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$ D' z% j: Z* u! O) F8 k5 i8 w DRC - (Final DRC)
, v. q7 c; J$ D' j" t4 C$ V -----------------/ |) R( S6 Q4 ]+ U3 Y8 p9 N
! G5 Q3 S% a( Z6 w9 c 04:46 PM Thursday, April 16, 2015' ]: f2 _2 F, e! {+ d
Job Name: E:\WorkSpace\Doppler\Hardware\DS120\PCB\Board1.pcb
* `, g" S1 v7 q( u( V/ O3 J( n9 c/ Y! y
/ A( W. {/ u! M, l" G0 F
---------" M8 {4 H( Y6 G* x9 t
PROXIMITY% R5 O4 B# Q! `" ]- ~6 e
---------- X0 @$ u, v1 {3 x
7 S3 x4 {1 X' J5 }& U# Z$ f Use DRC Window : NO
@& f2 H1 y- [7 h2 {6 C0 w2 f# E6 x3 X! B& N4 v0 ^& c# m3 ^
5 c- Z5 _" J3 G9 _# n Disable Same Cell Pad-Pad Checks : NO7 P9 h) K" G6 Z) b, B! G
+ ^- N6 Q5 Z8 d( @# R4 e
8 K% p2 V/ o3 w3 Q* x+ t( w Enable Same Net Pad-Pad Checks : NO7 S/ P9 M3 [2 v8 D( w
: [% l# w1 Q2 f' e9 ^9 X- e
$ ^ K4 p( d. w* |0 H; U Layers Specifed To Check : Layer 1- v% V. l6 m9 d) ?9 S0 \5 G( [- Q, I
Layer 2
& N- j4 h8 ? V E3 s1 ] Layer 3, A1 `6 `5 [; K- J/ |1 \% s* o
Layer 4# j( A/ \ b& |+ p% f
; F7 [' p# |5 g! l( D
: C+ i2 O- }5 p: z* I8 [
- t% ^' _" ?1 [# X; H; R! q, E' N& v7 P+ m# }# U" \0 z& L
Net Class Clearances And Rules
1 [4 h+ i5 J9 Y, }3 i4 @ ------------------------------
, @) Q; v7 X7 ]4 c! K! P! p2 A
0 w% ^+ M) T" n/ R; E2 j Components Layer 1 TO Components Layer 1
: P- @) w$ y$ m7 c8 R8 Q No Hazards.
& s& h7 Z1 e" S S, P
/ c5 s% V: o7 x1 h Traces Layer 1 TO Traces Layer 1
1 X* r. d& h- r% \" F3 L7 H* p No Hazards.0 @' l) W) i" C4 P( n
$ H) y3 j) {" h$ E7 L# I! ] Traces Layer 1 TO Part pads SMD Layer 1
4 t2 h8 A2 |4 p No Hazards.
! a" Q& v$ ^* S8 E( n% Z- N* x2 F: B. F
Traces Layer 1 TO Part Pads Thru Layer 1
! x V l' N9 ^0 X3 I" l No Hazards.
4 P8 M, a, _- g& s5 z" Z6 F
7 |$ `# o7 K3 P$ ]" M Traces Layer 1 TO Part Holes Layer 16 ?5 X: h9 h/ B' [% v- o
No Hazards.
: [8 p; p! v9 G8 v( G8 }2 y
, B/ G$ J5 e* y0 T; Y Traces Layer 1 TO Via Pads Layer 1 e# I3 `5 \, g$ Y9 S2 U( a/ f% n9 c
No Hazards.* A! }: I* W2 Z4 G. ?$ G
! y$ Q+ j$ _% u& c$ ^% ^- S Traces Layer 1 TO Via Holes Layer 1
( }) r5 e( \: a) R$ v; P# x' S No Hazards.
1 }' ~$ [4 G6 i. _9 @5 B& K& f
1 Z/ X9 F; Y2 p! j: J Part Pads SMD Layer 1 TO Part Pads SMD Layer 1! @. q5 B: t9 p2 ^* ]
No Hazards.* W- Q+ J7 y! z& J; A; u
1 B1 L, S; a) f. w
Part Pads SMD Layer 1 TO Part Pads Thru Layer 1- O, G) V+ u! `% @* E0 O& Q
No Hazards.
0 Z# c; z% I& t+ Y6 [; B. |' w: w4 V4 K+ r/ x/ l( ?+ I
Part Pads SMD Layer 1 TO Part Holes Layer 1
8 r2 j4 T6 C8 _2 X No Hazards.- R% _! e }1 J( f$ B
/ G h8 B/ j0 p* S
Part Pads SMD Layer 1 TO Via Pads Layer 19 {$ x7 ?: w& \# v. l0 w% d
No Hazards.
0 q/ e' c# u$ E( A& X, b/ p2 }# m
$ B4 X! d9 ^$ s4 u1 d Part Pads SMD Layer 1 TO Via Holes Layer 1: Z5 i. {4 A! V8 G4 F- B# e
No Hazards.. B6 } p, K! z# L6 {/ V
6 a* g% Y5 O( B; N
Part Pads Thru Layer 1 TO Part Pads Thru Layer 1
0 j4 Z- l6 p" \, H No Hazards.
