Via Current Carrying Capacity?

karpcb15

Hi all,
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# O$ s) P# [/ o0 x+ J% hI am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried  core Via (L2-L3)
Blind via size 60 um drill / 100um pad , Via length 40um
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Buried Core via size 100um drill / 200um pad , via length 150um
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0 C& w$ n2 p" H' N& cAnyone knows the Current carrying capacity of above mentioned blind and buried core via ?

What is the general Via wall thickness in substrate?
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EDNA

自己计算下，这种激光孔，是实心铜。

karpcb15

EDNA 发表于 2019-1-14 10:01
  H7 F5 g+ x- U2 w! j( W自己计算下，这种激光孔，是实心铜。

. \( _$ G- m7 l* Z6 ~* n2 p- g, _如果通过填充铜，我可以知道通孔电流密度
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tencome

直接按照圆柱体的实体铜计算过电流能力就行了。　　

gochip

怎么算