PDS

Iric071

PCB Stackup and Layer Order中:
Power supplies with high transient current should have their associated VCC planes close to the
; {: n! y7 _7 A, i; Xtop suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction
) i  o* ^8 ~9 Rthat currents travel through VCC and GND vias before reaching the associated VCC and GND
planes. As mentioned in the previous section, every VCC plane should have a GND plane
7 X4 Z2 O  Y9 @; y5 p6 V: Eadjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the
9 o3 p7 j" E. Bmajority of the current complementary to that in the VCC plane. For this reason, adjacent VCC
and GND planes are considered as a pair.
( @3 }; x; a$ M; m" W) U8 ]. N$ a這裡面,說的VCC,GND層到底所何放置?
- W0 x# [5 }' d- {& p謝謝!