|
|
EDA365欢迎您登录！
您需要 登录 才可以下载或查看，没有帐号？注册
x
$ x. Y: t7 q8 X 1. 板：board
* q# m3 y- G+ _1 y 2. 印制板：printed board
2 J, J" e% t8 P. p" P4 b k6 ?( S 3. 印制电路：printed circuit. d: O6 C' z% `4 H9 r
4. 印制线路：printed wiring; E8 r, f% Y( H
5. 印制线路板：printed wiring board(PWB)
: \1 }+ v3 ^# t: v) e( P 6. 印制板电路：printed circuit board (PCB)
/ N( z3 x9 b4 _- n. J 7. 印制接点：printed contact2 T0 f7 z! y6 ^$ \
8. 印制组件：printed component; l+ v9 R) E I O- A) h
9. 印制板装配：printed board assembly8 q) l3 g/ | M- R! u
10. 单面印制板：single-sided printed board(SSB)
. v a1 H# V! K 11. 双面印制板：double-sided printed board(DSB)6 K( ~% C" k: h. T
12. 多层印制板：mulitlayer printed board(MLB) T6 {% U! e1 W
13. 多层印制电路板：mulitlayer printed circuit board% M8 G9 u$ V9 b* J& x' G
14. 多层印制线路板：mulitlayer prited wiring board8 e" {6 l# Z( j( G* e
15. 刚性印制板：rigid printed board
+ Z( A8 Q7 y8 q _) d 16. 刚性单面印制板：rigid single-sided printed borad
$ G4 E( e) k+ i$ y& s+ k 17. 刚性双面印制印制板装配：printed board assembly3 V- m$ H- D c. E
18. 刚性多层印制板：rigid multilayer printed board J3 C2 U# o: d+ c, z
19. 挠性多层印制板：flexible multilayer printed board# z4 r8 o8 q8 a' o) M4 A+ t1 V6 Z8 i
20. 挠性印制板：flexible printed board
( M1 q1 X/ D5 |: Y+ R 21. 挠性单面印制板：flexible single-sided printed board0 Z2 y/ q4 }6 D* Y5 U
22. 挠性双面印制板：flexible double-sided printed board7 j3 f0 \, P# i& J. d* B4 e
23. 挠性印制电路：flexible printed circuit (FPC)
; Q/ q$ Z4 I0 V5 x: ^: l 24. 挠性印制线路：flexible printed wiring
) z7 S, V4 i4 b a' ^& X 25. 刚性印制板：flex-rigid printed board, rigid-flex printed board: j- g/ p% q& j W) Q# ]
26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed8 r: T5 U; W% n& g0 C
27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board: _2 W6 K* a1 V I( L z
28. 齐平印制板：flush printed board
$ \: \$ M6 }5 t& N 29. 金属芯印制板：metal core printed board" q% [( A, F: T* e
30. 金属基印制板：metal base printed board3 @0 A7 D: `' n3 U, M& n( t, g
31. 多重布线印制板：mulit-wiring printed board
# r: y" H3 N* w$ E4 E 32. 陶瓷印制板：ceramic substrate printed board
/ P, V% Q) Q$ i# Y l7 v 33. 导电胶印制板：electroconductive paste printed board( E4 e8 p5 b& d- |7 l
34. 模塑电路板：molded circuit board
3 O: p) \3 M+ s, o 35. 模压印制板：stamped printed wiring board
2 k( K* z, i; Z; J' W4 \ 36. 顺序层压多层印制板：sequentially-laminated mulitlayer
& ?, N# C7 s9 C# l1 c7 B1 r 37. 散线印制板：discrete wiring board
