IPC-2252射频/微波电路板设计指南

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IPC-2252射频/微波电路板设计指南 & _. L: p# t9 v- L9 C' E IPC 2252射频微波电路板设计指南.pdf (1.51 MB, 下载次数: 440) 2010-11-30 12:42 上传 点击文件名下载附件 下载积分: 威望 -5

由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发 2 W( T9 e$ r7 j: G' o目录 0 ^. ?% ^9 r' G# P* Y1 概述(GENERAL)................................................................................................................................ 1 : B! A+ M* ^: V1.1 目的(Purpose)........................................................................................................................... 1 ) Q5 R  s; C# k  P0 k4 e- }6 Z1.2 范围(Scope).............................................................................................................................. 1 1.3 术语和定义(Terms and Definitions)......................................................................................... 1 2 应用文档(Application Documents) ..................................................................................................... 3 * L9 x+ b4 T  j6 |2.1 国际互联与封装协会(IPC) ...................................................................................................... 3 , P0 k5 g$ T1 G: T4 K% i- z2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3 6 P! Y9 y  I1 w* a2 x2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3 2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3 2 w) N, }" F9 K2.5 国际标准化组织(International Organization for Standardization)........................................... 3 ( r7 R# j8 D& ^& W2 G$ X2.6 参考文档(Reference Information) ............................................................................................ 3 3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3 / k5 }# N2 l: a/ @* c" a+ h3.1 最初输入(Initial Input).............................................................................................................. 3 * J7 n: s1 `2 e9 f$ L3.2 设计方案(Design Options)........................................................................................................ 3 % h: Z8 w2 X. b& A1 _: S3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3 3.4 电气设计(Electrical Design)..................................................................................................... 3 3.5 机械设计(Mechanical Design).................................................................................................. 3 3.6 设计预审(Preliminary Design Review) .................................................................................... 3 3.7 电路实验板(Breadboard).......................................................................................................... 3 8 O# J& Q8 \* t3.8 原型(Prototype)........................................................................................................................ 3 3.9 文件编制(Documentation)........................................................................................................ 3 3.10 最终设计评审(Final Design Review)..................................................................................... 3 4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5 4.1 产品特性列表(Design Features Listing) .................................................................................. 5 * Y$ i8 b* C; u& G/ Q7 a: {( P- I! L4.2 原图(Master Drawing) .............................................................................................................. 5 4.3 原始图形(Master Pattern) ......................................................................................................... 5 3 x; }% {* ]2 S2 ^5 材料(MATERIALS)............................................................................................................................ 5 3 y* B8 X1 A$ p3 ^0 v5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5 + _; S9 W4 [* a2 B$ P7 D5.1.1 基材选择(Substrate Selection)....................................................................................... 5 5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5 5 R+ e! V7 R* s8 i5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6 5.1.1.3 厚度(Thickness) .................................................................................................. 6 & ^& [9 X2 q2 g5.1.1.4 环境(Environment).............................................................................................. 7 5.1.1.5 成本(Cost) ........................................................................................................... 7 5.1.1.6 供应商(Supplier) ................................................................................................. 7 1 W2 D1 J, M, `5.2 粘接膜(Bonding Films)............................................................................................................. 7 5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7 3 j# ?0 s2 [9 Z3 a' Z, c& q+ xI July 2002 # j7 k! u+ H# F0 u& i& X% Z5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7   E+ h$ n% f" N7 H* c7 ?# Z2 w5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8 5.3 金属(Metals)............................................................................................................................. 8 ; @1 ?' O+ X! F) A: q5.3.1 金属覆层(Cladding) ....................................................................................................... 8   t7 X6 _% ]( U( B5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8 5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8 & s" i6 y% W0 o; ]* H2 ^! d5.3.2 金属镀层(Metal Plating) ................................................................................................ 8 ; R) T5 H' A7 h" }5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9 3 Q" A: ]$ z$ M5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9 5.3.2.3 镀镍(Nickel) ........................................................................................................ 9 ) f- X: i8 E" ~: F5 X4 E5.3.2.4 镀金(Gold)........................................................................................................... 9 + K; J! F5 ]" H0 `: u2 i# J5.3.2.5 镀银(Silver) ......................................................................................................... 9 5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9 * I8 U2 ^; i/ K1 N- J5.3.2.7 焊料镀层Solder Coating...................................................................................... 9 5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9 : _% i" Y7 X8 |6 M5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9 / P% W6 i; l7 `7 l/ b5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9 6 e2 ~; T2 `/ X5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10 9 @4 G) M. w6 }3 m4 O5.4 仿型涂层(Conformal Coating)................................................................................................ 10 5 r; {& Y. [5 g7 w5.4.1 一般注意事项(General Caution).................................................................................. 