IPC-2252射频/微波电路板设计指南

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IPC-2252射频/微波电路板设计指南   V8 w$ @- P; { IPC 2252射频微波电路板设计指南.pdf (1.51 MB, 下载次数: 440) 2010-11-30 12:42 上传 点击文件名下载附件 下载积分: 威望 -5

由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发 目录 1 概述(GENERAL)................................................................................................................................ 1 1.1 目的(Purpose)........................................................................................................................... 1 * R6 v9 T+ L& ?8 i5 U, {3 r1.2 范围(Scope).............................................................................................................................. 1 # L  Q, L. c) T) J  d1.3 术语和定义(Terms and Definitions)......................................................................................... 1 2 应用文档(Application Documents) ..................................................................................................... 3 * Y9 O, U9 p6 X7 E7 H: U1 p  d7 y2.1 国际互联与封装协会(IPC) ...................................................................................................... 3 2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3 2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3 6 Y# h* {- R" j6 R; t5 N" C2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3 2.5 国际标准化组织(International Organization for Standardization)........................................... 3 6 K" I7 f, G; f: p2.6 参考文档(Reference Information) ............................................................................................ 3 * I  _! i' F" ]6 n) d% h3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3 - R; }% V) T9 j( d) E4 @, C$ P( }3.1 最初输入(Initial Input).............................................................................................................. 3 $ M; L0 ]7 `" n+ N* W; P3.2 设计方案(Design Options)........................................................................................................ 3   a6 E) h) E4 ^! n, g9 g! x. Z3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3 " e) p+ A& B3 w3.4 电气设计(Electrical Design)..................................................................................................... 3 ' C, w- `/ K* R* s8 f6 K3.5 机械设计(Mechanical Design).................................................................................................. 3 ( C: d3 v+ x2 h3.6 设计预审(Preliminary Design Review) .................................................................................... 3 & V7 X+ W: z" B/ R3.7 电路实验板(Breadboard).......................................................................................................... 3 % p" _1 r5 U3 N9 c7 S: X3.8 原型(Prototype)........................................................................................................................ 3 3.9 文件编制(Documentation)........................................................................................................ 3 3.10 最终设计评审(Final Design Review)..................................................................................... 3 4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5 # K9 A5 w% M7 v# o4.1 产品特性列表(Design Features Listing) .................................................................................. 5 + k3 \, P  ]' B( E9 k4.2 原图(Master Drawing) .............................................................................................................. 5 4.3 原始图形(Master Pattern) ......................................................................................................... 5 * g/ B& C9 q5 s7 n% [5 材料(MATERIALS)............................................................................................................................ 5 5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5   t* @5 P6 a7 \- J( p5.1.1 基材选择(Substrate Selection)....................................................................................... 5 ) T: E4 D" A/ y* W5 e5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5 5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6 5.1.1.3 厚度(Thickness) .................................................................................................. 6   S* t- g3 z7 i0 c6 ]# Y5 n  d5.1.1.4 环境(Environment).............................................................................................. 7 5.1.1.5 成本(Cost) ........................................................................................................... 7 5.1.1.6 供应商(Supplier) ................................................................................................. 7 1 Y* d) m8 R% D9 W1 w" |5.2 粘接膜(Bonding Films)............................................................................................................. 7 1 I3 ]0 m, i9 V: U' g+ u2 T& J5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7 2 [; V# t- ~% t% b  aI " D- _4 a# P' N: p9 y; x' hJuly 2002 ) v1 U* c0 J* K' j5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7   f3 V1 Y: c2 h* h1 C7 E2 n& p5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8 - O- S$ ?3 v* j1 P9 w  d! H6 G: z5.3 金属(Metals)............................................................................................................................. 8 5.3.1 金属覆层(Cladding) ....................................................................................................... 8 5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8 5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8 ; z8 k) m2 g" E3 I5.3.2 金属镀层(Metal Plating) ................................................................................................ 8 6 W9 q- J4 r1 e' w+ _& z5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9 & {. z# Q' J4 P( \  T% N) \9 A  N5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9 ; f* Q' O$ B7 K! q, X5.3.2.3 镀镍(Nickel) ........................................................................................................ 9 5 J$ d% W  z  @3 ]2 ?+ g6 m4 N2 t5.3.2.4 镀金(Gold)........................................................................................................... 9 5.3.2.5 镀银(Silver) ......................................................................................................... 9 0 a& ], H/ l) C, s- t' y/ a5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9 5.3.2.7 焊料镀层Solder Coating...................................................................................... 9 5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9   ^# i; @* t, _7 x7 `+ }5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9 % E" ~( q3 S: A8 g& g: X  a, a  ?( J5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9 % Y, `7 ]0 u# P% N( L5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10 5.4 仿型涂层(Conformal Coating)................................................................................................ 10 5.4.1 一般注意事项(General Caution).................................................................................. 