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% j j7 o! {! ?9 I# z 1. 板：board4 _4 k5 v9 P- H
2. 印制板：printed board& [8 `- q7 y5 M% q; i$ _5 w0 b. ]
3. 印制电路：printed circuit
$ Z6 ~/ q3 V. T' f 4. 印制线路：printed wiring1 E; R" P1 V4 V# N+ R
5. 印制线路板：printed wiring board(PWB)
5 F* H7 X/ r% Q3 z$ _ 6. 印制板电路：printed circuit board (PCB)# v1 q s1 w- ?1 r7 `5 W
7. 印制接点：printed contact
. h" G/ n3 T' R9 X3 ? 8. 印制组件：printed component
+ t- X- h* z. X 9. 印制板装配：printed board assembly& t- m1 O! j. i! [
10. 单面印制板：single-sided printed board(SSB)
) \9 S6 j' h, K: v0 @: K4 @ 11. 双面印制板：double-sided printed board(DSB)* h$ E7 J; L. C+ k+ ], y% H, q1 O! u
12. 多层印制板：mulitlayer printed board(MLB)$ z/ B; I! R. [* Y9 g
13. 多层印制电路板：mulitlayer printed circuit board
# G$ y' b5 h; w. x6 a) G1 I 14. 多层印制线路板：mulitlayer prited wiring board1 k6 G8 s% M! P7 ^& c
15. 刚性印制板：rigid printed board; Y/ h' Z8 t E4 B; c" H
16. 刚性单面印制板：rigid single-sided printed borad
m/ P4 @3 d4 c1 ?9 [ 17. 刚性双面印制印制板装配：printed board assembly
' {- ~/ R2 G" b# u+ Y* z% E 18. 刚性多层印制板：rigid multilayer printed board
; u. o; w' L P$ p R4 m* P2 x 19. 挠性多层印制板：flexible multilayer printed board
P E4 I: R' ?/ q7 U8 i7 ? 20. 挠性印制板：flexible printed board! @2 J: @; [: g
21. 挠性单面印制板：flexible single-sided printed board
: A% \, F f+ ?6 v" v 22. 挠性双面印制板：flexible double-sided printed board
, y( N9 E7 L+ V$ Y* \& j' [ 23. 挠性印制电路：flexible printed circuit (FPC)
2 I3 K M5 ~, x/ [ 24. 挠性印制线路：flexible printed wiring
( G' [, Y' _7 M% B6 E. c: N) o. n 25. 刚性印制板：flex-rigid printed board, rigid-flex printed board
' r, f2 ?/ g0 Y. b, ]. ]* a# P 26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
' J; s3 Q1 c/ F2 e: S( e. b 27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board# h# [! y% P# s5 ^0 v( |
28. 齐平印制板：flush printed board
9 z. H; w% J" ]$ L2 s 29. 金属芯印制板：metal core printed board
6 q2 o' u* d* C& S 30. 金属基印制板：metal base printed board% M6 o; r/ T3 Z* n
31. 多重布线印制板：mulit-wiring printed board
3 H5 e: W/ ^& b! W 32. 陶瓷印制板：ceramic substrate printed board& v; E9 a, c+ {1 A9 ^7 F
33. 导电胶印制板：electroconductive paste printed board
& I, o1 L) ]/ `% @ 34. 模塑电路板：molded circuit board1 }/ K8 C. y o) `6 B
35. 模压印制板：stamped printed wiring board; p9 ?. h8 k& }2 S) p0 \( J/ \2 J7 Y
36. 顺序层压多层印制板：sequentially-laminated mulitlayer! A( g( j* [# `
37. 散线印制板：discrete wiring board
/ K1 I4 J/ x6 C; }0 f6 z$ N! ~2 k 38. 微线印制板：micro wire board
