Mechanical via split into Stacked via?

karpcb15

We proposed the stcakup to manufacturer is  4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 , mechanical via from layer 1 to 4.

but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias My Question is why manufacturer changed mechanical via to stacked via? cost also increased increase while using stacked vias?

7 A$ ], u0 ^* F! V! U
$ S, B! l6 ^0 I) m% N



9 n1 p' ^& v1 ^, B/ k' W9 l

gavinjzz

各位都是外国人么，装逼都说英语

karpcb15

oh..

tencome

那是因为钻孔时，孔尺寸小于100um时，必须使用激光钻孔。
9 j) G  ?# {7 L' S而激光钻孔时，不能钻太厚的板子。    所以要分开钻。

  [) @! H% n  [: B" h钻孔尺寸大于等于100um时，就是用机械钻孔，就是一次性从第1层钻到第4层。

karpcb15

谢谢

kkk228

谢谢楼主