TA的每日心情 | 开心
2019-12-3 15:20 |
|---|
签到天数: 3 天 [LV.2]偶尔看看I
|
EDA365欢迎您登录！
您需要 登录 才可以下载或查看，没有帐号？注册
x
非常好的资料，前一阵子贴在个人主页上，忘发论坛上来了。0 T8 l: O% u* f1 C2 `# m6 ^* m( v9 f& `
【目录】：
1 Z) c; {! y5 R; i+ z1 ~" u第一章 高速数字电路概述..........................................................................5
5 Q. B I% y5 ~' w, L第二章 传输线理论...............................................................................123 R, v# F7 u8 ^! E8 w4 i5 ?1 w8 d
第三章 串扰的分析...............................................................................425 J2 v9 Y5 X! Q, }& R% } a
第四章 EMI 抑制................................................................................60
1 Y+ e! [, _7 m第五章 电源完整性理论基础......................................................................82, r# W5 T9 z7 N" @
第六章 系统时序................................................................................1001 R7 E% m" \) u+ x- z* w8 B
第七章 IBIS 模型...............................................................................113
: V( u! |$ g/ [( S第八章 高速设计理论在实际中的运用.............................................................122
; p" d0 |5 }3 w ?第二部分：DRAM 内存模块的设计技术..............................................................143
. f) l! X' X8 @( B% M! @4 q8 D( o: u第一章 SDR 和DDR 内存的比较..........................................................................143
) t- F0 r3 S* _$ y; L第二章 内存模块的叠层设计.............................................................................145
- r, n" _& }: Y1 n, i第三章 内存模块的时序要求.............................................................................149
$ G+ P8 A& ]/ y" i- m3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149
1 Q% H0 x7 ]! Z* m7 `- I3.2 带寄存器（Registered）的内存模块时序分析...................................1541 F o: B/ p0 O( Q9 F& J1 r
第四章 内存模块信号设计.................................................................................159
$ V' @% w9 Y7 g+ \; R4.1 时钟信号的设计.......................................................................................159
2 K- y! N4 V6 F$ z! q, w i: T c" |4.2 CS 及CKE 信号的设计..............................................................................162' |9 K& b) h) H( M* w. y1 O. k3 [
4.3 地址和控制线的设计...............................................................................163
" w- m2 P7 t/ M7 p8 e4.4 数据信号线的设计...................................................................................166# D& F& n5 l% [& k' K: }/ H
4.5 电源，参考电压Vref 及去耦电容.........................................................169
' ^/ c$ e1 X) G# `; X/ u3 _ D7 m4 ]第五章 内存模块的功耗计算.............................................................................1720 S" l5 f L# a2 K
第六章 实际设计案例分析.................................................................................178
# G' W7 }" h* t4 a. f第三部分 SPECCTRAQUEST 仿真指南...........................................................188
; i& {& R4 p0 M: m' W) q第一章 cadence SPECCTRAQUEST 的简介...............................................................1883 f# B; V" p# F" K
1.1 SPECCTRAQuest SI Expert.....................................................................189
% d* r) ?5 y* l. ~8 l1.2 SPECCTRAQuest Power Integrity.........................................................1898 e! {" N: S ~# s5 Q6 ]
1.3 SPECCTRAQuest for IC Packaging.......................................................189
( F, M, u/ R3 I8 X7 ]1.4 SPECCTRAQuest Signal Explorer.........................................................1898 o3 l5 k0 d+ n6 j% p
第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190' T1 B' `& ]" V9 F* K
2.1 仿真前的准备工作...................................................................................190. I- {$ X3 W9 [- Z
2.1.1 获取元件的IBIS 模型.....................................................................190
0 ]3 ~! G% |- E. ?8 g g2.1.2 转换IBIS 文件格式及调入模型.....................................................190
% O, m6 J' \5 E3 ?2.1.3 给元件加载对应的模型...................................................................192
" h6 j2 A" d4 `2.1.4 定义电源电压...................................................................................194
8 V$ h3 @, c( A; q3 t% A2.1.5 PCB 叠层设置....................................................................................195
* w7 a3 d5 O! P( c, X7 N# ~, v, e4 H2.1.6 仿真参数的确定...............................................................................1966 Z& ]; J4 t. V7 P! H" O* `3 ^* X
2.2 设计后仿真的过程...................................................................................197
: F* h( U3 c o0 H4 G: Q L1 F+ H2.2.1 确定准备工作已经做好...................................................................198
6 a( G }( z" v5 x2.2.2 选择信号线.......................................................................................198
$ x, _3 B1 I/ ?* R5 n2 `2.2.3 提取电路拓扑结构...........................................................................1993 F) n: a8 D) y8 q% K
2.2.4 选择不同的驱动激励和元件参数进行仿真...................................200
- u# C% e o* } }+ v8 S8 w: U2.2.5 仿真结果的分析...............................................................................201
2 b! h; ^3 `4 o- H# E( I* U2.2.6 SigWave 的使用................................................................................202
( |) d: F8 I: N" @) P( `4 w2.2.7 后仿真的收尾工作...........................................................................203
9 f: s+ O+ @- B2.2.8 一些补充...........................................................................................203
5 v% `. g2 k( t3 A1 h2.3 设计前仿真的过程...................................................................................2042 W3 y; m0 \5 u
