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[书籍]Digital Techniques for High-Speed Design
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& g1 T3 I. p# O. h# B; h) S3 s目录
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I. INTRODUCTION.
' r. |. t0 {! L; h1. Trends in High-Speed Design. c% l# ?2 s8 \
2. ASICs, Backplane Configurations, and SerDes Technology. 4 e ]6 ]) r7 Q& X8 z
3. A Few Basics on Signal Integrity.
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; k, J4 x `( j# III. SIGNALING TECHNOLOGIES AND DEVICES. 3 m2 g9 ]1 N+ ]$ r+ @
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
7 e7 E% v' O1 s2 t" |5. Low Voltage Differential Signaling (LVDS).
$ y. \$ _! w H3 g6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
( ^/ k; D3 Q8 ^% q; Z1 ?/ q7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
4 h" F6 ?' q! d" {6 Q8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm). 9 e. `! \" p! Q" U) J
9. Current-Mode Logic (CML).
8 i* d8 s: g& M i( K2 G10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. " u7 V8 W9 d& C' j% L- E
11. Fiber-Optic Components. # [7 v, A2 E; S) w4 H) o& b5 N
12. High-Speed Interconnects and Cabling. 7 h6 p/ N0 @% W6 j9 F; Q
: p. K7 N8 E& @1 o+ F, d# MIII. HIGH-SPEED MEMORY AND MEMORY INTERFACES. 5 `2 B$ M& a3 T( w# W" F
13. Memory Device Overview and Memory Signaling Technologies.
2 u; x* K: [! }" W; |14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. ' k6 E; g' ]+ k* z5 z$ i( y# j
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
( s' z3 s4 t" ~7 b8 N16. Quad Data Rate (QDR, QDRII) SRAM. % U1 i) [/ q" L8 w7 u' Y
17. Direct Rambus DRAM (DRDRAM). ; V5 N- @2 j% f5 h) }) H
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
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IV. MODELING, SIMULATION, AND EDA TOOLS. + u6 p+ R- n9 G7 Z6 E" e
19. Differential and Mixed-Mode S?Parameters.
9 a$ e- ]2 j9 {* G$ f0 `20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
2 }% J5 V- o+ _+ l! e21. Modeling with IBIS.
2 ]$ L x& r+ ]+ C M22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
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" z- Z" _; k0 K" r( BV. DESIGN conceptS AND EXAMPLES.
9 i; i9 r! E7 k. \7 u) l23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. $ ]0 D" c1 |' H) ` @+ ]
5 b5 ~5 d' k0 b9 Y) ^ YAppendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. 0 s( D& u& a0 F$ Y8 q3 i- I) l
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers. : C! y8 R+ k" q: I* D! g. J" X: _" u
25. Designing with LVDS.
- T: T2 c# y. A" X, H26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers. ) w3 M! Y, f! V: h/ i: `! D
27. WarpLink SerDes System Design Example. 2 j* i: {. {) {: Q6 n, N J6 x
: J0 C: W9 {. d( \: @VI. EMERGING PROTOCOLS AND TECHNOLOGIES. 1 q+ s$ x8 p/ Z; [ A6 V7 a6 H8 X$ D
28. Electrical Optical Circuit Board (EOCB). 7 V1 u6 v# q6 I
29. RapidIO.
( j2 n. l( |! k' G2 }2 N1 B( y* ^! I30. PCI Express and ExpressCard.
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VII. LAB AND TEST INSTRUMENTATION. ( }$ G2 r. `2 m
31. Electrical and Optical Test Equipment.
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3 s, O' `( w: N) Q8 `[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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