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1.开料：CutLamination/Material cutting
3 U( w4 T2 i. s$ X( C 2.钻孔：Drilling
, B) D# ?$ z2 K' L1 {2 V 3.内钻：Inner LayerDrilling
9 X7 t @+ R X. u: x) {! p+ h 4一次孔:Outer Layer Drilling
8 z% d( A" p2 E; B0 j `! @ 5.二次孔:2nd Drilling: l% r9 V% ?9 ^8 w' i, r7 a
6.雷射钻孔aser Drilling /Laser Ablation
9 J- I/ ^) G6 Z* c S 7.盲(埋)孔钻孔:Blind & Buried Hole Drilling+ j& J* W3 O) y
8.干膜制程：PhotoProcess(D/F)/Dry Film
+ d. G: F8 k/ W7 t. P/ J 9.前处理 (Pretreatment): }7 E& ]% S+ U; l! B
10.压膜ry Film Lamination
3 z" n7 b' H3 V/ }9 m 11.曝光:Exposure
. D! [3 q9 |2 G 12.显影eveloping
* j3 s$ H0 e8 d- H 13.去膜:Stripping. x+ m3 d6 `( e, ]8 ~2 L; }' Q
14.压合：Lamination; n" x6 B. c9 F! q' |% Z1 Z
15:黑化:Black OxideTreatment) v& _$ b2 ^( {+ l* B
16.微蚀:Microetching
% v2 E( @! L+ W8 j4 Z7 w0 w0 v- G' s 17.铆钉组合:eyelet
& e2 S5 W( ?: H5 z0 b6 x 18.迭板ay up
. [& c9 }1 D- f8 B 19.压合amination
% ~$ S( z/ T: Q5 ? 20.后处理ost Treatment7 y+ N4 _ d; r8 s4 c+ z4 q( X9 \# t
21.黑氧化:Black Oxide Removal. b; i9 k/ e; V! x# ?7 y! l& [$ s
22.铣靶:spot face8 @) G5 Z4 p9 j
23.去溢胶:resin flush removal
5 n: s' k, P; P1 K+ i 24.减铜：Copper Reduction
; L% x( w( @ @) b9 d: H/ G 25.水平电镀：HorizontalElectrolytic Plating5 F1 o6 ?$ ]' K3 j. c2 G. `0 {) v
26.电镀：Panel plating( l1 o3 @) `, G/ u8 o; g. a
27.锡铅电镀:Tin-Lead Plating /Pattern Plating7 b& U- c+ ^6 W$ X+ y: B8 x
28.低于 1 mil: Less than 1 mil Thickness
; O3 n1 r. e8 N1 D8 ]( F$ U 29.高于 1 mil:More than 1 mil Thickness
; j# o2 b" t3 M5 _ 30.砂带研磨:Belt Sanding
m$ k$ N6 l5 K) a) G; C 31:剥锡铅:Tin-Lead Stripping# K' C$ D# J" m( d4 T
32.微切片: Microsection2 S( ?( e4 A/ x i( H
33.蚀铜:Etching
5 O1 B9 p6 `! i: w6 e5 Q0 V 34.初检:Touch-up. J0 R/ w/ J6 b) B$ J2 S/ f6 }
35.塞孔：Plug Hole, v3 |* z7 C6 H) ]6 V4 f+ m
36.防焊(绿漆/绿油)：SolderMask
& R7 `* {# J1 {/ d 37.C面印刷rinting Top Side
5 d+ C2 i2 ], |/ t( s 38.S面印刷rinting Bottom Side; e8 B& c; o6 M9 B% t+ I
39.静电喷涂:Spray Coating
6 t. E2 [8 [8 G* R) B: b- K 40.前处理retreatment. P) t5 `2 k" b( b$ S; ~# M
41.预烤recure
) ^3 H Q8 R' @" g 42.后烘烤ostcure- J- G* I7 b: Q; `' i0 R- b" T
43.印刷:Ink Print" [" r) K, O: }8 e( v% `- k) J
