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各位大侠6 h ]0 E( Z( `
现在碰到一个问题# H. M8 O/ K# u5 ?% M: Q' V" z
就是ddr2内存接续的问题1 r% K/ ~0 U- \1 c7 d, s
现在系统cpu是三星的32位的s3c2450(ARM9核心),支持ddr,mobile ddr和ddr21 O( I9 r. z) s- }$ c
The S3C2450 Mobile DRAM Controller supports three kinds of memory inteRFace - (Mobile) SDRAM and mobile
* m( N3 `, V% z1 XDDR and DDR2. Mobile DRAM controller provides 2 chip select signals (2 memory banks), these are used for up! b2 z5 y# e8 Y
to 2 (mobile) SDRAM banks or 2 mobile DDR banks or 2 DDR2 banks. Mobile DRAM controller can’t support 3
- l- O* L2 f: U6 |3 A% B7 okinds of memory interface simultaneous, for example one bank for (mobile) SDRAM and one bank for mobile. m, z5 g ^( x3 X
DDR.3 |3 g3 v# X1 V: J- B' w' S% I
DDR2 Features1 M! I6 W% k- W
− Support DDR2 having 4-bank architecture, don’t support 8-bank architecture.4 r% V+ j5 |% Y
− Support 16-bit external data bus interface' J v, G2 ^8 \& \/ c
− Support AL(Additive Latency) 0, don’t support posted CAS, it needs EMRS setting.
8 E) m8 e5 h4 \1 F3 k. o− Don’t support ODT and nDQS function, it needs EMRS setting.: u( Z1 a* W. B7 |0 w
− All other features are same to the features of SDR/mDDR0 K' u2 q( W1 y' E1 \
2 `6 z3 m2 x3 b( A$ v" `- n5 F, v
但是我看他们接续的时候
0 m# ?+ c& }6 n7 O* G接续了两个ddr2 (32M*16),而内存上只有十六位数据线7 n1 `% g) b: I) |
于是他们就将两个内存芯片的数据线分为高十六位和低十六位
" G7 A5 g& R5 x1 l7 P) e2 S
h+ e9 X( y7 Z/ W. g我的问题就是% Y H# q2 F" Q4 Q; A
1,要是接两个内存芯片的话必须这么接么?这么接有什么好处?
0 G% m8 j, ]; l" p/ K2,要是接两个芯片的话可不可以将两个芯片的数据线都接续到一起?
* L, c, K2 ^3 {& d7 M7 B7 e& X3,我现在是用了两个ddr2 (32M*16),但是我要是用一个ddr2 (64M*16)的话这两种方式谁更快一点,原因?
$ n2 j6 B8 X+ w1 r3 Z! \8 l4,现在内存标称频率还有待于选择,比如说我现在可以用ddr2 667的内存,也可以用ddr2 533的内存,要是都工作在533MHz的话
I, L: C7 q1 A9 b" y7 _ ddr2 667的电磁干扰(EMI)会不会更大一点啊? |
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