PCB设计中专业英译术语之基材

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　　PCB设计中专业英译术语之基材：
8 ~( ~* j6 g" Z) `/ [　　1. 基材：base material
3 t6 d6 q* ~/ R- ^8 F3 [- G1 A# V. u　　2. 层压板：laminate
　　3. 覆金属箔基材：metal-clad bade material
　　4. 覆铜箔层压板：copper-clad laminate (CCL)
　　5. 单面覆铜箔层压板：single-sided copper-clad laminate
　　6. 双面覆铜箔层压板：double-sided copper-clad laminate
  F* j) V9 G) {2 r  F　　7. 复合层压板：composite laminate
　　8. 薄层压板：thin laminate
　　9. 金属芯覆铜箔层压板：metal core copper-clad laminate
　　10. 金属基覆铜层压板：metal base copper-clad laminate
　　11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
　　12. 基体材料：basis material
　　13. 预浸材料：prepreg
4 V, l3 m; {( d: F$ `+ U- L$ s# P　　14. 粘结片：bonding sheet
　　15. 预浸粘结片：preimpregnated bonding sheer
) I( N" e, Q; a: @2 ]: I, z/ n　　16. 环氧玻璃基板：epoxy glass substrate
　　17. 加成法用层压板：laminate for additive process
0 p  t) ^" g4 c9 e0 w　　18. 预制内层覆箔板：mass lamination panel
4 m; m7 k1 s1 v- Y　　19. 内层芯板：core material
　　20. 催化板材：catalyzed board ,coated catalyzed laminate
3 a  e, ~( T8 w' {+ V　　21. 涂胶催化层压板：adhesive-coated catalyzed laminate
　　22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate
　　23. 粘结层：bonding layer
) h0 R" b/ |: d" _　　24. 粘结膜：film adhesive
+ B+ _% U; K2 y; y$ k( l　　25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
  |3 }# u( a/ i; A' }+ D, \　　26. 无支撑胶粘剂膜：unsupported adhesive film
　　27. 覆盖层：cover layer (cover lay)
　　28. 增强板材：stiffener material
　　29. 铜箔面：copper-clad suRFace
　　30. 去铜箔面：foil removal surface
　　31. 层压板面：unclad laminate surface
　　32. 基膜面：base film surface
　　33. 胶粘剂面：adhesive faec
　　34. 原始光洁面：plate finish
; p3 {$ k  ^# w8 e- W　　35. 粗面：matt finish
　　36. 纵向：length wise direction
$ m. `- p- X0 h! i" w　　37. 模向：cross wise direction
　　38. 剪切板：cut to size panel
　　39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
: ]1 W3 k+ V. ~* H' P' `　　40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
9 H, @. [  y1 {% H6 O$ f' m/ ~　　41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
　　42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
' D5 A0 n8 }0 C3 X2 Y" {( i3 B: u　　43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
: w; D! B) U/ p- b- a$ W7 S　　44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
2 i1 z6 r& {  l　　45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
　　46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
　　47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
　　48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
1 ?; @, `# Z) l, ~　　49. 超薄型层压板：ultra thin laminate
　　50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates
　　51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

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