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［书籍］Digital Techniques for High-Speed Design
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DJvu格式,共67分卷,压缩文件里有DJvu浏览器.
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目录
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/ @$ K q a( S; \8 k& YI. INTRODUCTION. v2 ]3 k6 o9 S1 ^
1. Trends in High-Speed Design.
* K( u/ ~0 r! L* X; u% G+ [5 i2. ASICs, Backplane Configurations, and SerDes Technology. 4 W+ F4 _, U; X: P3 n
3. A Few Basics on Signal Integrity.
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II. SIGNALING TECHNOLOGIES AND DEVICES. 1 ]3 [8 M$ ~2 h- l8 P
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
( ]: J" M6 C+ D% R5. Low Voltage Differential Signaling (LVDS). ' O# O3 H+ q/ D
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
# b F, F( \" j: t% \/ a7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL). " N3 ]+ E' e* n- x z
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm). : t0 F4 @: _5 F% P% a/ L
9. Current-Mode Logic (CML). 3 B9 s. T; m* s# g y, x7 S! a: |
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.
! T+ Y" h1 A* r2 C; D( J' @11. Fiber-Optic Components. 2 n8 p! |8 Y8 z- b: q' J4 \
12. High-Speed Interconnects and Cabling. 8 }3 n+ [+ N# x& i
" j6 R; D% G, \III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
0 j+ k( a/ {4 A! K13. Memory Device Overview and Memory Signaling Technologies. $ Z. Y1 n5 E* \1 e# ^
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. 0 |. q# M( p: t
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM. " a5 P6 W3 o, e5 O) p
16. Quad Data Rate (QDR, QDRII) SRAM. & {1 n8 b4 i' {5 |5 W5 M6 \ H' N
17. Direct Rambus DRAM (DRDRAM). 6 h* _6 ?$ R9 l% L! F7 z
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR. 2 Z. l/ B7 Q( a, I u+ _; n" U
& ~" K A0 o5 rIV. MODELING, SIMULATION, AND EDA TOOLS. X5 r+ Y% {- A3 a% D
19. Differential and Mixed-Mode S?Parameters. $ _1 z2 ^3 @: v( W: B# Y+ g
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. # i1 Y5 s$ Q; k
21. Modeling with IBIS.
5 y. X% E- h( m22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout. 8 K0 X" H3 |, g* }
. m/ t' ]2 M0 zV. DESIGN conceptS AND EXAMPLES. + z8 p# I* @0 y
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. 0 U$ n) _- z7 M9 k
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Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. . s) Q8 R; b2 I- L7 [1 q
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
, ~7 f4 c" U( Q25. Designing with LVDS. 4 k' Q# ^9 I( A8 k: L/ U
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
1 Z6 |9 }* Z! F# }3 m% E27. WarpLink SerDes System Design Example. & K7 \; y, v) d' |# x0 i; l/ O; ~
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VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
5 H3 Y8 i! u* F- l1 ?" v4 g% K28. Electrical Optical Circuit Board (EOCB). % V1 U9 k! V- N6 z! h
29. RapidIO. 2 H& A* L3 H- L5 L$ a
30. PCI Express and ExpressCard.
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# i' m6 z" Y+ j5 x( i9 lVII. LAB AND TEST INSTRUMENTATION.
2 x/ w: {: _" i7 ^5 c7 U31. Electrical and Optical Test Equipment.
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% \. |) ^3 j t) ~: @9 z[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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