Fujikura Develops World’s Thinnest Substrate with Embedded Components

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Fujikura is pleased to announce that it has developed the world's thinnest substrate with embedded active and passive components. Demand for thinner and high density electronic devices is constantly increasing. In response to such requirements, Fujikura has been developing an advanced range of products-from multilayer Flexible Printed Circuit (FPC) boards to Wafer And Board level device Embedded Packages (WABE Package®) that utilize Wafer-Level Packaging (WLP) technology. Now, Fujikura has enlarged this WABE technology to embed not only active components, but also passive components, such as LCR, in a single embedded substrate. The standard profile is a 260μm board comprising five FPC layers and can be available to embed both active components by WLP technology and 0603/1005 sized passive components with a profile as thin as 0.15 mm. Connecting active and passive components in a single substrate enables a reduction of implementation space and offers good noise reduction and high frequency characteristics. Further, the fully FPC structure has realized a significant reduction in board profile. Fujikura will offer this embedded substrate both as a wiring board for use inside mobile electronic equipment, and as a module substrate, with applications such as semiconductor package, sensor modules, and high frequency modules.

Features of WABE Package With both Active and Passive Components

Ultra low profi le due to all polyimide fi lm layers High-reliability via hole structure fi lled with conductive paste High density wiring is possible by using Interstitial Via Holes (IVHs) Low cost production by co-lamination process + A7 R' n2 [: B/ K% u6 m1 F

Cross Section View of WABE package with Active and Passive Component (Top: Schematic Structure; Bottom: Photograph)

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denny_9

直接在基板上把芯片做出来，就剩很多事了。