|
|
EDA365欢迎您登录!
您需要 登录 才可以下载或查看,没有帐号?注册
x
[书籍]Digital Techniques for High-Speed Design+ x) K% R7 I0 x- q0 `+ d# P
. Y+ z2 Q A7 C! e9 L3 h% dDJvu格式,共67分卷,压缩文件里有DJvu浏览器.
6 U+ y: f) I# \1 b/ v1 ]$ {7 D6 ?" ?3 g u! d
目录
% Z9 i! o5 Q A o. h& c
/ Q1 z7 m x1 c8 @I. INTRODUCTION. ! X3 `* `4 V( x4 X
1. Trends in High-Speed Design.
, A% A Y+ k$ d# \2. ASICs, Backplane Configurations, and SerDes Technology.
) F3 J7 z/ E* {. P6 K' a3. A Few Basics on Signal Integrity.
. q) n; }+ B! X. R& a% E4 @ o" d( [% P& X# \0 a
II. SIGNALING TECHNOLOGIES AND DEVICES. 6 V& N9 G0 Z/ o3 |! x* T& v
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
& Y9 p$ @# B0 s6 N) h5. Low Voltage Differential Signaling (LVDS). . `4 l* G0 q2 `
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
5 F# R% W+ G- V/ F& C. Y g' k7 m7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
- M# d3 [/ d( Y: T6 A/ q8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
2 l3 @' [/ G0 l9. Current-Mode Logic (CML).
9 {3 O" F4 _3 e- c$ d- g" o10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. ' A. G' o" b* N( o# v
11. Fiber-Optic Components.
8 H/ k" p: ?; e$ f* D8 Y4 f12. High-Speed Interconnects and Cabling.
& Q5 x3 O v* V* }9 P# D
- b' d) W- b; g/ r( S# e7 xIII. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
|. R! ]$ h! d* }" ~1 f13. Memory Device Overview and Memory Signaling Technologies.
+ L& e) _8 u* \+ x14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. 0 }: v, _+ }% s; \3 z3 L" D9 e
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
( `3 I7 ]: B" }0 W1 D16. Quad Data Rate (QDR, QDRII) SRAM. & \8 v S+ X! _
17. Direct Rambus DRAM (DRDRAM).
: X# Q) k# v" _( P+ {6 I* } l18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR. ' L7 h4 O( ]# \! z s9 I
/ U+ v$ T( {& J: A+ N9 j/ f
IV. MODELING, SIMULATION, AND EDA TOOLS. ) d& m" ?; K2 M+ w
19. Differential and Mixed-Mode S?Parameters. ! S/ K, M4 j {8 u6 y& l. B8 e
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
. C/ `4 N& l2 G4 b2 N' E/ v0 m" I21. Modeling with IBIS. 9 e( ~, U. |$ e, y- O+ [
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
8 V) A9 |1 r8 M1 K3 E; m* w' ^! O1 u$ e! b. q- a9 Y" A
V. DESIGN conceptS AND EXAMPLES. 7 @$ r7 S% `! J
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. ; }2 x5 r; R G8 g! u3 D: ^& b/ ?
# N! h, e3 X& _3 n
Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. 0 D; j- g& K4 M8 p
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers. + s C; l! j7 j; D/ j
25. Designing with LVDS. ( i0 ~4 U$ ~+ _1 {1 S2 E2 a
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
/ u) F. r; d' n3 P% r27. WarpLink SerDes System Design Example. . p2 Z4 M: c/ y% {( P+ S
. B' G) J$ n% o+ C
VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
5 l4 E7 h, {7 F4 _28. Electrical Optical Circuit Board (EOCB).
9 b% ^1 _7 U1 X29. RapidIO.
! d' e& N* w0 c1 G6 C1 t30. PCI Express and ExpressCard. & h5 k" ]3 Q* K* a; c; }: x
& j8 |8 h" H1 L* p y( h( z& ]# q8 eVII. LAB AND TEST INSTRUMENTATION.
# N& _* H2 B" O0 F: |) u2 ~" L31. Electrical and Optical Test Equipment.
: k; k* i% x/ L6 i/ V/ W2 ?, ]$ A: T' i! Y2 D% J3 [3 Q
- N2 A7 P0 h6 n/ }# K! M2 f5 n1 z
. s8 s6 _5 M( l7 F6 {% _[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
评分
-
查看全部评分
|