6 p# K5 H* c w5 B0 `$ |4 [0 B3 c
8 d6 Z' h3 A/ _$ B0 k+ a0 ~) ^* f Part Pads Thru Layer 1 TO Part Holes Layer 17 L6 C7 R$ ~# x4 F6 X3 K
No Hazards.
& J( w+ H- C( g2 h
) Y, b1 V2 m: M) o& T( x% t Part Pads Thru Layer 1 TO Via Pads Layer 1# W, e% {& S3 ^4 ~6 D2 \# o5 T7 ]
No Hazards.
7 w1 Z" X0 k" N$ b. ]/ j; {' N" |5 ^; f4 F0 v) c
Part Pads Thru Layer 1 TO Via Holes Layer 1$ |. b2 Z2 ^- C8 j
No Hazards.7 d1 |" l7 Y. e. K) a
5 L# U6 L3 k8 C- t1 X- K
Part Holes Layer 1 TO Via Pads Layer 13 }( d6 J5 |$ N6 V. k( D4 b7 t
No Hazards.
# j: s! ~+ `# d5 t# P+ ~+ J1 w& T9 G/ A" }0 L
Part Holes Layer 1 TO Via Holes Layer 1
; w7 `/ H" \5 U& h/ t No Hazards.7 L/ ^" v }# U2 w2 ?
0 c% h+ ^) K. S
Via Pads Layer 1 TO Via Pads Layer 10 q! F6 W% x/ z6 a( g
No Hazards.
+ B6 g' V6 H2 y: Q
- E0 h1 v+ `4 ]/ L3 X Via Pads Layer 1 TO Via Holes Layer 1
$ @1 r5 ?# a. w N4 c9 Y% B No Hazards.
d5 S* ~5 F0 ^% H! U
/ U% E$ i5 b0 X1 e/ ^7 y Via Holes Layer 1 TO Via Holes Layer 1
. R/ q, C/ ~4 }! p6 B" T+ [. y No Hazards.8 E' Q& p9 t) d1 V
. q! j3 O T6 T# p% E
Part Pads Thru Layer 2 TO Part Pads Thru Layer 2
4 p& \2 t, T& q& b$ V( n No Hazards.. j* r% s9 }3 A: h9 d4 Y
2 E z5 I6 v1 Z. |( N. H1 a+ g2 p0 z Part Pads Thru Layer 2 TO Part Holes Layer 2
9 a3 _3 @4 t( M3 h+ _2 \ No Hazards.* {& T5 a& j: h- Z
# k$ p4 X$ S( n0 t
Part Pads Thru Layer 2 TO Via Pads Layer 24 P) \; B# V9 s/ ?( ^( r
No Hazards.+ K- {3 c M( Y" B W1 v0 J
7 r, c1 ^) o; F+ B* ] Part Pads Thru Layer 2 TO Via Holes Layer 2) Y; D. j( x; n+ F% {! ^
No Hazards.
5 }% a0 j+ I9 C, M* ~
( n2 j) a" m( d8 `9 q& ?& K% N Part Holes Layer 2 TO Via Pads Layer 2
' M4 l$ K3 W- n& i3 E* s o3 z No Hazards.
; s5 {* q- G `# U9 b3 S2 I& |& _
& s: m" @2 y. |4 T6 \( Z Part Holes Layer 2 TO Via Holes Layer 2- F) T7 q* b& w6 Y6 |
No Hazards.
- w7 |% P# V+ c0 b* v6 k8 L* E+ @1 B" w. f1 Y7 a) b0 N
Via Pads Layer 2 TO Via Pads Layer 2+ ^5 ]" H0 {: z/ J7 y) a
No Hazards.* `( S# h, Z2 H- t
( J W$ |4 r% T; \2 l: C Via Pads Layer 2 TO Via Holes Layer 2) o% k$ c2 L/ ]4 a+ q
No Hazards.; `7 r% S) G1 C8 s( g
8 H( P4 V3 M* B) h/ v
Via Holes Layer 2 TO Via Holes Layer 23 L) S7 s [# B7 ?& H, P
No Hazards.) E c6 V/ \7 ~- y5 `* P
2 r& u7 L# | v6 _0 x& X v/ _& @1 k Traces Layer 3 TO Traces Layer 3! [# O- G" f( I9 g% b, [% a
No Hazards.
% W9 n9 {* E8 R
( a: E( t7 w( ]' w- n. [ Traces Layer 3 TO Part Pads Thru Layer 3# h$ Q( _8 q# W0 h1 J
No Hazards.
4 E0 N% I G7 k* s
7 @, W2 A( X& P. W" q. T Traces Layer 3 TO Part Holes Layer 3
& H9 \+ G; J& l( i0 L5 W3 X) i No Hazards.
