[AD 16][4层]STM32F407ZET6+IS62WV51216+CC1310_PCB源文件

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作品名：[AD 16][4层]STM32F407ZET6+IS62WV51216+CC1310_PCB源文件

9 h! s9 m: b0 i6 z4 z文件描述

1. 作品用途：STM32F407ZET6+IS62WV51216+CC1310_PCB源文件

2. 软件版本：AD 16

$ I  r! e8 d7 c+ E& D& d3. 层数：4层板
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7 S: i$ _1 |$ P4. 用到的主要芯片：STM32F407ZET6+IS62WV51216+CC1310

5. PCB尺寸：91mm*60mm

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作品截图如下：

顶层截图：

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底层截图：
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全层截图：


叠层信息截图如下：


BOM：

Comment（属性）	Designator（位号）	Footprint（封装）	Quantity（数量）
7n5	B1, L2, L6	Ind_SMD_0603	3
BATT	BAT	BATM	1
22uF	C1	CAP_SMD_0603	1
105	C2	CAP_SMD_0603	1
12pF	C3, C4	CAP_SMD_0603	2
100pF	C5, C7	CAP_SMD_0603	2
3p6	C6, C9	CAP_SMD_0603	2
3pF	C8, C12, C13	CAP_SMD_0603	3
2p7	C10	CAP_SMD_0603	1
6p2	C11	CAP_SMD_0603	1
104	C14, C15, C17, C18	CAP_SMD_0603	4
106	C16, C19	CAP_SMD_0603	2
10pF	C20, C21, C29, C30	CAP_SMD_0603	4
100nF	C22, C23, C24, C33, C34, C35, C39, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C51	CAP_SMD_0603	19
22nF	C25	CAP_SMD_0603	1
10uF	C26	CAP_SMD_0805	1
22uF	C27	CAP_SMD_0805	1
22pF	C28, C31, C32	CAP_SMD_0603	3
2.2uF	C36, C37	CAP_SMD_0603	2
Header 5	CC_JTAG	HDR1X5(SMD_2.54)	1
LED0	D1, D2	DIO_SMD_0603	2
1N4148	D3, D4	DIO_SOD_323	2
Header 2	KEY	HDR1X2(XH_2.54)	1
6u8H	L1	IND_SMD_3012s	1
27nH	L3	Ind_SMD_0603	1
6n8	L4, L5	Ind_SMD_0603	2
2.2uH	L7	IND_SMD_3012s	1
3.5寸_40PIN	LCD1	3.5_TFT_40PIN_0_5MM	1
Buzzer	LS1	BUZZER_SMD	1
COAX-M	P1	IPEX	1
Header 6*1	P2	HDR1X6(SMD_2.54)	1
MOSFET-N	Q1, Q2	SOT_23(SOT_23_3)	2
1k	R1, R7, R11, R12, R14	Res_SMD_0603	5
56k	R2, R3, R4	Res_SMD_0603	3
100K	R5, R8, R9, R13	RES_SMD_0603	4
453k	R6	RES_SMD_0603	1
10K	R10	Res_SMD_0603	1
SW-PB	S1	SW_3*4*2mm	1
cc1310_qfn32	U1	QFN32	1
IS62WV51216	U2	TSOP44	1
W25Q256	U3	WSON-8	1
URAT_WIFI_IPEX	U4	URAT_WIFI_IPEX	1
MT2492	U5	LC-SOT-23-6	1
STM32F407ZET6	U6	LQFP144	1
Header 7	USB&USART2, USRAT1&SW	HDR1X6(SMD_1.25)	2
Header 2	VIN1	HDR1X2(SH_SMD_2.54)	1
32K	X1	CY_MC306	1
24M	X2	CY_SMD_3225_4P	1
XTAL_1	X3	CY_MC306	1
XTAL_2	X4	CY_SMD_3225_4P	1

附件：

1 [4 c- ^; @, V) w) x0 R/ IPCB源文件如下：

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