44.表面刷磨:Scrub# g# ]1 Q* H1 c ]9 f% c+ _! n
45.后烘烤ostcure
6 @2 t+ l/ }1 X D3 f& l! ^ 46.UV烘烤:UV Cure ~" \1 ]" |1 O1 q# |4 l* ?% S
47.文字印刷rinting of Legend; S& M4 Y- k, `# E4 S
48.喷砂umice/Wet Blasting& ^+ t, e; S4 p; B2 p
49.印可剥离防焊/蓝胶eelable Solder Mask)7 Z$ m( x- O7 i: ^! R+ Y) ?' H& e1 K
50.化学前处理,化学研磨：Chemical Milling/ S/ F" ^. D9 G9 L2 P b
51.选择性浸金压膜：Selective Gold Dry Film Lamination2 g9 Q; O2 a- S" H
52.镀金：Gold plating
4 E7 _ T. g( i/ j 53.喷锡：Hot Air SolderLeveling
/ U7 q: n% l- U! `1 N4 W% J 54.成型：Profile/Form
3 }# Q' ^# C5 i: P8 Z( M 55.开短路测试：Electrical Testing
" M: l) U3 u" J. D 56.终检：Final VisualInspection
2 W# W f) D8 c% I% A! g 57.金手指镀镍金：Gold Finger: [4 X8 P: Q; J) j& P% p
58.电镀软金：Soft Ni/Au Plating
9 J7 D% x. f/ C! v# X; E9 e 59.浸镍金：Immersion Ni/Au / Electroless Ni/Au
5 E- \ Q: x" n' x Q( v& E4 f! s 60.喷锡:Hot Air Solder Leveling( ]! d* ^: G- P
61.水平喷锡:HorizontalHot Air Solder Leveling) b1 F* ?- n T" i) ?5 q; ]
62.垂直喷锡: Vertical Hot Air Solder Leveling/ P- w" ~6 o% U m! o! g2 C
63.超级焊锡:Super Solder
0 \" s% ^4 h% O0 P7 Q+ h, l' w/ l 64.印焊锡突点:Solder Bump# m% M( A! Y* z( _& r# p" S, R# r2 T
65.数控铣/锣板：N/C Routing/Milling$ g: h! C: c3 r
66.模具冲/啤板：Punch) {0 C9 }7 |9 z* I
67.板面清洗烘烤：Cleaning & Backing
+ @7 [% w- Z; t. G/ ~. Q& m" h 68.V型槽/V-CUT： V-Cut/V-Scoring
! L- g" c, u$ D/ P8 u$ o 69.金手指斜边：Beveling of G/F
, i _1 c! _4 t) { 70.短断路测试Electrical Testing/Continuity & Insulation Testing
6 i) R' ]8 h- f2 r0 }/ X' z 71.AOI 光学检查：AOI Inspection$ P- n4 x6 `6 J6 X
72：VRS 目检：Verified & Repaired9 D: R* T. j# U+ N) w+ r
73.泛用型治具测试：Universal Tester$ M7 f8 `# v8 N) V3 ?1 A
74.专用治具测试：Dedicated Tester
. i0 w+ g4 p3 U9 t, A 75.飞针测试：Flying Probe3 j0 v2 _% x$ h5 `3 s2 J$ c1 i
76.终检：Final Visual Inspection |& j: ]; ?5 |4 y J: {' y
77.压板翘：Warpage Remove
7 H, S# V O o, _+ N% w! T# n 78.X-OUT 印刷：X-Out Marking' C6 z% }) u, s3 O# ^
79.包装及出货：Packing& shipping
5 z) Y3 n5 p6 V1 |4 { 80.清洗及烘烤： Final Clean & Baking
( L# n9 _( `( W, D, Y 81.铜面保护剂：ENTEK Cu-106A/OSP
0 L8 u+ W0 |, d3 A. t o" C# N% m: }$ g 82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test
! `1 R5 O# O" e/ l/ l 83.冷热冲击试验:Thermal cycling Testing* C+ g, X7 s# b
