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本帖最后由 stupid 于 2010-6-30 14:56 编辑
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Chip-Level Design
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Creating C++ IP for High Performance Hardware Implementations of FFTs, H9 L- ~; E G( V# t
' J1 Z, H2 v0 [' kStrong Encryption and Correct Design Are Not Enough: Protecting Your Secure System from Side Channel Attacks" t0 P' ^# O, N# F4 m4 D
- p: z8 m6 z$ W! yBoard and System Design8 c$ Z' f2 l6 ^9 @
. v: S3 G- a! l9 h8 I, jEffect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High Frequency Transmission Lines
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) i$ N* \, {6 d7 p8 M2 f# M( I6 ?Introduction and Comparison of an Alternate Methodology for Measuring Loss Tangent of PCB Laminates% Q/ z& ~7 Y6 E& k P. R! ~) b
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Interconnect Design! {( p: X3 a" z. D: c, o
, j7 v! U$ W) B! qFrequency Dependent Material Properties: So What?: a. O1 e0 ^& W% v7 n; J' G
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Additional Trace Losses due to Glass-Weave Periodic Loading
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3 ?. u' L* O: r$ c) \High-Speed Design and Test Category5 R/ `. f9 V R) j
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A New Method for Receiver Tolerance Testing Using Crest Factor Emulation
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{/ ] j$ z5 o+ nAccuracy Improvements of PDN Impedance Measurements in the Low to Middle Frequency Range& s; B# P8 a/ m6 @% @: |1 t1 R- g, I
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Power and RF Design Category
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: D9 L1 H& V4 M+ y/ V5 HOn-Chip PDN Noise Characterization and Modeling
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/ h4 ]6 s2 U. o8 Q3 ]4 c& W) mFast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis |
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