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[AD9][2层]基于Jlink v9仿真器参考板(STM32F205RCT6+LM358+AMS1117-3.3)原理图和pcb文件
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1. 作品用途:基于Jlink v9仿真器参考板' ?" Y# n: M/ b; W' X
2. 软件版本:AD9
) y( A* g0 R# r1 ^/ |3. 层数:2层; a* Q' C, N5 u+ u
4. 用到的主要芯片:STM32F205RCT6+LM358+AMS1117-3.3
F/ C f) m8 O- F n5.PCB尺寸:88.57*38.68 MM2 @6 U8 `3 ~6 @! K. l7 V
作品截图如下:
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3 S1 k& m0 O2 J! H顶层截图:
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; R2 |3 R X" T1 I8 @# F2 t+ E底层截图:
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叠层阻抗信息如下:
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/ d. C. H6 S$ \( b) QComment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | 104 | C1, C2, C3, C4, C5, C6, C7, C12, C13, C16, C17 | CC2012-0805 | 11 | 226 | C14, C18 | CC2012-0805 | 2 | 106 | C15, C23 | CC2012-0805 | 2 | Cap Chip | C19, C20, C21, C22, C31, C32, C33, CU1, CU2, CU3, CY1, CY2 | CC2012-0805 | 12 | Diode SMT | D1 | DSO-C2/X2.3 | 1 | Header 10X2 | JTAG | IDC2.54-20 | 1 | Resistor Chip | L1 | CR3216-1206 | 1 | LED-3-DOUBLE | LED | LED-R3-H5-DOUBLE | 1 | Header 3 | Pwer | HDR1X3 | 1 | PNP-8550 | Q1 | SO-G3/C2.5 | 1 | NPN-8050 | Q2 | SO-G3/C2.5 | 1 | Resistor Chip | R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15 | CR2012-0805 | 15 | RESNET 4 x 220R | RN1, RN2, RN3, RN4, RN5, RN6 | SDR | 6 | RESNET 4 x 220K | RN8, RN9 | SDR | 2 | RESNET 4 x 10K | RN10, RN11, RN13 | SDR | 3 | Header 5 | SWD | HDR1X5 | 1 | 2T45 | T1, T2, T3, T4, T5, T6, T7 | SSOP8 | 7 | STM32F205RCT6 | U1 | LQFP64_N | 1 | LM358 | U2 | SOP-8 | 1 | AMS1117-3.3 | U3, U4 | SOT-223 | 2 | NUP4201 | U5 | SOP-6 | 1 | Header 5 | UART | HX2.54-5 | 1 | Header 6 | USB-B | USB-B | 1 | XTAL | Y1 | XTAL-PINGBI | 1 |
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原理图和pcb文件如下:
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