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1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil& N9 ^3 `/ Q8 P6 G# f
2)END LAYER与BEGIN LAYER一样设置
; a! v- j0 ^4 d; H: t$ U8 G/ ^2 X* E2)DEFAULT INTERNAL尺寸如下
" t7 v+ Q1 `- @2 I其中尺寸如下:
& Q( g6 `2 Y6 g/ ^* E& PDRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL
3 [* v! W, o" Q+ J1 ?Regular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil)
. U2 ]; G. j7 yRegular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)
/ ~, } }/ q. Y4 d& P8 vThermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍)
- I, H; F9 I8 YAnti Pad = DRILL_SIZE + 0.76mm /30MIL
' \5 Z: K* L, lSOLDERMASK = Regular_Pad + 0.15mm /6MIL 4 {2 r& c- D. t
PASTEMASK = Regular Pad (可以不要)
0 j* O' u+ m( ~3 _# O, G( r•Flash Name: TRaXbXc-d 3 o& W, J! m. i2 U
其中:, o- x; r x6 j# g" T- p
a. Inner Diameter: Drill Size + 0.5mm/16MIL
6 H7 {* ^6 r) Q8 x" b$ ^b. Outer Diameter: Drill Size + 0.76mm/30MIL
5 r4 B# f5 o) Z7 Qc. spokes:
1 T4 @9 B: q& A- A! ?9 d' U0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
q: l/ e: y& p0 r/ K# P }0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)
) F: S* c0 ]( T1 X1 R/ n0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm)
* L0 d! Y) l4 e4 F$ G3 ]' M0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm)9 ?& M* E: s f
1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上)8 ^" X2 e6 `: R
也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。" k& `- R& b# k! j" h
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