" \# q9 Y( J: c
9 K1 E5 c( I: G& p2 Z6 i4 v5 t9 j( B# q Traces Layer 3 TO Via Pads Layer 3
$ r; B2 @, d4 k& a No Hazards.
# m0 V/ [; ~7 u( ^8 n5 s9 B E! c C. N" F( ~9 ^/ l
Traces Layer 3 TO Via Holes Layer 3
1 z+ b/ w; t7 ]' y) O No Hazards.
2 @" `( t9 q) N" K( t0 l7 E d( T. Z
' L. n v9 k1 B; E/ ^ v9 r; u Part Pads Thru Layer 3 TO Part Pads Thru Layer 3# X! X- S0 }. t+ T: A
No Hazards.
7 y4 h/ N' D. u4 I! a$ `
3 Z+ S* W" w( f Part Pads Thru Layer 3 TO Part Holes Layer 32 u" R- N" l' h! A6 `3 s$ q
No Hazards.) c7 K$ F4 Z$ D0 c
S8 \; M/ K- u3 e A
Part Pads Thru Layer 3 TO Via Pads Layer 3
1 S0 Y' \5 @" B& L1 ? No Hazards. X& [1 u7 W9 `9 f7 `$ x* S: ?+ D
0 q! J: M& O' A/ f- f |5 f Part Pads Thru Layer 3 TO Via Holes Layer 3
) u( W" J, T# A No Hazards.& d" m" j3 Z+ f5 }
2 J9 z7 _. p# R; T( b Part Holes Layer 3 TO Via Pads Layer 34 X4 M) ^$ w9 \' n# D; j
No Hazards.: u) b8 N6 K4 ^- q
% e' s# o/ W2 o$ {" h& k Part Holes Layer 3 TO Via Holes Layer 3
; u5 H; M+ A' K+ g7 m No Hazards.% X" P- y( w ]3 h0 N; W' M- N
3 E- E7 S+ |6 @& \/ v
Via Pads Layer 3 TO Via Pads Layer 3( N& p- O% m) {' a5 h( t( T
No Hazards.
4 t# w6 J$ s; _8 K+ C) H. I3 @% J1 |* ?4 l1 W6 \& `0 K9 p8 j( X
Via Pads Layer 3 TO Via Holes Layer 38 ]) b$ d+ I. M# X2 c
No Hazards.
3 _4 M. e# M3 @( K }; e+ b" k. Y+ G" a& ~
Via Holes Layer 3 TO Via Holes Layer 3# i7 u7 j \2 G: _+ C) i7 ]1 q4 y U4 V4 k
No Hazards.% p3 j# k8 `, ^$ u' Q
1 P n Y0 j4 o) Q Components Layer 4 TO Components Layer 4
0 E; W0 j* I, w# w) q; C No Hazards.
5 ~9 i- H6 Z e% F/ U& ^: {1 q" @5 ?7 e3 i" C$ P6 s
Traces Layer 4 TO Traces Layer 4
* p$ s# n' X. w% D- a No Hazards.
/ y9 C) _7 |+ O; l
; X* r8 K7 |3 `6 p* i Traces Layer 4 TO Part Pads SMD Layer 46 C( {2 ^$ z+ R- M s4 _; v
No Hazards.
* {6 d: V4 B0 L( c4 q9 _
G' n7 P! U, A3 y# }2 H; b Traces Layer 4 TO Part Pads Thru Layer 4
7 r1 j+ Q" i* E6 J No Hazards.. E0 M6 H! |* k$ e
5 C4 E, M7 [+ J( i Traces Layer 4 TO Part Holes Layer 4. I, O: y% g$ N6 R+ w% L
No Hazards.
( g) J0 A! ^" h& ]; w) p/ h! E- y
Traces Layer 4 TO Via Pads Layer 4 g0 a) ?7 Z7 r( N) h
No Hazards.2 B9 ?9 P& f) l% l5 Y# j/ s
% h7 P! W. g- k5 {# \ Traces Layer 4 TO Via Holes Layer 46 E' Y4 @" ]5 ^+ ]( U
No Hazards.
0 M1 d0 y* Z& M) {6 y" _. Q) C( \: i) T0 J/ Y
Part Pads SMD Layer 4 TO Part Pads SMD Layer 4
& g6 v: |9 D7 z! `0 W6 I No Hazards.
# n! d( @* _7 O Y4 M z% J3 w" d' p: }- Q$ D3 i9 s
Part Pads SMD Layer 4 TO Part Pads Thru Layer 4: V+ Q U5 f3 y: Z
No Hazards.2 N! {' w5 u+ k& k& X
9 G/ g; P, q9 R6 D* {
Part Pads SMD Layer 4 TO Part Holes Layer 4- H5 K+ U: Y+ u4 `* k- d" w
No Hazards.
