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IBM DFM Guidelines for FBGA - Internal , J8 E7 |$ P* B' o& [
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This document covers design issues related to the assembly of fine pitch BGA devices with pitches greater than or equal to 0.5 mm and less than 1.0 mm. Only components with reflowing balls are addressed in this document, parts with non-reflowing balls may have different requirements and are not covered here. FBGAs are a subset of chip scale packages (CSPs), and form a substantial proportion of CSP packages presently available.
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/ b! ~$ z- F3 P( K3 a# IThe following recommendations are provided as a guide to achieve optimum manufacturability and reliability of fine pitch area array technology printed circuit, p) f. e' B; {- f8 q
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发表于 2020-8-19 10:33
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