2.3.1 布局前的前仿真...............................................................................204: ?& ? Q0 T. E. e9 g5 K
2.3.2 布局后的前仿真.................................................................................207
1 t- _, M5 N* a" ?0 P$ J; ?- M! Z第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................209' X' d- ^6 t. |! ?- E7 u
3.1 高速系统级设计和分析...........................................................................209, O& ]3 X( I3 w- N. }3 W$ h
3.2 高速设计的问题.......................................................................................2097 U7 u) P+ I0 v$ Y
3.3 SPECCTRAQuest SI Expert 的组件.......................................................210
) c7 Q1 K1 W& _9 }3.3.1 SPECCTRAQuest Model Integrity .................................................2103 `5 K8 A6 y/ o+ }: `% x4 e8 H
3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
/ V$ K j& B& Q" D3.3.3 Constraint Manager .......................................................................216
h7 n( s. p5 C, {8 m3.3.4 SigXplorer Expert Topology Development Environment .......223
2 i4 B" l. q* x7 L' P6 E4 _3.3.5 SigNoise 仿真子系统......................................................................225
5 l& b2 e( G2 o" I3.3.6 EMControl .........................................................................................230( j) M$ I6 F0 T3 i$ ?1 n
3.3.7 SPECCTRA Expert 自动布线器.......................................................230
) V6 d8 H3 O9 {* o3.4 高速设计的大致流程...............................................................................2301 P/ G/ _, G s) ^. R
3.4.1 拓扑结构的探索...............................................................................231# N: E; A8 ~1 n. B4 S
3.4.2 空间解决方案的探索.......................................................................231) C. O: T3 X" J* Y7 V
3.4.3 使用拓扑模板驱动设计...................................................................2318 K# G3 s. D- W# _) N: M' k/ s" L6 _
3.4.4 时序驱动布局...................................................................................232
( j& W* L; C- F5 O& u3.4.5 以约束条件驱动设计.......................................................................232
2 d5 u; M1 t, W a6 |$ \3.4.6 设计后分析.......................................................................................233' ^% E P: X1 `) _ R+ Q
第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2342 X( c& k i. E$ _# X
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234
: u( v c5 c2 M' D4.2 图形化的拓扑结构探索...........................................................................2340 g; W6 L' T* M
4.3 全面的信号完整性(Signal Integrity)分析.......................................234 `5 l( Z: f, I0 V. A) D
4.4 完全兼容 IBIS 模型...............................................................................234( V9 @7 i @+ x) C/ ^' t' s
4.5 PCB 设计前和设计的拓扑结构提取.......................................................235
G6 |* y D+ F' [. r; w4.6 仿真设置顾问...........................................................................................235
: O: q8 ~9 T, A+ W# ]4.7 改变设计的管理.......................................................................................2359 \7 x1 B$ y( _9 a! x
4.8 关键技术特点...........................................................................................2367 B6 X: e7 ]5 C b5 U- J4 J
4.8.1 拓扑结构探索...................................................................................2365 O4 \0 V+ g& {3 o: {+ j
4.8.2 SigWave 波形显示器........................................................................236
6 C+ h7 S( o7 V2 G4.8.3 集成化的在线分析(Integration and In-process Analysis) .236
}$ g/ y5 i/ W- t, {- W第五章 部分特殊的运用...............................................................................237
$ {" z! a+ Q) n! f2 o, p5.1 Script 指令的使用..................................................................................237: ?8 N& v2 @% B, s- A
5.2 差分信号的仿真.......................................................................................243
- z( j. y$ [; ]7 ~: U5.3 眼图模式的使用.......................................................................................2494 f2 o: }) e* G0 U
第四部分：HYPERLYNX 仿真工具使用指南............................................................251
- ]- X V' W9 a( q2 q第一章 使用LINESIM 进行前仿真.......................................................................2513 `: j" N7 g3 T& m" I" G
1.1 用LineSim 进行仿真工作的基本方法...................................................2518 m9 {; b- N! D) S1 H9 Q+ g
1.2 处理信号完整性原理图的具体问题.......................................................259" B1 V& ?5 j# Y7 G/ C! v4 w/ c9 e' z
1.3 在LineSim 中如何对传输线进行设置...................................................260
1 y# ?, U8 e' a" Y* E5 i1.4 在LineSim 中模拟IC 元件.....................................................................2632 C/ u$ s. x/ I8 T; n
1.5 在LineSim 中进行串扰仿真...................................................................268
9 }( T5 e5 K. S* V$ o第二章 使用BOARDSIM 进行后仿真......................................................................273( n: O- c8 U9 ], U
2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273
& ~" D* l8 j+ N( J8 X9 S2.2 BoardSim 的进一步介绍..........................................................................292
5 w+ S/ k$ Y% H+ O. J/ R2.3 BoardSim 中的串扰仿真..........................................................................309$ F; Q2 N9 \0 d5 c6 K8 R" _
1 u r! g+ N; B: G2 ^
' E _% `6 \' Q( @5 B6 ?- C) Z$ B
4 @& \4 w& D5 G# \6 q1 F0 O7 |& L1 F |
评分
-
查看全部评分
|
[复制链接]
/1 
发表于 2007-12-20 12:27
收藏
淘帖
支持！
反对！
发表于 2007-12-20 20:20
好东西怎么没人顶！！！