84.焊锡性试验:Solderability Testing# k7 R% q0 ^- m" c( u3 x
85.雷射钻孔aser Ablation6 [% B, Z- T8 }# n4 P% _0 y6 j
86.雷射钻Tooling孔aser ablationTooling Hole! |/ l! l) K2 L4 f. z8 B' d! H
87.雷射曝光对位孔aser Ablation Registration Hole
4 |' f( \. |: k* w* \$ J) ^5 B, i. a 88.雷射Mask制作aser Mask3 e! b1 Q+ K' m \1 w% @
89.雷射钻孔aser Ablation- H' v; ^1 A1 ^8 U1 x8 l
90.AOI检查及VRS:AOI Inspection & Verified & Repaired* t1 p( s3 g; d6 h3 [
91.除胶渣esmear1 l8 A7 n$ k) _0 R7 m
92.专用治具测试edicated Tester
4 p6 P' t/ u% f6 E0 b9 g* b 93.飞针测试:Flying Probe1 `/ I* S' H0 n7 h* ]8 w& Q
94.压板翘: Warpage Remove- h& y- |4 u, i/ }* A( k/ H. [
95.底片：Ablation: J# R' ]! [( K6 b; @1 s/ [
96.烧溶：laser)( Y' v" ]2 i ^$ |) W. q1 J
97.切/磨：abrade( |- f7 P9 t( J t
98.粗化：abrasion. J. N8 N7 ]6 Q! R' I
99.耐磨性：absorption resistance' S9 d3 p( s f; c
100.允收:ACC /accept5 ~6 L" e9 E) S2 Z
101.加速腐蚀:accelerated corrosion test
; ]; F% g' C6 C" O) X 102加速试验:accelerated test
) n" O" m$ T9 [. g 103.速化反应:acceleration
! t4 h) `6 Z$ e! K: U; j) p- H6 e 104.加速剂:accelerator
5 U2 b6 b4 n. S3 f, b1 R/ g" | 105.允许：acceptable7 W6 R9 ]! _* @+ }! |( O
106.活化液：activator
; t! z, n: d5 j" z8 T 107.实际在制品：active work in process# K& _% ]2 f$ C& M- i
108.附着力：adhesion
+ A0 _' U: f; T: v; R& E( N 109.黏着法：adhesive method& M: P6 e" P; M8 e: L
110.气泡:air inclusion+ U- l% p+ t/ y' m( X7 x8 S4 z3 [
111.风刀：air knife
" p9 _ b, K- h) G* h# @2 w 112.不定形的改变：amorphous change. {1 p4 j) v: z8 `
113.总量：amount
+ P7 q. ^1 e) B+ | 114.硝基戊烷：amylnitrite
% D! }' ?, ^) q/ Q/ K5 N 115.分析仪：analyzer
. z1 R0 E$ ]- }7 n 116环状垫圈;孔环annular ring2 `' n9 [3 L0 M. l/ U
117.阳极泥：anodeslime (sludge)/ T2 P9 R; z! H3 N& @
118.阳极清洗：anodizing
9 J0 `; x( Z d) p% y 119.自动光学检测：AOI/automatic optical inspection
: m$ M$ {' s" i. j+ {9 D9 E9 l' B 120.引用之文件：applicable documents
4 M$ i" v3 p' Q$ a0 m 121.允收水平抽样：AQL sampling7 d( E3 Y/ k% a" J' \) I
122.液态光阻：aqueous photoresist
' o1 g+ O7 P/ [1 H2 `% g 123.纵横比(厚宽比)：aspect ratioAs received
9 N' [. Z8 t y' S 124.背光：back lighting [! d2 ]3 m) P$ s
125.垫板：back-up0 O3 ]/ u) g9 P
126.预留在制品：banked work in process# E3 N( F, z! }: Y0 _
127.基材：base material
