最新拿到一家IC厂家的推荐设计文件; X! b+ m: r/ G
发现里面的大封装电容的两个焊盘全部贴的很近,1206封装的电容,焊盘间距大概只有10mil左右。 1 x% p& }/ d6 E( G' G" p9 E6 ^5 u" ZThe +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized. & r) [% w% d7 L" l+ _+ z7 x$ I. |, ~# c* S' }: r# I
这样处理的意义何在? 5 N6 @7 G y2 l: Y( ^减小ESR吗?