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非常好的资料，前一阵子贴在个人主页上，忘发论坛上来了。0 I8 x9 Y( d5 V" r3 H3 y; C
【目录】：
% P. k$ u3 M6 O' t第一章 高速数字电路概述..........................................................................5
, w% y; ?, H& R' L d: i ~1 \第二章 传输线理论...............................................................................12
: c9 M/ v- D/ {7 u2 G1 d第三章 串扰的分析...............................................................................42! \2 y2 |* u. u/ s3 k
第四章 EMI 抑制................................................................................60
+ m. W0 {4 Q5 t/ [第五章 电源完整性理论基础......................................................................82
( k I: P+ O6 l/ B第六章 系统时序................................................................................100
# R; B% \/ ?) B! ^第七章 IBIS 模型...............................................................................113% x0 R2 ]5 R) a7 `) L- C
第八章 高速设计理论在实际中的运用.............................................................122
6 O2 u( V. f' L9 m; q第二部分：DRAM 内存模块的设计技术..............................................................1431 v4 s- I6 r+ j2 @) A
第一章 SDR 和DDR 内存的比较..........................................................................1436 n7 |0 `) j' I' X6 G |
第二章 内存模块的叠层设计.............................................................................145
$ c7 C* q7 B4 G' E+ E3 K第三章 内存模块的时序要求.............................................................................1493 b% Y# J- _# Y/ W# q
3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149( K0 N3 v; ^0 G g3 W6 [$ j
3.2 带寄存器（Registered）的内存模块时序分析...................................154
% T, g l, J8 b! h第四章 内存模块信号设计.................................................................................159) f2 X3 q6 i+ l0 g
4.1 时钟信号的设计.......................................................................................159* n) v2 K) |5 w) q. I. z# K5 R
4.2 CS 及CKE 信号的设计..............................................................................162
- _: ~$ ]6 `/ y2 ~4.3 地址和控制线的设计...............................................................................163- x A$ C- Z! Q) @& \- ^
4.4 数据信号线的设计...................................................................................166
7 E) P& f# U L% E4.5 电源，参考电压Vref 及去耦电容.........................................................1692 O: d7 o# r* }( f a9 f, e# P
第五章 内存模块的功耗计算.............................................................................172
! T3 H: ~, d- ]1 o3 _" X第六章 实际设计案例分析.................................................................................178) G) Y7 x3 _" h" O
第三部分 SPECCTRAQUEST 仿真指南...........................................................188% ^1 E$ B# V4 ?. N5 ~8 _6 I4 y# ~
第一章 cadence SPECCTRAQUEST 的简介...............................................................1887 _# S+ Q. o; T: }! Z n
1.1 SPECCTRAQuest SI Expert.....................................................................189# s. m L, E$ [8 q& {
1.2 SPECCTRAQuest Power Integrity.........................................................189
" @" S3 i# G$ `8 }1 i1.3 SPECCTRAQuest for IC Packaging.......................................................189
/ I z% s& x8 P! b$ |2 M1.4 SPECCTRAQuest Signal Explorer.........................................................189! G% Y6 _$ }/ i: @0 m2 I% J; f
第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190
. O+ T: ?' Z$ G- ?! T* ~2.1 仿真前的准备工作...................................................................................190
1 O, d9 ?; w4 C- {, R2.1.1 获取元件的IBIS 模型.....................................................................190' j6 \7 e5 l+ D
2.1.2 转换IBIS 文件格式及调入模型.....................................................190
% x, k! p/ M, {6 r2.1.3 给元件加载对应的模型...................................................................192
7 M) [) h9 { L/ p4 L, Z4 o6 b% g2.1.4 定义电源电压...................................................................................194
" C3 K: I4 O- W. g0 i2.1.5 PCB 叠层设置....................................................................................1953 T' D, J, A# }4 q6 R* R* v
2.1.6 仿真参数的确定...............................................................................196* E2 G. Y/ M4 f9 b- e
2.2 设计后仿真的过程...................................................................................197
+ J5 ?( \7 g6 B7 R* U2.2.1 确定准备工作已经做好...................................................................198
; V( N8 _ y0 l! \& m, k, H( ]2.2.2 选择信号线.......................................................................................1983 g- M0 I- p1 `% R& t4 N1 S) r
2.2.3 提取电路拓扑结构...........................................................................1996 d7 o7 B7 H/ Z$ E& c9 N8 `2 h
2.2.4 选择不同的驱动激励和元件参数进行仿真...................................200
1 W$ D9 K$ ?$ `/ n0 N$ _2.2.5 仿真结果的分析...............................................................................201
0 F0 q) W3 b% h$ `( Y/ R, z2.2.6 SigWave 的使用................................................................................2024 k* s+ g4 |4 z
2.2.7 后仿真的收尾工作...........................................................................203
+ E1 L9 N8 h {4 ]2.2.8 一些补充...........................................................................................203
" L+ M% C/ @6 P9 t. m2.3 设计前仿真的过程...................................................................................2046 m( |; A4 t5 }% D0 q
