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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
5 f% ?8 V5 d: h4 {7 }/ XRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when- l+ V' k5 m2 j* i
electrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.6 Y' R: r* u+ `6 g: b
The dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen. X$ E- A1 M5 y: @3 V
when electrical properties are less critical. |
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