, M9 ^4 l8 P9 v/ {+ [! S 38. 微线印制板：micro wire board
5 o5 K1 |2 e! {' c7 t& t& L$ t 39. 积层印制板：buile-up printed board
5 [2 C: ?, ~' H B7 L& P 40. 积层多层印制板：build-up mulitlayer printed board (BUM)4 h" y( m: b" x1 i- d
41. 积层挠印制板：build-up flexible printed board8 a6 e9 R* N7 a3 g
42. 表面层合电路板：suRFace laminar circuit (SLC)
7 x7 {1 f3 D: q: v* J! }9 t 43. 埋入凸块连印制板：B2it printed board
/ E1 K$ W( B4 a 44. 多层膜基板：multi-layered film substrate(MFS)
: v$ l7 C# p/ ?: n 45. 层间全内导通多层印制板：ALIVH multilayer printed board! f" l& n8 |. P( ]6 z# \# f% x
46. 载芯片板：chip on board (COB)4 X$ K" V2 u6 Q# d3 \! j8 e+ [
47. 埋电阻板：buried resistance board
P2 ]* |: N% e4 u6 I+ \ 48. 母板：mother board
/ U6 T' O% f* T5 Y( U) u/ R& c0 S5 O9 M 49. 子板：daughter board# L( V; @/ S6 G/ u) D
50. 背板：backplane3 _" k5 C* K6 @. m. ~9 |* a
51. 裸板：bare board
3 q5 m! I; W2 x 52. 键盘板夹心板：copper-invar-copper board! `% J4 ?/ m# T* `) T2 J
53. 动态挠性板：dynamic flex board- \6 [9 Y. U7 D# Z. L
54. 静态挠性板：static flex board
7 Z* O+ `; T/ N3 m% c! C3 w 55. 可断拼板：break-away planel
7 j3 E, n* o& f) v 56. 电缆：cable
( H" c1 ]; }( x5 @6 w 57. 挠性扁平电缆：flexible flat cable (FFC)# a( `2 J' A8 V1 \' ]3 t
58. 薄膜开关：membrane switch
" l$ X, s$ a" L- p" v, M, p 59. 混合电路：hybrid circuit+ }. z! g! x& _, @9 g0 @
60. 厚膜：thick film
6 y; f9 @. t% d5 A1 B 61. 厚膜电路：thick film circuit9 Z8 A- o. D7 x! S
62. 薄膜：thin film# X" h! }8 I; A% S9 A! S
63. 薄膜混合电路：thin film hybrid circuit2 F* c8 J/ g* `; ~" F2 K0 r0 F
64. 互连：interconnection* e- f" N0 f" c
65. 导线：conductor trace line7 x* ^8 L( w! n6 M5 V0 _- a) r$ h7 r
66. 齐平导线：flush conductor
( X( `- ?3 J. P; c2 t6 Y 67. 传输线：transmission line! s0 l9 Z2 y, ^3 ^$ a2 r+ k# f# B
68. 跨交：crossover
4 c4 H g# c8 U' f6 i+ r6 _' s 69. 板边插头：edge-board contact. i9 O- D R: r2 Z) s. O
70. 增强板：stiffener
5 s* p* h5 L5 @% R4 l3 _ 71. 基底：substrate
$ S' S. b- y8 e8 h( q' Z$ y 72. 基板面：real estate( M" h7 U- `% {* X
73. 导线面：conductor side
}1 X# F* G" Z3 { 74. 组件面：component side/ X, r" r7 i2 H: x
75. 焊接面：solder side
0 o7 w9 c" J7 ` 76. 印制：printing
: @1 e3 b' V6 `6 n3 L6 U 77. 网格：grid
- U# r: ~: @8 B! o9 g 78. 图形：pattern
9 U8 Y+ \" W, @! j, k! M) e 79. 导电图形：conductive pattern" x0 k% Z. h3 d- x3 |
80. 非导电图形：non-conductive pattern5 w, [4 u t5 ^- O9 c
81. 字符：legend8 H+ E2 G$ p" ]# i& q" P( Z/ w
82. 标志：mark |
|
/1 
发表于 2021-7-7 10:12
收藏
淘帖
支持！
反对！