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非常好的资料，前一阵子贴在个人主页上，忘发论坛上来了。
8 T7 }# b5 o5 \4 Q3 b【目录】：; P+ @- e( z& R" f
第一章 高速数字电路概述..........................................................................5
; N% a. T8 d3 x0 l! Y第二章 传输线理论...............................................................................12
$ q' n5 ^5 H+ w1 r$ _第三章 串扰的分析...............................................................................42
3 X6 W' _- f- x$ ?/ p# H& o* m第四章 EMI 抑制................................................................................60
$ y$ s8 f1 P# ]' W/ h& y第五章 电源完整性理论基础......................................................................82
2 B1 `" @$ \0 y+ M) Y" @- Q. O% o第六章 系统时序................................................................................100
- o/ c: ?- A; c6 j第七章 IBIS 模型...............................................................................113
# K0 x1 {; f( f" c第八章 高速设计理论在实际中的运用.............................................................1226 a, |" K ~2 x
第二部分：DRAM 内存模块的设计技术..............................................................143# w3 M7 X8 E2 j- P9 M
第一章 SDR 和DDR 内存的比较..........................................................................143
5 g* p; h# u. U& v" O第二章 内存模块的叠层设计.............................................................................145
3 ~3 Y% L8 `# z* o第三章 内存模块的时序要求.............................................................................149: S" _; R3 D% q6 ]" `2 z# t0 E
3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149
4 a- l0 r3 E# z5 k: R7 B4 ^3.2 带寄存器（Registered）的内存模块时序分析...................................154+ T9 O9 _2 R6 `+ Q
第四章 内存模块信号设计.................................................................................159
9 V7 l1 p1 h% U* O% X" W* V4.1 时钟信号的设计.......................................................................................159+ ]& I9 [9 G4 g* O c8 F0 D1 d& }8 q
4.2 CS 及CKE 信号的设计..............................................................................1628 G7 q6 L$ U# N3 n5 y: K
4.3 地址和控制线的设计...............................................................................163
$ ?/ j7 a0 y M7 P& a) v4.4 数据信号线的设计...................................................................................1669 E# ?# [( Y$ S+ w2 ~
4.5 电源，参考电压Vref 及去耦电容.........................................................169- ]- x8 e# R1 Q: a( Z5 A* z
第五章 内存模块的功耗计算.............................................................................172
$ p( d- s8 h/ g, S第六章 实际设计案例分析.................................................................................178: Y, J* _0 a- H4 B4 D
第三部分 SPECCTRAQUEST 仿真指南...........................................................188# G7 Z9 z9 @7 |% M) d: s
第一章 cadence SPECCTRAQUEST 的简介...............................................................188
5 K0 I1 T$ ` M9 i1 l1.1 SPECCTRAQuest SI Expert.....................................................................189
3 ^5 o/ d* _6 D8 N1.2 SPECCTRAQuest Power Integrity.........................................................189
_" K* E- L" T" R! r1 L. @8 o1.3 SPECCTRAQuest for IC Packaging.......................................................1893 @, X: C4 Q. j! _ x7 d& j# w0 c8 p8 h
1.4 SPECCTRAQuest Signal Explorer.........................................................189 E2 V' y& I9 N8 a2 i) o- y
第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190. @ {" g$ ?5 F Z
2.1 仿真前的准备工作...................................................................................190
5 L! J: [! L& i2 y2.1.1 获取元件的IBIS 模型.....................................................................190' @3 u, J1 E' I- Q! I% c
2.1.2 转换IBIS 文件格式及调入模型.....................................................190# X3 A6 e% {- |: o* K
2.1.3 给元件加载对应的模型...................................................................192
0 U& d- C1 e7 @* ^6 ?5 Y0 p$ [2.1.4 定义电源电压...................................................................................194
) k+ x+ T2 Q; D1 W# G2.1.5 PCB 叠层设置....................................................................................195
8 g0 p; R; t; C1 @2.1.6 仿真参数的确定...............................................................................196
1 Y) f4 {% M- f, |8 |1 g6 j- o, |2.2 设计后仿真的过程...................................................................................1973 f# w& n& _) l# C* K
2.2.1 确定准备工作已经做好...................................................................198! J9 v4 i& U6 x t6 s# z2 |/ m( u
2.2.2 选择信号线.......................................................................................198
( @! \: K% j S9 W) f2.2.3 提取电路拓扑结构...........................................................................199
( t( `' p2 [- {: E- i# g7 \" O6 h2.2.4 选择不同的驱动激励和元件参数进行仿真...................................200
1 ?7 X+ M5 h: c9 o2.2.5 仿真结果的分析...............................................................................201" x1 ]9 v5 c: {3 ]5 x; F
2.2.6 SigWave 的使用................................................................................202& q9 n8 Q5 B) _5 z
2.2.7 后仿真的收尾工作...........................................................................2038 \* J* ^7 Q ]
2.2.8 一些补充...........................................................................................203
( F; P& J* M A- _# v2.3 设计前仿真的过程...................................................................................204 h3 w8 w. A% a+ w- L+ z
2.3.1 布局前的前仿真...............................................................................204