0 M) f% e1 I A: i 39. 积层印制板：buile-up printed board+ [8 q- A, _7 E U$ i6 }/ [+ d- |
40. 积层多层印制板：build-up mulitlayer printed board (BUM)
! t8 | ?' R* l# P* T% m. u3 A 41. 积层挠印制板：build-up flexible printed board
3 D, |) C- C+ l$ R" q 42. 表面层合电路板：suRFace laminar circuit (SLC)
5 z$ ]- o; A1 T+ B* [& c6 x" A 43. 埋入凸块连印制板：B2it printed board
4 P U8 w# R/ H$ O 44. 多层膜基板：multi-layered film substrate(MFS)
7 n3 Y3 P* `. F) V( Z0 @' r 45. 层间全内导通多层印制板：ALIVH multilayer printed board
9 s6 U, l8 G5 g s 46. 载芯片板：chip on board (COB)* w! @: d7 L' K' g; }
47. 埋电阻板：buried resistance board _1 { J" F" E5 f! x
48. 母板：mother board- V' p& D9 b2 E: S6 H% L! ~1 u
49. 子板：daughter board
$ C1 J9 d Y0 ], p, T 50. 背板：backplane5 P8 K p6 Z/ [; Q: ]2 I4 V: Q
51. 裸板：bare board( f3 l7 `( x! G0 l: z9 K* I/ }* h
52. 键盘板夹心板：copper-invar-copper board( M7 X. @1 O9 z3 |+ l
53. 动态挠性板：dynamic flex board) Q( q% Y) d' z% R$ X$ F! h
54. 静态挠性板：static flex board
; H3 Y9 k }8 d4 c6 C1 p 55. 可断拼板：break-away planel# d0 b3 k9 V' ]. N2 Z( C
56. 电缆：cable
1 Y; \! b. _& B9 q: l# r 57. 挠性扁平电缆：flexible flat cable (FFC)
" |& y! r, P, U1 \, Z) A 58. 薄膜开关：membrane switch4 }% N' l& `* k& P w9 B: c
59. 混合电路：hybrid circuit
: r! F3 a$ y# p 60. 厚膜：thick film
7 B- ?+ P& f9 p8 l/ t$ ]* c3 V 61. 厚膜电路：thick film circuit4 Q; B# d. K3 s) { J0 X
62. 薄膜：thin film
- B- s% O- M! j _7 a1 O( B1 k, u 63. 薄膜混合电路：thin film hybrid circuit V; W4 _7 ^+ O6 P: b; h: ^
64. 互连：interconnection% S5 ~, w8 ]% s) q$ t5 H) C$ n# m
65. 导线：conductor trace line
! E9 c: m" d. N( h$ l 66. 齐平导线：flush conductor1 d0 r% u* w0 _2 z S s O& G
67. 传输线：transmission line( O& p- }2 y1 m V3 `
68. 跨交：crossover
, u3 ]& V. H! q( A/ H 69. 板边插头：edge-board contact, B# n+ ^8 K5 q1 f9 k5 Y6 J3 w. g
70. 增强板：stiffener4 }& a: r& D+ K& g
71. 基底：substrate
2 l. @- z+ b' d6 I 72. 基板面：real estate/ Y2 v( ]6 G9 y" ? [; _
73. 导线面：conductor side
( q6 c4 f* V/ w Z 74. 组件面：component side8 z: n% ^( `4 C+ q$ k8 v* D- I. L
75. 焊接面：solder side
0 a0 b% K) [; S' Q8 _ u/ X; x8 ] 76. 印制：printing0 w7 T. {6 k2 K5 \, W
77. 网格：grid8 C# I7 L2 n0 X0 D2 B. j
78. 图形：pattern4 u! k e! u" A/ J' w
79. 导电图形：conductive pattern
3 k$ F& J* v3 X. \0 o9 { 80. 非导电图形：non-conductive pattern
4 R- T3 S7 j3 l: Q+ l 81. 字符：legend
0 ~* U+ C0 K$ ~# c 82. 标志：mark |
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发表于 2021-7-7 10:12
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