Via Current Carrying Capacity?

karpcb15

Hi all,

I am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried  core Via (L2-L3)
Blind via size 60 um drill / 100um pad , Via length 40um
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- g2 `  N, Y- L& o' g( b5 s$ OBuried Core via size 100um drill / 200um pad , via length 150um

5 `# |% z  \5 Y; l+ g" G5 G! mAnyone knows the Current carrying capacity of above mentioned blind and buried core via ?
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' x+ U8 t7 d% |7 W% dWhat is the general Via wall thickness in substrate?

Thanks in Advance
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EDNA

自己计算下，这种激光孔，是实心铜。

karpcb15

EDNA 发表于 2019-1-14 10:01
. [+ i1 f0 b# ?! B- X' {6 k自己计算下，这种激光孔，是实心铜。

* |! z+ ]9 |' k3 S- t" y+ M; z如果通过填充铜，我可以知道通孔电流密度

tencome

直接按照圆柱体的实体铜计算过电流能力就行了。　　

gochip

怎么算