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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
+ P# c- ]$ A4 E6 r; F3 f GRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when
! z, D6 ]* s0 T4 x! Y" v5 zelectrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.
) o3 t! ~; y% o1 k9 @; u; {The dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen6 m- o9 B; q. q5 {& y3 O8 B. Y: O- x2 G. w* Y
when electrical properties are less critical. |
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