10 ) ^4 y" I' p- @( d; q+ e- t5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10 : I& K; t* b3 H  a6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10 4 N  U+ U7 M5 h3 S6.1 带状线(Stripline) ..................................................................................................................... 11 6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11 2 m) o- b- I8 m6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11 6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12   f2 K* ~8 \8 t/ a. z6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12 & M1 X" H. A: q( w$ W6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12 6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12 6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13 5 ]4 X8 C, Y' k, l+ _6 j6.3 微带线(Microstrip) .................................................................................................................. 13 6 I9 H/ @+ w, u6 q6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective Permittivity f Microstrip)................................................................................................................ 13 ) B0 ^7 O, c4 h  ^, R6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15 7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15 7.1 机械特性(Machined Features) ................................................................................................ 15 : `8 v  P7 y, D  H8 S* ^7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15 * ]& S" h! ?4 x& R( T( _7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16 7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17   p2 s$ V0 |$ f% l" H$ gII 1 N' k+ l0 `& F! C1 ~- C' Y5 IIPC-2252 & h5 F5 D2 C' s' t: V) i  D7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17 7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18 7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18 7.1.6 外形(Periphery)............................................................................................................ 18 7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18 3 M; {* C# b4 N7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18 3 ]  }# W; W4 ~/ o" B7 D7.2 出图(Imaging) ......................................................................................................................... 18 7.2.1 底片(Artwork).............................................................................................................. 19 $ r. u, E! {  T# v7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19 , h! y! o& Z+ m" }1 m) w1 j7.2.3 环孔(Annular Rings) .................................................................................................... 19 7.3 PTFE活化(PTFE Activation) ................................................................................................... 19 7.4 金属化(Metallization) ............................................................................................................. 19 7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19 5 \* Q# S3 c) h" F6 ^7.4.2 镀铜(Copper Plating) ................................................................................................... 19 9 I2 T$ ~" s' m% g7.5 蚀刻(Etching) .......................................................................................................................... 20 7.6 粘接(Bonding)........................................................................................................................ 20 7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21 7.8 测试(Testing).......................................................................................................................... 21 ! S* {0 U- O9 s9 f3 x8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21 0 l- a1 z! j2 r' H$ r8 u8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21 8.1.1 机械固定（Mechanical Mounting）........................................................................... 21 3 r1 p$ P2 Q# t; e) W8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21 3 y! ~' U2 ?1 S+ i8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21 / a2 [! H  p# c6 J( E7 N8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22 7 b2 k; ^, X" q/ W8.1.4 软钎焊（Soldering）................................................................................................... 22 . x8 o( e+ ]3 e1 l3 _7 R  {, l8.1.4.1 温度警示（Temperature Caution）.................................................................. 22 3 w1 g. z! v# V8.1.5 直接粘结（Direct Bonding）...................................................................................... 22 8.2 连接器安装（Connector Attachment） ................................................................................. 22 8.2.1 边缘连接器（Edge Connector） ................................................................................ 22 ( b( k: T0 H9 Q& `8.2.2 表面连接器（SuRFace Connector） ............................................................................ 23 8.3 器件安装（Device Attachment）........................................................................................... 23 ! ?, u3 F4 C: x6 t' p8.3.1 焊接连接（Welded Bonds）....................................................................................... 23 8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23 8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23 8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24 + S; j! r  P9 F& d8 S( C8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24 8.3.1.5 软钎焊（Soldering）........................................................................................ 24 8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24 6 s5 M2 G4 n) ~! q% A7 i8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24 , S5 e0 o5 t$ D2 L, x& xIII July 2002 1 ?( B# a' X% H& \; Q3 t8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24 ! Y2 f6 y# t& \  O8 p8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24 8.3.3 器件安装（Device Attachment）................................................................................ 24 8 L  I* {/ v( ~4 v% b' ]/ L& I8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24 8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25 1 {8 r* {1 U, ^! `- `8 T; r8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25 8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25   U3 K& H' {8 Q) b8.3.3.5 再流焊（Solder Reflow）................................................................................. 25 + j9 ?8 [0 D6 M- x8 H* F8 S: D9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25 9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25 ; K9 v1 l5 o  i& \9.2 可靠性（Reliability）.............................................................................................................

黑月

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liqiangln

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