" T1 d# C0 @+ v+ I! a$ ~2.3.2 布局后的前仿真.................................................................................207
, F( X9 F* A. H. q$ w8 S/ {第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................209
! c, j Q$ B6 ]0 T' j. V4 e; ]: z1 c3.1 高速系统级设计和分析...........................................................................209" }/ S: l/ J9 O% f- N
3.2 高速设计的问题.......................................................................................209; s9 p8 A1 V# O/ Y# b. b
3.3 SPECCTRAQuest SI Expert 的组件.......................................................210( g& y: n7 B# D7 Q2 f) y0 i: a
3.3.1 SPECCTRAQuest Model Integrity .................................................210
2 d; ^! Y) [0 O. {& _3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
' _' L2 z5 h, T, \3.3.3 Constraint Manager .......................................................................216" ~& o0 k/ j* s7 S8 B
3.3.4 SigXplorer Expert Topology Development Environment .......223. t. |% Z5 \' S% B: u$ p9 |3 L8 h
3.3.5 SigNoise 仿真子系统......................................................................225
5 c& t; s2 E: u: F$ T M3.3.6 EMControl .........................................................................................230
$ J/ E' u7 G. f6 y8 s6 h, h X: o3.3.7 SPECCTRA Expert 自动布线器.......................................................230
; X+ x: e% _( _0 ?/ I3.4 高速设计的大致流程...............................................................................2307 \9 S4 v: s+ v
3.4.1 拓扑结构的探索...............................................................................231$ B8 ^7 M$ C1 G
3.4.2 空间解决方案的探索.......................................................................231
% e0 q& w! E! `/ v9 P3.4.3 使用拓扑模板驱动设计...................................................................231
* H9 w+ ?. n3 x1 {( e" M. e7 k3.4.4 时序驱动布局...................................................................................232
; O- A6 H4 i3 i* F& i7 \( W$ A3.4.5 以约束条件驱动设计.......................................................................232, p3 m5 h; a1 k& V5 G
3.4.6 设计后分析.......................................................................................233
& m, ^8 H" ^: y) R2 i$ T第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2342 A* [5 E _2 f6 s! k7 l
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234/ I' C2 E" P, V9 z! b7 c
4.2 图形化的拓扑结构探索...........................................................................234# \0 |+ ^0 G! I, W
4.3 全面的信号完整性(Signal Integrity)分析.......................................2344 H2 [ \+ q0 F, f1 c
4.4 完全兼容 IBIS 模型...............................................................................234& J3 C' ^ Y1 ?/ w5 F5 J
4.5 PCB 设计前和设计的拓扑结构提取.......................................................235
! I6 h) C8 `# {; @# m4.6 仿真设置顾问...........................................................................................235
6 v$ l, y4 f _, Q; X4.7 改变设计的管理.......................................................................................235; k w0 N9 a1 E5 @1 f" j1 F! w+ h$ B
4.8 关键技术特点...........................................................................................236
: ? m% {' s1 K5 v4.8.1 拓扑结构探索...................................................................................236
8 J$ e2 }# a! Z y1 Y. y Z4.8.2 SigWave 波形显示器........................................................................236: K- N1 i* ]. i4 T5 c
4.8.3 集成化的在线分析(Integration and In-process Analysis) .236
& C S* {( N/ L* H2 t: ?: e第五章 部分特殊的运用...............................................................................237
+ ~. R( I( M" e5 [* t/ c$ {5.1 Script 指令的使用..................................................................................237
# D7 x4 V+ w2 G! r0 l5.2 差分信号的仿真.......................................................................................243
; M* p3 g0 x0 q; T4 P# @( e" K" J5.3 眼图模式的使用.......................................................................................249
, E% s" y. z$ f! H% ]9 \ P7 W第四部分：HYPERLYNX 仿真工具使用指南............................................................251) y& P ?/ W% p& p" a, Q
第一章 使用LINESIM 进行前仿真.......................................................................251
5 @; I# K3 u' [0 e. ^1.1 用LineSim 进行仿真工作的基本方法...................................................251+ [& p H! E# A& y4 x# M
1.2 处理信号完整性原理图的具体问题.......................................................259
+ {; i! [) B' D) I1.3 在LineSim 中如何对传输线进行设置...................................................260! E7 T0 C. m* @$ E/ Y3 |2 [) w
1.4 在LineSim 中模拟IC 元件.....................................................................2632 n5 H7 v7 ~0 U0 b
1.5 在LineSim 中进行串扰仿真...................................................................268
# v0 Y0 r2 Y, G# I+ ]+ S第二章 使用BOARDSIM 进行后仿真......................................................................273
P- f7 N1 l1 a" ?, M& B2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273- v8 E* _5 V$ w) B
2.2 BoardSim 的进一步介绍..........................................................................292
9 z2 Y8 j$ f8 F8 }. s9 i5 y2.3 BoardSim 中的串扰仿真..........................................................................309% o+ D/ B% Z, @9 F# V" k
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发表于 2007-12-20 12:27
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发表于 2007-12-20 20:20
好东西怎么没人顶！！！' F" ~9 ?- L) N" U