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1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil
/ K$ [& g1 E, f% W2)END LAYER与BEGIN LAYER一样设置
: |7 x- g& Y; g& S& e2)DEFAULT INTERNAL尺寸如下& [: M' u$ ]( I6 u4 K. j
其中尺寸如下:' P1 u" G% b' J; D
DRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL ! j6 Z% `- S$ E l8 k! X- }+ o8 w
Regular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil) $ Y+ D: K; w1 E7 s% _. f: p6 h. Z
Regular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)
, s5 x4 A+ ?5 j8 c4 _Thermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍)
$ A/ E! p1 P7 ~# Z5 RAnti Pad = DRILL_SIZE + 0.76mm /30MIL 8 S! R$ }' w+ F5 p$ M8 e2 I& L
SOLDERMASK = Regular_Pad + 0.15mm /6MIL + O9 e/ E! `+ F
PASTEMASK = Regular Pad (可以不要)- Y% c" a) i8 o0 z. Y& F
•Flash Name: TRaXbXc-d ) W9 f6 m, s- F* q7 l: P* O* a
其中:
8 V3 u; H5 T( P8 w% i1 @* Ea. Inner Diameter: Drill Size + 0.5mm/16MIL* x, v! D t+ |& b
b. Outer Diameter: Drill Size + 0.76mm/30MIL
; d5 m; ?0 {. X* W# ^* a) zc. spokes:
$ t1 v3 ?! T( w7 B& a$ c- ~0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
: I4 E3 \1 s j {0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)
! Z7 v/ K3 w) U. m7 j3 H7 l0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm): [* k4 \ Z2 O' h& ?
0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm)
! t2 d# _# D1 X/ x/ M5 _ 1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上), w% B; Y* E- N3 E& c
也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。
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