关于电容两个焊盘的处理疑问

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最新拿到一家IC厂家的推荐设计文件
- Z8 z' v% e, p' U发现里面的大封装电容的两个焊盘全部贴的很近，1206封装的电容，焊盘间距大概只有10mil左右。
The +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized.

这样处理的意义何在？
, n1 @% _3 ~1 d) l减小ESR吗？