|
Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding- H4 o) ?0 ~7 Q- G) _' K( |
RT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when& W7 }* z3 l0 @0 {
electrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.
3 k5 \ w5 c* b) C. B b6 q" QThe dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen
2 _+ X0 g) h& q5 T1 Q4 N( }8 |2 G, Qwhen electrical properties are less critical. |
|