3 ^% X, L9 K* T6 S& X1 J1 j/ a% A! z# F
" k& x% n8 s* y- z/ A" z0 j6 W5 U2 j Part Pads SMD Layer 4 TO Via Pads Layer 4& d# P/ M% S+ d& i7 q& [1 H/ n
No Hazards.0 [1 D9 t1 |$ F+ J
/ @" b# ~& X& y
Part Pads SMD Layer 4 TO Via Holes Layer 42 D1 W) S, l5 J; u" A( `
No Hazards.
/ B! ?; f: @5 ^
) c7 w6 a. L) I( A8 N3 D% m Part Pads Thru Layer 4 TO Part Pads Thru Layer 4" U1 R& ~- \# T* X
No Hazards.
: v8 J' n# I' H. h; A1 F; h/ I5 K0 t% M$ K
Part Pads Thru Layer 4 TO Part Holes Layer 4
: J2 A* R% A/ q+ c9 F No Hazards.+ m* r8 r' }( T& ]
' H+ ~; Z, m2 ?6 N Part Pads Thru Layer 4 TO Via Pads Layer 48 F$ R G; H* J7 \) ^' l1 u$ c; t
No Hazards.9 v+ t" ^( ~1 \/ W! S0 j- ~8 K
# F0 A' S* X0 W& ` Part Pads Thru Layer 4 TO Via Holes Layer 44 w4 u; ~; E! U
No Hazards.
* G1 V8 \* @! j7 \4 q( @9 U% M. k! b% g' x% }5 K1 X
Part Holes Layer 4 TO Via Pads Layer 4! ^' C9 H7 _7 N' p% m
No Hazards.
: M9 d" [% ]. |! P5 P& R8 ?- F- U; K. {9 T! o% q# R) _% X
Part Holes Layer 4 TO Via Holes Layer 4
! ~' d7 ^* w6 M No Hazards.6 l6 j$ m+ e2 {) B% M+ h7 H
% {2 _$ t5 \3 W/ g; H ?
Via Pads Layer 4 TO Via Pads Layer 4$ h9 O: q9 e: Y! S7 j- Q
No Hazards.
0 A6 t& e5 ]% x$ N% S5 T* T1 d6 D0 W. ~( W' n7 j
Via Pads Layer 4 TO Via Holes Layer 4
! f+ O, C+ o7 |5 g, T+ i7 \ No Hazards.9 H# s" l- p8 F7 @5 ~6 P. ?) y e
. L# _$ \3 @# t! c" P% { Via Holes Layer 4 TO Via Holes Layer 4
/ s Q5 s* U: Q/ c* c; @ No Hazards.( d3 V0 p( m" O( @- A: i
5 B2 w' q2 }, l- D3 P
. R. K3 T! v' ^3 m! f: x" f
Total Hazards Found : 0
# V' S: s8 g+ m& k5 u5 J
. ~: i) v6 c% h9 k3 o5 K$ T' e) ` N! X
5 L K, \# y4 r% K
; L9 _4 q- p* e- H Planes Clearances And Rules/ C2 G @. W) k( [' e* `
---------------------------% c& U; R4 b% D: R
' |! d2 H6 z2 Z, d" I5 Q* T/ u" M8 q
Positive Planes Layer 1 TO Part Pads SMD Layer 1
: H% n: ^0 Q" O' ]0 z No Hazards.
, F+ d0 u) T; D6 C% k4 Q
8 n3 w3 ?* _+ Z# d3 _2 K# _ Positive Planes Layer 1 TO Part Pads Thru Layer 1
# j* L5 M( U7 {7 a! B No Hazards.7 d# J# d/ V* h2 O! B: r3 T7 _& l
; ]1 M, q! R8 z4 l
Positive Planes Layer 1 TO Part Holes Layer 1
( e( z1 B3 i1 U' \6 u0 m No Hazards.3 q! Y7 c0 G9 F# \& t
T9 t7 z7 W/ v3 J( U Positive Planes Layer 1 TO Positive Planes Layer 1
. L& V" l/ E3 | No Hazards.# X6 t7 a5 {8 Y3 r
: r& P+ S: y. S3 \/ _2 }- X, o5 \ Positive Planes Layer 1 TO Route Border
- `; v' C+ C6 p9 D# ]/ F/ X No Hazards.
0 k. I# E0 ?& K' q) c
( U+ U1 d8 Y5 ^ Positive Planes Layer 1 TO Traces Layer 1
7 l1 Y, a# ^- c( ^; L) ? No Hazards.4 T0 v8 Q9 n+ g5 B4 x! G
0 g4 o8 x- n* A C0 A* ~" m3 Q7 m Positive Planes Layer 1 TO Plane Obstructs Layer 1
M5 j/ q0 f" A& j No Hazards.
