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PCB设计中专业英译术语之基材：( B/ e0 a$ u0 D, h' x
1. 基材：base material" O, E8 T. u3 ^
2. 层压板：laminate8 @- J; ]+ f4 H9 r+ G7 D
3. 覆金属箔基材：metal-clad bade material9 L" f; U6 x- }7 h5 ^, H8 k
4. 覆铜箔层压板：copper-clad laminate (CCL)
) L; B3 F, Y/ Y' f, w& o 5. 单面覆铜箔层压板：single-sided copper-clad laminate
% \, ^9 N, m9 b8 y# a, Y 6. 双面覆铜箔层压板：double-sided copper-clad laminate
2 d% s2 g3 _6 F8 G 7. 复合层压板：composite laminate
2 F3 E' Z* c/ Z8 w5 H4 T1 X 8. 薄层压板：thin laminate* u# r& {( ]. H2 T$ y, ?9 E9 w
9. 金属芯覆铜箔层压板：metal core copper-clad laminate D5 ?* [4 z- o
10. 金属基覆铜层压板：metal base copper-clad laminate; H& F7 R* O. q& l
11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film" | [# [5 ?6 V* d2 \
12. 基体材料：basis material" P% X" U4 R# o' j2 l3 k
13. 预浸材料：prepreg4 ^) N. _6 L6 h( G) q, g' o8 B% u6 g
14. 粘结片：bonding sheet
8 H2 \& [* B( `7 \* s3 h! b, I 15. 预浸粘结片：preimpregnated bonding sheer
8 P. A+ S& |2 g5 s 16. 环氧玻璃基板：epoxy glass substrate9 J. u( D n* B6 G4 l
17. 加成法用层压板：laminate for additive process
& q: ]+ A' U; B" _ 18. 预制内层覆箔板：mass lamination panel
. H+ ^) w% ^4 Z; _ \- u6 s 19. 内层芯板：core material
3 d" u* k/ x6 c( d- y 20. 催化板材：catalyzed board ,coated catalyzed laminate
' B+ F/ X$ Z" U6 ~ 21. 涂胶催化层压板：adhesive-coated catalyzed laminate
# T4 N) V" A0 V8 Y2 [, z6 ]% l 22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate- @3 |$ g' f8 d, ]) D
23. 粘结层：bonding layer V5 N* j+ K4 s" f$ q6 N+ U
24. 粘结膜：film adhesive
" ?+ w" `7 X0 q( U8 r; @ 25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
8 N( g* ?$ R1 c& a- v# l 26. 无支撑胶粘剂膜：unsupported adhesive film( S; {, X, z' j. M8 l+ K( V8 C
27. 覆盖层：cover layer (cover lay)) n) P5 J- A, Q! ~
28. 增强板材：stiffener material
& I: W( R' o. ~# c1 O& ^ 29. 铜箔面：copper-clad suRFace
( Z5 U* k7 \3 V L+ t$ C2 } 30. 去铜箔面：foil removal surface9 e& y) ?+ x8 f- D/ w m: G
31. 层压板面：unclad laminate surface
# h) y3 f5 ~0 N9 h2 T" H 32. 基膜面：base film surface
! ~3 n; W- ^! H7 X8 C( K 33. 胶粘剂面：adhesive faec
L+ B x4 j8 Q! K- a 34. 原始光洁面：plate finish
0 {0 M: C: {* N& x- i' f: ?& a 35. 粗面：matt finish2 J4 j7 {; J* h: p! V
36. 纵向：length wise direction
8 ?( z0 c0 e/ l& k9 \! z 37. 模向：cross wise direction% v+ r8 H" T, B
38. 剪切板：cut to size panel
8 x$ B: \7 T0 i. P0 a# W( B 39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
8 S5 W) m& x- L( G0 E, K! W9 y 40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
' L+ {) h6 P$ J( G2 U9 M1 U4 o( Y 41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates7 U8 P( g% `; X) ], }6 s$ e
42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
* u5 Q+ ]( J x. P8 { 43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
1 K0 L. ~0 t( P) n( A) p; p# R+ A 44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates/ }" z. _$ s7 p) z; W8 y3 Z6 {
45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates. j( y4 ` ?1 r
46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
1 o0 q/ [' ?# {* k- r7 H- w 47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates" p6 g* M% O8 S$ r" z) y
48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
- h' R8 t2 h5 ^+ U 49. 超薄型层压板：ultra thin laminate. P- Q ^6 v" n& p6 t" v
50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates
" u u5 a8 H1 ? 51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates |
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发表于 2021-7-5 10:50
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