2.3.1 布局前的前仿真...............................................................................204) L" j- d5 Q# j& b$ i) e
2.3.2 布局后的前仿真.................................................................................207
( ^' M3 t( E; P第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................209; u, B1 a, }. C- M
3.1 高速系统级设计和分析...........................................................................2092 H' P# t/ j2 B0 M( v
3.2 高速设计的问题.......................................................................................209
/ a% B# Y# c2 k2 ~- _8 o' N+ C3.3 SPECCTRAQuest SI Expert 的组件.......................................................210
. n. `$ w+ D4 C3.3.1 SPECCTRAQuest Model Integrity .................................................2104 l6 O S. N% ]# j# x
3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
8 Q& j4 h; A- ^' s3.3.3 Constraint Manager .......................................................................2169 W4 K7 ~( f& U" E6 M6 m+ h! w
3.3.4 SigXplorer Expert Topology Development Environment .......2238 F! H. O# ]; ~6 M
3.3.5 SigNoise 仿真子系统......................................................................225/ O& E/ c+ {1 O2 k! b
3.3.6 EMControl .........................................................................................230
* U' q- \! j5 c* B' J( ~3.3.7 SPECCTRA Expert 自动布线器.......................................................230& g( y/ f6 c+ c9 o; `6 v
3.4 高速设计的大致流程...............................................................................230" `. D# f& W2 }0 i
3.4.1 拓扑结构的探索...............................................................................231
( k2 S* p E3 Z3 a/ |3.4.2 空间解决方案的探索.......................................................................231# k# ~, Z9 N+ ~) E
3.4.3 使用拓扑模板驱动设计...................................................................231+ X( Y/ b( @; M, p
3.4.4 时序驱动布局...................................................................................232
! V" b3 v9 x) d' {+ i3.4.5 以约束条件驱动设计.......................................................................2328 k+ C7 \# U4 q7 D! O
3.4.6 设计后分析.......................................................................................233
7 d. h* j5 N3 `; j: V+ a' V第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2342 ]$ F: q3 h$ k( F
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234; I, G5 `" K1 r& m! E+ O
4.2 图形化的拓扑结构探索...........................................................................234
, L% W' J* I, n2 Y4.3 全面的信号完整性(Signal Integrity)分析.......................................234
, `4 ?1 t7 |/ C5 X- T4.4 完全兼容 IBIS 模型...............................................................................234
% r/ f0 i6 N/ _4 P- K$ t+ t) u4.5 PCB 设计前和设计的拓扑结构提取.......................................................235
6 o' c3 f2 x# _- {! \- N N4.6 仿真设置顾问...........................................................................................2352 N8 B6 Z* U( M- F4 z
4.7 改变设计的管理.......................................................................................235+ P' g# v- e0 L3 s
4.8 关键技术特点...........................................................................................236
3 Y* J" a1 ?+ j2 r6 \4.8.1 拓扑结构探索...................................................................................236
, V8 d) ^; @ Y- R6 M4.8.2 SigWave 波形显示器........................................................................236
: v4 H% a! l, y1 Q7 G8 a# E( C4.8.3 集成化的在线分析(Integration and In-process Analysis) .236
( t2 i/ ?5 f8 f2 ~第五章 部分特殊的运用...............................................................................2379 B: Y1 M( l6 V0 I) H# j
5.1 Script 指令的使用..................................................................................237
7 R& V: u. B D+ N5.2 差分信号的仿真.......................................................................................243! v, \9 p6 Y9 f d7 i
5.3 眼图模式的使用.......................................................................................249
H) P2 i0 D* N D& S1 R5 [/ g第四部分：HYPERLYNX 仿真工具使用指南............................................................2516 i. N8 }1 G* ?
第一章 使用LINESIM 进行前仿真.......................................................................251
) T7 B, M2 X# L3 O- R b' p. U. c1.1 用LineSim 进行仿真工作的基本方法...................................................251* }# O: _0 d1 g1 U
1.2 处理信号完整性原理图的具体问题.......................................................259% F8 e2 u0 y8 Z" p) F
1.3 在LineSim 中如何对传输线进行设置...................................................260
6 M% V, S8 t1 S6 t- V5 @. L1.4 在LineSim 中模拟IC 元件.....................................................................263% G3 F' ]4 v/ H, C0 e3 G9 ^ `
1.5 在LineSim 中进行串扰仿真...................................................................268% |: R& o6 j6 f3 t
第二章 使用BOARDSIM 进行后仿真......................................................................273
/ a c- h0 F3 {& y- a2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273
3 B8 H% C1 \9 U4 I( J4 z- W2.2 BoardSim 的进一步介绍..........................................................................292
: L- w) ?6 s/ ]9 }, U- }2.3 BoardSim 中的串扰仿真..........................................................................3095 O+ ?( {* _( O* t+ X- t
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发表于 2007-12-20 12:27
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发表于 2007-12-20 20:20
好东西怎么没人顶！！！$ \4 b! ~# o* d& L2 K