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1.开料：CutLamination/Material cutting
8 o6 V, L: S7 l" F5 |3 g8 V 2.钻孔：Drilling/ G+ s. Z1 M( e N r. R' m- {
3.内钻：Inner LayerDrilling
3 O+ G1 e: W& r& u: R! v( ` 4一次孔:Outer Layer Drilling
9 N& U; X% ?+ o; l0 c 5.二次孔:2nd Drilling
0 m7 l. d( S, B# _ 6.雷射钻孔aser Drilling /Laser Ablation) d4 m0 l& d) _ S" ?
7.盲(埋)孔钻孔:Blind & Buried Hole Drilling
" f. I% I% Z0 r' x( d 8.干膜制程：PhotoProcess(D/F)/Dry Film
1 |9 Z4 O4 X& v% z9 `; M- X; D 9.前处理 (Pretreatment)
* _2 w; N: U3 V+ V2 ^: C$ V 10.压膜ry Film Lamination% O y' X" b, l( b; f( E
11.曝光:Exposure
q( |% Q: T8 ~: E6 F, v/ | 12.显影eveloping
" n) I' h- T ~8 k, K 13.去膜:Stripping
/ X0 N; N. A: x9 l8 C 14.压合：Lamination) n" e4 D2 z/ m# Y* K) C/ w
15:黑化:Black OxideTreatment
; }/ z/ _9 L9 o4 Y1 W- Q5 b/ A+ _ 16.微蚀:Microetching5 {/ L9 `8 o% w" e
17.铆钉组合:eyelet
- W7 j3 s+ A" j& x$ J5 e 18.迭板ay up* N7 A" f* w( v, a$ b
19.压合amination1 y, X9 C/ Z1 U' X: G7 O' |+ z3 v, J
20.后处理ost Treatment- @2 p- H& s+ O: f
21.黑氧化:Black Oxide Removal0 V/ B( L4 Q+ H) U" X
22.铣靶:spot face: ^4 b% q) O3 Z+ G3 }# p- p
23.去溢胶:resin flush removal
* X6 ~) _- e% C% e9 x, K- G 24.减铜：Copper Reduction9 v1 k: _8 T' j% k s7 N/ L, }
25.水平电镀：HorizontalElectrolytic Plating# Z& ?! V6 k6 K& E2 E
26.电镀：Panel plating' E1 `' Y$ r, ]2 f. M) j
27.锡铅电镀:Tin-Lead Plating /Pattern Plating' @6 p# R7 y; G+ `, q# Z+ Q! f
28.低于 1 mil: Less than 1 mil Thickness5 M0 {% B4 \: T9 \# j, n
29.高于 1 mil:More than 1 mil Thickness
1 {0 w" J! ^+ ]9 U2 W 30.砂带研磨:Belt Sanding
# Z8 u( |* S- B& D) M* z 31:剥锡铅:Tin-Lead Stripping9 s- ^* l' p3 y9 t: I! x; z
32.微切片: Microsection! h" x; B, N7 c
33.蚀铜:Etching
6 k6 e N/ H/ q" |1 b 34.初检:Touch-up
0 O8 o: `+ D: W! d# \' f 35.塞孔：Plug Hole: u: k {/ q6 Q# T8 O: {
36.防焊(绿漆/绿油)：SolderMask
( x, u4 ~& Q' Y1 X! @ 37.C面印刷rinting Top Side
6 J A$ r: A e9 @8 B9 I 38.S面印刷rinting Bottom Side/ W1 H5 W& ], E6 i
39.静电喷涂:Spray Coating/ G7 P1 ~ |5 c( b# {8 y1 W
40.前处理retreatment- o2 T4 P7 D2 U. J$ W
41.预烤recure
1 }; S( l3 ~ d5 V; N- J1 V+ I 42.后烘烤ostcure( S. X. P( f8 C! P5 I1 D: ?