7 B/ }0 L- Q, W4 @8 Q8 J 128.基准绩效：baseline peRFormance. K' O+ b4 |" J6 u* z9 Q8 u
129.批：batch3 j2 b# {5 R" ^) m
130.贝他射线照射法：beta backscattering
; X# |5 z! F# d/ _ 131.切斜边;斜边：beveling' n W+ k! c4 ]" z% @, ]; c
132.二方向之变形:biaxial deformation
; y( A/ R- y8 |5 t" m 133.黑化：black-oxide
0 ?8 G& ?; H# x9 `+ X 134.空板：blank panel" \$ @1 l1 `6 x6 V
135.挖空:blanking: Z, ~% t- v* B* f$ t6 N/ u
136.弹开:blip: M; i% j( |! R9 z
137.气泡:blister blistering3 c/ e5 {$ s$ N' [$ C; z0 z) p
138.吹孔:blow hole L f/ _4 D/ }4 y8 S' m( B' ]
139.板厚错误:board-thickness error: _) o% b( i4 N- i# @
140.黏结层:bonding plies5 ]& m9 }2 Y+ f" k
141.板弯:bow ; bowing
) X4 k6 H1 Q0 L; t1 k. i4 A D6 P5 i6 T 142.破空:break out% y: c6 z( R( V& j# H; q& |) z
143.搭桥;桥接：bridging- `- V% s, T7 Q4 y
144.接单生产：BTO (Build To Order)
~: p9 c% N x8 j4 E2 ` 145,.烧焦：burning
$ [* |& Y9 l$ _/ ^ 146.毛边(毛头)：burr3 M4 o6 F0 u. \1 Y, F
147.碳化物：carbide
8 |+ D7 I0 B5 W: D5 c 148.定位梢：carlson pin) M7 i1 H" J( |1 r8 e+ K
149.载运剂：carrier. G3 |! m4 Z9 r8 \7 a
150.催化：catalyzing2 V# e+ R+ X% J" E4 p/ t' R" N
151.阴极溅射法：catholicsputtering
% I: ^0 G7 u. } 152.隔板;钢板：caul plate
$ T& \) G& j2 G" R( { 153.校验系统之各种要求：calibration system requirements
W+ T: ~) [2 \7 x# b. ? x# q 154.中心光束法：center beam method+ i' c) ^ _# B( ?9 w0 ?0 G2 G
155.集中式投射线：central projection, H p- ^4 D% W' I
156.认证：certification
6 i# l' L$ c) H2 V. a, N 157.倒角 (金手指)：chamfer chamfer; o) |4 c0 Z9 O
158.切斜边;倒角：chamfering
7 L% n! \4 g- W' @ 159.特性阻抗：characteristic impedance; r& G& a \( R: H
160.电量传递过电压：charge transfer overpotential! }! m/ G/ B) j# C ~3 B
161.网框：chase. L+ e2 R$ t1 D8 O' B" k
162.棋盘：checkboard h6 f0 n# w" i# c) {2 |. ]& f5 H! R
163.蟹和剂：chelator# W! `0 D6 P! W: y
164.化学键：chemical bond
8 K; I* [9 X, N/ C; W) N 165.化学蒸着镀：chemical vapor deposition
8 J- p# t6 U) x; B; s# l 166.圆周性之孔破：circumferential void
% |$ D1 i3 B' h3 O# m 167.包夹金属：clad metal
6 j" f4 d& j9 S; ]& z 168.无尘室：clean room
; ?8 @6 _* e. T+ [; h# O+ T 169.间隙：clearance
0 ]0 Y. R6 |. V: h( ~ 170.表面处理：Coating/Surface Finish |
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发表于 2020-8-13 13:30
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