! O4 f5 l+ Y) q- Q/ [* L( J; F* Z# V, O Q$ r9 G8 Y2 G
Positive Planes Layer 1 TO Via Pads Layer 1
( }1 `3 Y) P' m3 S4 @9 }) N No Hazards.$ s* W T9 m/ z: w7 o$ m9 n( x
' y4 n" T& ?5 Z& }! s
Positive Planes Layer 1 TO Via Holes Layer 1+ E h# F6 A9 ^- a% z" A, S1 [
No Hazards., \" G% D- H9 \. ~$ }2 L' L) a
2 o: J% M" {5 Q2 Q' J' d Positive Planes Layer 2 TO Part Pads Thru Layer 2* x1 l$ Y0 M# @. [
No Hazards.+ U( I4 E# g/ [/ b: O
+ z1 Z; C; G& v0 T" {# E1 C( |
Positive Planes Layer 2 TO Part Holes Layer 2
2 ?, @5 b% E5 @$ \! u No Hazards.
3 @. L) [" G) q. z+ r4 y/ ]; P! D
6 q6 @' b- V* G/ r2 E Positive Planes Layer 2 TO Route Border- M" _) E" W, s+ U- T
No Hazards.! F3 U& r& o2 x& x
/ b7 m' n0 V. i8 _1 _1 I O
Positive Planes Layer 2 TO Via Pads Layer 2
, D2 Z, V8 u% K: [8 c0 ^6 ` No Hazards.! [' ~) p0 n# ^% A
. R& V* ^& H! N+ h; S
Positive Planes Layer 2 TO Via Holes Layer 2
: l7 z. q( }+ t; Q1 R% O0 ~3 K No Hazards.
+ ]; d# C, `5 a& A1 B
- ^, l5 V7 a$ s9 ~# c7 g Positive Planes Layer 3 TO Part Pads Thru Layer 3
, k V9 H( S' z Z+ @4 ?' b No Hazards.
6 i: M0 A6 t" i; v5 M4 R/ T5 Y s8 ?" ?7 d; q$ _
Positive Planes Layer 3 TO Part Holes Layer 32 Q2 {, [2 A4 g4 t
No Hazards.
% }& k \9 D, @. j$ G
6 v* q& v( I5 O5 u& n. Q% A- f Positive Planes Layer 3 TO Positive Planes Layer 3# F" W8 d0 \& f& S, Y2 a! ]
No Hazards." X) _) j' S1 H0 L
) `. A+ x y: f' I' G
Positive Planes Layer 3 TO Route Border
& p! k, g/ e ?+ _5 f No Hazards.
L( q* w) l, { H; O2 H, N- G$ k6 S: L- J i% v5 X
Positive Planes Layer 3 TO Traces Layer 3$ W- K% F, K" p3 m# }; _
No Hazards.& K7 v. D6 [& n3 F7 G" m
7 R) r( k, m) j5 b) |, y2 h Positive Planes Layer 3 TO Trace Obstructs Layer 3
' @" o( v1 u- L7 ?# t" ?5 H No Hazards.
# u% X/ g5 r* U0 O+ j/ F" O8 @0 ?: O" U) y. B: {/ G+ a
Positive Planes Layer 3 TO Via Pads Layer 3' \- Y( V }+ j2 B' W0 F
No Hazards.
" L$ |( H3 o$ x4 ]; H6 h) G/ a. S/ M5 w% [, n
Positive Planes Layer 3 TO Via Holes Layer 3
' z; D- |+ S' b( m2 j5 g/ n9 J No Hazards.& ^% A- W1 H7 N) w# _& T
2 Q: z+ t( ~* o7 }
Positive Planes Layer 4 TO Part Pads SMD Layer 4% u* Q" `, p' j: ?. g
No Hazards.+ D4 a! ?( H$ o0 y+ g( b
. R; i! v/ z+ U/ x* k/ d- y7 r
Positive Planes Layer 4 TO Part Pads Thru Layer 4
* b# j- }3 P* J No Hazards.' u8 P3 a& @" h: u9 C( F
/ y; G9 k6 j& `# k0 X7 C: h3 N1 [
Positive Planes Layer 4 TO Part Holes Layer 41 @' b+ u6 i" `5 a" |/ m
No Hazards.+ ]# `( e, Z7 e( G! ^4 [
2 x, O' u5 I1 s4 _ Positive Planes Layer 4 TO Positive Planes Layer 4
6 l! N0 W0 V, A No Hazards.
0 ~! ~' l+ ]9 L( n* S5 g
" a0 _$ {" H9 h e+ u0 y; p Positive Planes Layer 4 TO Route Border
! Z0 h. g: Z+ d4 b0 Z$ S+ k4 n No Hazards.
1 Z! j7 z1 z: y+ p4 v8 Z& H& n9 B( L! r/ {
Positive Planes Layer 4 TO Traces Layer 4
2 ~; B$ h8 D+ D' e! q No Hazards.. k4 r2 K/ H( [/ y. n- |: K
5 L# X i+ T9 ^6 Q7 ]" k+ j8 p
Positive Planes Layer 4 TO Plane Obstructs Layer 4
% |; N- Y' Y( o! ]+ O, K" W" \ No Hazards.
8 {" M( u k8 \" x9 `0 F0 K6 b- v! {) o2 R" Y6 ^$ ~
Positive Planes Layer 4 TO Via Pads Layer 4+ V! `, ]. r# v4 ^+ @
No Hazards.