10 5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10 6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10 0 v" a0 x' c% C8 k0 J6.1 带状线(Stripline) ..................................................................................................................... 11 6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11 6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11 ; I; l* r8 \0 F6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12 6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12 6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12 6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12 6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13 : E1 }8 o2 o. c4 H6.3 微带线(Microstrip) .................................................................................................................. 13 6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective Permittivity f Microstrip)................................................................................................................ 13 6 r2 X- \! E+ `  x. y& V1 }- P/ n& \6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15 / @0 x+ h0 N$ d; i. E5 E  l! X7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15 7.1 机械特性(Machined Features) ................................................................................................ 15 + N  B- q9 `$ I4 H) M- g7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15 7 r2 Y' m2 U" P' d% `7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16 5 F1 d4 i+ U. b% y& l7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17 II 3 }& E$ U8 D# G! j- F: ^IPC-2252 8 ]6 w" Y0 R3 r2 M9 X. z* b$ y7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17 + B6 |' Q; W( c& M7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18 ; {# x' L, l2 s7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18 9 a; R/ ^" F+ |3 u% [7 V7.1.6 外形(Periphery)............................................................................................................ 18 " C( B7 e/ m4 _- {& y7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18 7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18 : W/ c- a9 m8 w$ h. _" @7.2 出图(Imaging) ......................................................................................................................... 18 : f  a% F$ V% A  t/ A. e7.2.1 底片(Artwork).............................................................................................................. 19 / ~% z$ i  b4 |) F" b1 ]6 d6 m4 x7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19 7.2.3 环孔(Annular Rings) .................................................................................................... 19 7.3 PTFE活化(PTFE Activation) ................................................................................................... 19 7.4 金属化(Metallization) ............................................................................................................. 19 3 H+ b3 G5 q: j5 a7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19 0 A: @6 v/ x, \7.4.2 镀铜(Copper Plating) ................................................................................................... 19 7.5 蚀刻(Etching) .......................................................................................................................... 20 7.6 粘接(Bonding)........................................................................................................................ 20 . \. J' F6 ^# I& f  D% ^7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21 7.8 测试(Testing).......................................................................................................................... 21 8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21 6 A: h9 K/ w" G6 {$ s' [8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21 , u; V0 w! H3 d" H8.1.1 机械固定（Mechanical Mounting）........................................................................... 21 8 M% J6 I  g6 X# Y8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21 3 U+ G& x) P  k5 p8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21 ; V( [6 g% d2 j. t, q0 [$ [8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22 8 K. ]% }3 U: R+ v, j8.1.4 软钎焊（Soldering）................................................................................................... 22 ; x8 v  t. g! R; n, q5 e8.1.4.1 温度警示（Temperature Caution）.................................................................. 22 $ |1 ~3 M7 v' a; e8 i8.1.5 直接粘结（Direct Bonding）...................................................................................... 22 8.2 连接器安装（Connector Attachment） ................................................................................. 22 0 _+ V2 E# S4 \9 O- E1 G8.2.1 边缘连接器（Edge Connector） ................................................................................ 22 8 v# z! P3 P5 A* d- ^7 u8.2.2 表面连接器（SuRFace Connector） ............................................................................ 23 9 l: Y' Z' W4 ]* @, `4 s6 [8.3 器件安装（Device Attachment）........................................................................................... 23 8.3.1 焊接连接（Welded Bonds）....................................................................................... 23 8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23 ; Z; K! k" C; `9 A0 _0 R# Y3 M; {8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23 , y1 t; {/ g/ I; N* Z' E8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24 6 R! P  u( |9 ?2 w) ]8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24 8.3.1.5 软钎焊（Soldering）........................................................................................ 24 8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24 9 F' g7 P- y: g4 |8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24 6 W! h8 R' `+ q  Z2 l5 C  VIII 3 a# B1 P( x" @( _4 O( O3 {July 2002 8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24 ) J! _  ?' f) g2 s# W$ _8 e: H8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24 8.3.3 器件安装（Device Attachment）................................................................................ 24 8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24 8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25 $ w! C7 t7 i1 W- t% `& Z/ t; h) S8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25 8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25 8.3.3.5 再流焊（Solder Reflow）................................................................................. 25 9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25 9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25 9.2 可靠性（Reliability）.............................................................................................................

黑月

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liqiangln

关于IPC的东西，大家可以多了解，毕竟这个是标准，讨论的时候，有理可依。

beihaifuyao

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lequwudi

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