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Hi all,
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7 A# y4 T% w2 u! Y* Y uI am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried core Via (L2-L3), h& G& ^5 d5 ?
Blind via size 60 um drill / 100um pad , Via length 40um
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9 J5 l, u& W) _" `Buried Core via size 100um drill / 200um pad , via length 150um- t, v: S" [( w
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Anyone knows the Current carrying capacity of above mentioned blind and buried core via ?$ K) x' ~7 z' I3 Y* J
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What is the general Via wall thickness in substrate?8 l1 P- \& h! W" o y/ H
. ~4 j I. ?( g q; W& pThanks in Advance
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发表于 2019-1-10 21:53
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支持！
反对！
楼主