|
|
EDA365欢迎您登录！
您需要 登录 才可以下载或查看，没有帐号？注册
x
PCB Stackup and Layer Order中:
5 x( A# w% ^) X) d4 X/ u0 mPower supplies with high transient current should have their associated VCC planes close to the1 `8 n% `$ c2 s% o3 I/ v
top suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction$ @ B: K: K. }8 {$ I
that currents travel through VCC and GND vias before reaching the associated VCC and GND4 \; g* W/ x( F2 y9 N# V: w" j
planes. As mentioned in the previous section, every VCC plane should have a GND plane0 T6 h) S6 u! C v; N* ~ e
adjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents- f3 g2 ]6 _' h
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the8 Q0 X) S: m/ X: _, q8 {
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC" ]; D) z6 l- {8 M1 M, B8 i
and GND planes are considered as a pair.1 M; g: \/ v% i1 N+ V
這裡面,說的VCC,GND層到底所何放置?
. }( b- `" `7 ?2 m/ a謝謝! |
|
/1 
发表于 2007-12-28 17:23
收藏
淘帖
支持！
反对！