! ~/ I7 D, z, j/ V
* M# b9 C. h) G& @ Positive Planes Layer 4 TO Via Holes Layer 4/ A) c2 R* B' u; J
No Hazards.
" T) W; c; h6 f/ x y+ g; ^, K) b1 `5 A9 T; Z
& \) h7 y. T9 A
Total Hazards Found : 0
' M% G; ]( S2 G8 N6 `: q2 O" C" w
& G, ~0 S" _9 y6 [" {, t: E. ^
( F, C# i7 Z3 I, j! S9 U( g) J) b
% L) ?" D8 a$ F- T0 ^" H; B: U- Y+ U% g. i5 V
Non-Net Class Element To Element Clearances And Rules
& ^5 d+ v; \& B: W' w" F -----------------------------------------------------9 F- |% }: u- ?; i/ \# H
* O H+ D6 e8 [; S2 |& D6 u% { Route Border TO Via Pads Layer 1 Clearance: 0mm( ]& R5 K' O6 q' N% `1 g
No Hazards.
5 j* R0 Z- P2 {4 Q$ Z4 P7 U' t
/ K' `5 o. R4 `2 e Route Border TO Traces Layer 1 Clearance: 0mm
3 {6 E B, S2 b& N: q' u No Hazards.! j$ x5 _8 u. `2 o0 S
2 M( ^% ^% b0 a1 T8 S9 `* d$ V Part Pads SMD Layer 1 TO Route Border Clearance: 0mm; O" z; r4 K6 p3 m0 Y. K
No Hazards.
. y$ c* G8 w* k7 [" ~( ^' j1 c- O: Y
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm. k2 _- r. Z0 L2 e2 ^+ t3 Y
No Hazards.
. T0 w q8 K+ r( |/ H! p2 Q5 s+ o$ z7 q8 s# J
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm; T+ {/ [2 s* i
No Hazards.
/ N0 A3 V" K1 @( r! L+ G% y
2 ~0 l4 O6 @* s: c Board Outline TO Via Holes Layer 1 Clearance: 0mm' {- z. W' }/ Y4 d
No Hazards.
! b# w" M7 e/ R, X5 F8 O! H* L9 L6 m
Board Outline TO Via Pads Layer 1 Clearance: 0mm1 r. q. U" p' I/ ~3 V7 ~* ]: S
No Hazards.
6 R4 x5 c& R: O" ?& r: y2 c7 Q1 M: @' _
5 `& n' S! n/ z, x1 u% X5 l Board Outline TO Part Holes Layer 1 Clearance: 0mm8 D+ G0 g9 A) ~1 N
No Hazards.
* d7 |( H' C0 h9 ~ Z9 i; b% k* V R/ |+ P
Board Outline TO Placement Outlines Layer 1 Clearance: 0.25mm. n; @3 i, q( a$ _9 S1 ]
No Hazards.
, C2 w3 V' Z8 G, x6 s1 o: X& x# t
7 l$ j1 e5 r3 B, V Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm
4 s9 C% Z% s1 E. p8 B- N No Hazards.
9 l) V( o9 ]- k" ~# X" S
+ y9 V; z7 E- k. Q4 k6 f Board Outline TO Traces Layer 1 Clearance: 0mm
1 n; D$ V4 Z) s# ]# ] No Hazards.
: y/ N, {5 x' O2 r8 V# ]; b$ {9 e
. W4 ]: e8 O4 @; B- |" l6 K& I Route Border TO Via Pads Layer 2 Clearance: 0mm) m& `7 [& t6 V8 R5 Y6 F
No Hazards.
X- i. T2 h1 h! w+ H
/ ^6 u2 @, {3 \% T* L! K+ h Part Pads Thru Layer 2 TO Route Border Clearance: 0mm
( z6 D1 F0 w8 r1 P No Hazards.
' B1 W1 @3 |8 {) f, P+ J# n/ w. d5 R5 V0 y( _; |
Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm. x7 n' d9 s# a( N1 @; Q! c9 q
No Hazards.
& S+ }# Y. g9 I4 ?
/ T8 ?4 U, |8 O- j8 K+ w Board Outline TO Via Holes Layer 2 Clearance: 0mm5 [( M5 m! y' v* @( \/ M
No Hazards.
+ t& s& b4 l& [, v/ }+ u! `
! K8 c) U4 ~; F$ D7 u3 m Board Outline TO Via Pads Layer 2 Clearance: 0mm
1 [2 K( ^2 L- c, s No Hazards.
" L" M7 i8 P! u! d7 D1 W/ ?
