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本帖最后由 leleeda 于 2020-5-27 17:03 编辑 6 X8 O3 A6 n8 w6 b/ l
% g% D M: [' k7 n[AD15][2层]NE5532芯片的自制LM1875功放板的 PCB 源文件分享: X, q3 ^: k$ }; l I* L/ z
文件描述:# _" c) r$ V5 T) Y+ E% o
" s7 q- ?/ F! O6 Z) `/ h2 F1. 软件版本:AD15
t* O# ~; r% y2 q y9 j8 V2. 层数:2层2 s. u5 u# t# a" r: H; Z* X! X
3. 用到的主要芯片:NE55322 S* W, {8 ]8 k# N3 S$ _6 [
4. pcb尺寸:100*150 MM
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作品截图如下:
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% |* ?$ h. O. N B- z! o顶层截图:1 U* s6 p/ d. l4 q* h8 j! ~
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. E/ w1 p1 E% y1 v3 S底层截图:. @" o, O% D1 v( A
" r! r, J! i$ S T6 l7 g全层截图:
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/ j; s6 g- ~0 T! Y6 S1 F叠层阻抗信息如下:
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BOM:
% O# |& o; U- _; k5 a2 ]# k. MComment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | AC | AC | RAD3_16/30MM | 1 | BRIDGE2 | BR | BRIDGE2 | 1 | 220P | C1, C6, Ca1, Ca6 | C0603 | 4 | 2200 | C2, Ca2 | C0603 | 2 | 47000P | C3, C4, Ca3, Ca4 | C0603 | 4 | 1U | C5, Ca5 | RAD5x7.5 | 2 | 0.1u | C7, Ca7 | RAD5x7.5 | 2 | CE+ | C9, C21 | CE35X20 | 2 | 4.7UF/50V | C11, C12, C23, C24 | C+_6*6mm | 4 | 104/50V | C13, C14, C17, C18, C19, C20, C25, C26 | C0603 | 8 | 104/50V | C15, C16 | RAD5x7.5 | 2 | MMSZ15T1G | DZ1, DZ2 | SOD-324 | 2 | Phone-3.5MM | JP1 | Phone-3.5MM | 1 | BLUE | LED | LED-2.54MM | 1 | LM1875 | LM1875A, LM1875B | LM1875T | 2 | SPEAKER | LSA1, LSB1 | RAD5x7.5 | 2 | 1k | R1, R4, R10, R11, R13, Ra1, Ra4, Ra10, Ra11, Ra13 | R0603 | 10 | 47k | R2, Ra2 | R0603 | 2 | 100k | R3, Ra3 | R0603 | 2 | 1.8K | R5, R6, Ra5, Ra6 | R0603 | 4 | 10K | R7, R12, R15, Ra7, Ra12, Ra15 | R0603 | 6 | 8.2k | R8, R9, Ra8, Ra9 | R0603 | 4 | 33K | R14, Ra14 | R0603 | 2 | 10 | R16, Ra16 | R0603 | 2 | 220 | R17, Ra17 | R0603 | 2 | 0.33/0.22w | R18, Ra18 | AXIAL1.2-10/30MM | 2 | 330R/1W | R19, Ra19 | AXIAL1.0-4/15MM | 2 | 0R | R20, R21, R22, R23, Ra20, Ra21, Ra22, Ra23 | R0603 | 8 | 5.1K | R25 | R0603 | 1 | Phone-3.5MM | RCA1, RCA2, RCA3 | RCA-2 | 3 | NE5532 | U1, U2 | SOP8 | 2 | SW-2P-6 | U4 | SW-2P-6 | 1 | 50K | V1, V2, V3 | VR-SL6 | 3 |
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附件:4 O J( W1 U. R
PCB源文件如下:
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( P' o3 y7 i, s7 I实物图如下:
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