43.印刷:Ink Print
) J7 _* Q, t d9 W# p, ~# K9 O 44.表面刷磨:Scrub
2 P/ @2 P- u2 F- P7 J$ f5 Q# w J 45.后烘烤ostcure7 p1 O2 ]1 p8 p! S
46.UV烘烤:UV Cure; H9 S: K& \& F& p- A. P/ V$ ]( j
47.文字印刷rinting of Legend( h6 b: |" a. m4 G
48.喷砂umice/Wet Blasting! Z: @) J4 S( L& W! o! J
49.印可剥离防焊/蓝胶eelable Solder Mask)
& o X* ^) {) }; | 50.化学前处理,化学研磨：Chemical Milling
' y% R# v/ G2 M: k. s 51.选择性浸金压膜：Selective Gold Dry Film Lamination* m, d9 K" R4 ?4 l0 l
52.镀金：Gold plating
" n- ^0 }8 P. u) k& r2 T$ z 53.喷锡：Hot Air SolderLeveling
, C5 q7 ]2 g5 B6 T) H9 G. S 54.成型：Profile/Form% y' ?6 Q" q2 I; Z) `
55.开短路测试：Electrical Testing( B' n f$ c( C+ I& z/ f+ m2 O
56.终检：Final VisualInspection
( U! u- o( [7 r' z# o4 A 57.金手指镀镍金：Gold Finger
) N7 W& w5 V( F7 Z) ` 58.电镀软金：Soft Ni/Au Plating
) }0 w# D5 `1 e% b1 r M O 59.浸镍金：Immersion Ni/Au / Electroless Ni/Au, d' u+ c+ F8 p; Q& X- C
60.喷锡:Hot Air Solder Leveling
s# z& M! k# t. i# E 61.水平喷锡:HorizontalHot Air Solder Leveling! p% l0 V/ A, ^% g, S
62.垂直喷锡: Vertical Hot Air Solder Leveling
# `/ s# h9 s" ?0 b# p+ F, ? 63.超级焊锡:Super Solder- T* u" N; u2 K2 K, B8 L3 X
64.印焊锡突点:Solder Bump; L* w* c; y1 q1 V: L5 t) J
65.数控铣/锣板：N/C Routing/Milling
) C/ m/ ^ f# e# }+ w% O7 Z: o 66.模具冲/啤板：Punch1 j5 C3 ]8 I8 Q; N. U2 k* K# w
67.板面清洗烘烤：Cleaning & Backing' n; W. b/ I3 p6 c
68.V型槽/V-CUT： V-Cut/V-Scoring
2 Y3 W, z X9 Y 69.金手指斜边：Beveling of G/F) z5 b; D \! U7 m' U" s
70.短断路测试Electrical Testing/Continuity & Insulation Testing1 V5 Q- ^7 L! s+ J6 A
71.AOI 光学检查：AOI Inspection
6 j X9 }7 r3 k2 c3 z; y6 N 72：VRS 目检：Verified & Repaired7 K2 i. |& A! g; `# M- L/ t
73.泛用型治具测试：Universal Tester9 [$ w( h6 |, O m3 ^9 y
74.专用治具测试：Dedicated Tester2 c' m* K# D3 I9 c" [
75.飞针测试：Flying Probe
: P' i& [0 X7 {, Y! U0 _ 76.终检：Final Visual Inspection9 i( e. R' V q0 [: l) {8 D. @: [
77.压板翘：Warpage Remove
, S* G) L j: f) V 78.X-OUT 印刷：X-Out Marking( Z, q3 N3 W% d1 {
79.包装及出货：Packing& shipping c8 ~* w3 c9 `- X8 `+ \# a2 v+ ^
80.清洗及烘烤： Final Clean & Baking
% l$ c# [5 x5 ?0 |. Z/ ?# h2 c9 x 81.铜面保护剂：ENTEK Cu-106A/OSP
6 k `. g1 O" j* R 82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test3 S$ w) u; p" s+ {6 q
83.冷热冲击试验:Thermal cycling Testing
# }0 A% P9 x; B9 H, E 84.焊锡性试验:Solderability Testing3 H) K4 F/ c5 n' S& B
85.雷射钻孔aser Ablation8 A% ]9 E2 e \& M
86.雷射钻Tooling孔aser ablationTooling Hole, u$ v- J" \) W/ L% T0 B
87.雷射曝光对位孔aser Ablation Registration Hole
# W, S4 o r( p0 ?& R* D 88.雷射Mask制作aser Mask
8 f/ `5 z0 j) i0 } 89.雷射钻孔aser Ablation3 P# |0 p( Z; F/ h4 |3 ^# ]+ {
90.AOI检查及VRS:AOI Inspection & Verified & Repaired
& \% @, w9 W+ n- C6 M 91.除胶渣esmear
' W" J6 C2 V/ i7 H \+ C r7 B8 m 92.专用治具测试edicated Tester. m3 ?: O0 G9 H+ [% X$ @7 M1 s
93.飞针测试:Flying Probe/ D7 z! h4 z- O ~# c1 @3 K( f, t6 b
94.压板翘: Warpage Remove, B1 P7 S1 p1 h" Q! R, B
95.底片：Ablation
* u/ w0 G7 h( i' _# r 96.烧溶：laser)
6 E' E) `2 ^/ R% s, G0 U 97.切/磨：abrade" l5 W( h! D& A4 ]5 g
98.粗化：abrasion
3 p$ o0 C* ]% m* @% R8 U: _ 99.耐磨性：absorption resistance9 O: \; j- s" N! |. A6 B
100.允收:ACC /accept p X: [0 H$ F# D5 _/ P1 v1 G" ^
101.加速腐蚀:accelerated corrosion test
( J5 A" d/ \( d* V 102加速试验:accelerated test
" a) M4 D# p8 A: T. Y+ R. s& s 103.速化反应:acceleration! ?( F, S) t8 M, D
104.加速剂:accelerator8 H, ~4 Q" ^+ i8 `