2 ]1 p& N9 c1 S$ @5 k Board Outline TO Part Holes Layer 2 Clearance: 0mm
; d; O. m0 u$ A. g( ] No Hazards.. z y/ o# ~ c" h
% Y( n! \' ?4 X9 _( a+ W
>> Via Obstructs Layer 3 TO Via Pads Layer 3 Clearance: 0mm" x D" l; w( G
Hazards Found : 6
8 a3 L# Y1 h% i4 W! S" Y* t$ a& ?! Q
>> Via Holes Layer 3 TO Via Obstructs Layer 3 Clearance: 0mm4 e: w; c0 f& `. d* C
Hazards Found : 6# a9 O1 }* }) H7 E5 a& j# k
, ?; y3 _ {! R, r >> Traces Layer 3 TO Trace Obstructs Layer 3 Clearance: 0mm
/ F7 M# Z8 {$ J N Hazards Found : 1
% X4 e1 P8 I1 p! r) r& ~% l) I; R+ n" |! z8 z5 n
Route Border TO Via Pads Layer 3 Clearance: 0mm
0 U9 ~9 R1 U# j9 N6 r' `4 v, x' x No Hazards.
. X' z7 I5 b! B$ R I" V. G
7 _0 b+ S; i8 x8 y. q Route Border TO Traces Layer 3 Clearance: 0mm- K- V0 X: P) S1 a4 E5 L a5 I
No Hazards.0 O5 @8 i3 W/ A- N. H0 o
+ W3 W8 H! A( L9 R7 `" N/ b
Part Pads Thru Layer 3 TO Route Border Clearance: 0mm
# l$ x) t" J* G, Z* ~7 ~: N No Hazards.
: g9 h; r5 a& O9 j6 H
: T# |5 q0 B0 `! O Board Outline TO Part Pads Thru Layer 3 Clearance: 0mm
9 W5 F' |( N9 K0 X& O; e No Hazards.' Z' b/ g1 C* a9 S; U9 ~- ?
! F) Q2 Z4 x; |) H" K8 B Board Outline TO Via Holes Layer 3 Clearance: 0mm
6 Y; s$ B7 a' L& u7 D& ^* U6 A a No Hazards.
) U3 d* `& Q3 v" b: x" _* t( ], }; x7 |7 I7 D0 t
Board Outline TO Via Pads Layer 3 Clearance: 0mm6 R5 P, H- x# E" ^
No Hazards.+ h. N" J- l& H( q2 P: _! }: G5 `
- ]! o% x0 h9 F4 a# ~, I* i$ |7 c$ s Board Outline TO Part Holes Layer 3 Clearance: 0mm# S* w) h8 ^$ R$ ?4 p
No Hazards.
, ~/ X3 K, l7 D1 `1 j4 T& \# }/ [5 w! f, K
Board Outline TO Traces Layer 3 Clearance: 0mm0 F: P) U2 ^# [: P7 g% Q
No Hazards.! N, g( N3 H' V* M! V
$ ?; [+ j5 c" F- j" r! \! P7 V
Route Border TO Via Pads Layer 4 Clearance: 0mm8 c/ \# D) K3 J8 ^3 u6 n
No Hazards.
2 X$ G1 _9 z2 a# X) I. R G2 R3 K2 A& R7 a: J9 w
Route Border TO Traces Layer 4 Clearance: 0mm7 Y+ h# i& R$ i5 Z; C% X. z# Z
No Hazards.: T- G/ {, _7 Z6 L4 M! Q# u! P) S! _
; v8 L8 e3 H2 l7 I7 ^7 y ]
Part Pads SMD Layer 4 TO Route Border Clearance: 0mm
& ^* x! z" T, A& X2 q No Hazards.+ C- D/ A* l2 J3 U
; u) q, @0 F& U/ _% B" [ Part Pads Thru Layer 4 TO Route Border Clearance: 0mm: |( T6 p2 _, e& S3 Z( ]
No Hazards.
- E2 ]7 `' }5 X' p9 D @# e4 Y. d( K% q2 D% m4 Z
Board Outline TO Part Pads Thru Layer 4 Clearance: 0mm7 R. B) v7 k1 R# o! @
No Hazards.3 p8 k& _7 ~5 L0 }
x% f% ~. F* g c! y9 o
Board Outline TO Via Holes Layer 4 Clearance: 0mm: x8 ?) e9 W+ J! W5 f5 j
No Hazards.
- v$ M$ x( r" D) e: j8 W
% d8 e {# a. L9 l* m Board Outline TO Via Pads Layer 4 Clearance: 0mm/ d: @; _) ?0 s
No Hazards.
8 R; u. q5 G" L4 `, j
# L. }3 B' r+ N, g; | Board Outline TO Part Holes Layer 4 Clearance: 0mm
1 z/ i' E: n- [5 u7 k+ l No Hazards.% b* q' p- z0 b; V1 P$ q
$ x$ Z4 A9 \3 J9 V4 n" q3 N
Board Outline TO Placement Outlines Layer 4 Clearance: 0.25mm L; A/ D* s L! R% p
No Hazards.
* I2 D6 C q9 O9 D* U3 ?+ F. o d5 c0 l& m( L0 Q1 p: g- U
Board Outline TO Part Pads SMD Layer 4 Clearance: 0mm
& }' j3 R, j3 K No Hazards.! W N- \3 T) G2 p2 I
3 Y9 u+ `* Y3 ^1 p5 T Board Outline TO Traces Layer 4 Clearance: 0mm: C+ v6 w7 v( F* w# J
No Hazards.