105.允许：acceptable
% e1 H$ l" ] C$ b 106.活化液：activator
" A2 W' w' V# e' j% I/ H/ z$ Z 107.实际在制品：active work in process
" G2 o' T# y0 _0 R- v+ H) }2 X1 x 108.附着力：adhesion( ?0 ]4 s; ^7 A# p+ a
109.黏着法：adhesive method
# H8 L+ N7 \9 b: n 110.气泡:air inclusion
& u& R6 k* d* [ 111.风刀：air knife. @& u% C& d5 [. G$ V
112.不定形的改变：amorphous change
4 F4 l, R( U$ Q3 Y+ b* y/ x o 113.总量：amount, e5 T( l2 {; w( `
114.硝基戊烷：amylnitrite2 l1 e' V' _, K) \! F7 x j* T
115.分析仪：analyzer
0 q% [5 v- z2 r- l 116环状垫圈;孔环annular ring
! A0 m1 }* T8 O8 v 117.阳极泥：anodeslime (sludge)
+ Q% R; W1 a; d7 E( W 118.阳极清洗：anodizing
' r6 A/ t" f3 ^- G 119.自动光学检测：AOI/automatic optical inspection+ n4 s% D$ w; H1 |
120.引用之文件：applicable documents" ]9 R* r( c# O, l; u' r
121.允收水平抽样：AQL sampling7 @7 p _6 S) @3 H# ~( o2 ^# U2 O# y
122.液态光阻：aqueous photoresist
7 q) f- ?1 X b0 i7 x 123.纵横比(厚宽比)：aspect ratioAs received
" ~( e; z$ {! ~# E" n3 [ 124.背光：back lighting
# l; h. n; W$ p+ e: v 125.垫板：back-up- ?& D( d M- k6 J5 K* P6 u+ g; ]
126.预留在制品：banked work in process
% D3 f- P- F# }% b& G9 L$ | 127.基材：base material
. B6 K3 |! `; s; d3 W' ?; F 128.基准绩效：baseline peRFormance
! D" S" n, u+ l5 {. }8 G 129.批：batch
|% Y; |' }' X9 e6 F* { 130.贝他射线照射法：beta backscattering5 ^% o4 n8 o4 _5 R# T z: m
131.切斜边;斜边：beveling
1 H4 R, N6 ^0 b/ m/ T" e& ^ 132.二方向之变形:biaxial deformation
/ u% A/ w7 e' l3 a* ^ 133.黑化：black-oxide. ~' D% j3 \% |
134.空板：blank panel! s& g! \4 {, a
135.挖空:blanking( s" M; a! ] w9 q; I
136.弹开:blip
, W4 P1 m; z% [5 | 137.气泡:blister blistering- i+ n9 ^2 L4 Q
138.吹孔:blow hole
1 X* `5 J5 r( b/ b6 @ 139.板厚错误:board-thickness error' @- ]+ T8 s9 `/ k
140.黏结层:bonding plies
0 h* {0 S5 x. i* ^1 I 141.板弯:bow ; bowing8 R ~+ s" u8 U* F, Y
142.破空:break out
]9 K0 e9 x0 Q( a 143.搭桥;桥接：bridging
" D7 q4 t" a1 Y& v8 g* m 144.接单生产：BTO (Build To Order)
5 N2 e! \& n8 V+ c* w: v. J 145,.烧焦：burning4 p( u) \. T' a
146.毛边(毛头)：burr; h- K0 N3 V/ a9 m3 G: L" J' _) v
147.碳化物：carbide G( Z" V, V3 f1 S" w& V$ k
148.定位梢：carlson pin
( V) |3 b5 s1 k+ e/ c7 @ 149.载运剂：carrier
* A& |. o/ o' J3 V1 x 150.催化：catalyzing' D' z/ L8 x9 ?+ D! d1 e5 ~
151.阴极溅射法：catholicsputtering
- k! }$ p. X0 b6 b2 v8 x 152.隔板;钢板：caul plate
8 F6 r( j" W+ F; x: y 153.校验系统之各种要求：calibration system requirements
4 ]+ ~; M8 @: `. b5 a 154.中心光束法：center beam method
& E% v" K; _, V' O 155.集中式投射线：central projection
Z6 A5 k3 Y1 ]$ P0 f2 J 156.认证：certification) U# N/ ?. ]+ p" d2 i& t! X
157.倒角 (金手指)：chamfer chamfer$ H0 L6 }# b. `
158.切斜边;倒角：chamfering
; S8 k J8 A2 p9 T 159.特性阻抗：characteristic impedance
L7 ~ ]6 q) E 160.电量传递过电压：charge transfer overpotential6 Q$ @' G! M- m% V! k. O
161.网框：chase* M5 s1 F* x# C. }9 V! k* V) X
162.棋盘：checkboard/ ~; ~1 y r9 n! F0 M% V
163.蟹和剂：chelator+ L8 ~# P* K/ S* c
164.化学键：chemical bond2 L7 p3 S1 f: p9 s9 t# I
165.化学蒸着镀：chemical vapor deposition
+ B( d' m4 L" M 166.圆周性之孔破：circumferential void
$ D- J* Z- C. l, o; h: @ 167.包夹金属：clad metal* {. u0 P8 z X8 X b' d8 Q9 U# T1 F
168.无尘室：clean room
% ]8 R- O& t) U, ~, Q, @ 169.间隙：clearance
$ C4 B4 f0 V2 x6 ~6 x 170.表面处理：Coating/Surface Finish |
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发表于 2020-8-13 13:30
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