+ z; F% K/ L/ y2 R1 r: `1 G6 X9 s7 K6 ?4 [. ]
& k6 Q' }3 k- i
Total Hazards Found : 13( U% H/ v! G3 H4 v
0 L# Y3 R, f7 E
! w3 N2 i6 i. y9 {. b: Z4 ^
1 i, ]: t3 ^% W0 X Total Proximity Hazards Found : 136 y# u" S: ?4 T% \
4 u1 r V$ t& k) I+ a. G Q1 A! L% | g3 D9 {, t" J+ G
+ l* N& A, m. k9 L: k6 n) p) `) Z/ ~( x% p0 {$ j, n* C; N9 K
----------------------------
! E* m, u, Z8 G CONNECTIVITY & SPECIAL RULES
2 ~9 ?/ e; a3 S- q4 G7 j ----------------------------
; ~4 `/ c: D- m2 _0 z7 O. W* t# g0 B/ {% w& ?$ m
+ J$ ]; J. I3 P) K R
Check For Unplaced Parts : YES1 i' E6 y0 p3 `7 Q7 X% {
No Hazards.: w" T Z. k3 p/ z( F
+ @* l; b' @7 n7 \" d7 G5 U- S" m _1 w# s
Check For Missing Parts : YES( A) }: _, D" b8 q
No Hazards.6 V* X, i5 J S& A
: J! ]9 \8 @% V: }- M9 y: f
" O* g2 f% k: T) g- t8 X Check EP Component Hazards : YES; J5 |) N7 G+ M& f
No Hazards.
0 J* F: l' }7 V
+ s h4 H! H3 d) k( Q% x3 ~
) \0 k/ B# H4 y Check Trace Hangers : YES6 T9 e! P2 u- |% _; D8 @( ?
No Hazards.: Z& R2 S2 l1 W$ a( a7 l1 A! O
3 Z3 j, _) L7 W2 S. f( E+ q6 y$ F0 l2 Q5 y, M, O
Check Trace Loops : YES% E) `" z1 h5 z+ A2 y# o, [
No Hazards.
$ i/ i6 V' s# q) w
) T. X l# V# U, B4 v) }) F n7 @& d6 D6 ^
Check Trace Widths : YES
5 h) Z) i3 @. m3 B/ b# D# [' a& O, b No Hazards.# m2 ?8 O9 X6 C% r
1 z# P$ T+ Z& G; m1 c" Q
- ]/ L- ]. x# y0 C' K2 V$ \4 b
Check Single Point Nets : NO
2 V3 L3 L; b S, g) G3 `9 Y% |( e, [) j7 ?
- E" D. J+ w- g' c/ P: S$ C
Check NonPlane Unrouted/Partially Routed Nets : YES6 b: {- w1 G0 P! q0 G& A) @8 e
No Hazards.2 E) _* X. E% q# _
& v! x% ~0 q: H; B3 R3 U( [
6 I# ]; G3 ^. x8 a( e
Check Plane Unrouted/Partial Routed Nets : YES
3 t9 b; j1 J* L5 t# Z No Hazards.
' B& I, r, T) z o3 Z6 d7 C
& o+ g v* i3 h% R0 p
: W3 X: g5 s& `! y Check Routed Plane Pins : YES, y0 s5 {0 \9 G; o2 E
No Hazards.
3 _, R6 B3 Z* a: P% W+ ]
* y; S9 v! a' w
' B c+ R& M+ n( x Check Plane Islands : YES; W+ U$ ~- O% F l$ x1 w
No Hazards." |& {6 p! J* [
! \ {9 L7 b8 B, l7 N7 X" p0 X; B f
Check Dangling Vias/Jumpers : YES; L' g I- Z9 E4 Y+ V
No Hazards.
7 S4 T% ~' \- B' o1 m g! K h6 ?4 }& ^# Z/ C' A6 r6 \
1 h* @3 R# C/ _
Check Unrouted Pins : YES
, J8 [7 x( f d A s! h* ~3 P! b No Hazards., I5 L8 Z% J( m6 E5 U
8 c1 A Q3 {% Z4 [' j( m- g1 N8 S2 g4 u7 }7 x
Check Routed Non-Plated Pins : YES& d3 ?; k( B6 A6 p, N
No Hazards., A2 v$ g, a7 J- _" C9 `/ I) `
6 I/ _( \% y3 ^+ q) m' z( c, X, u# h/ u% i5 n0 b2 C" K
Check Minimum Annular Ring : NO8 e N& k9 ~0 O" c
4 X% A9 @$ D; w$ G" ?1 Y- @
8 n5 _, I9 J7 h
Check For Vias Under SMD Pads : YES9 ]+ h3 L$ r8 ~: r o6 A
No Hazards.
`! X( L2 c" O" \
$ y- _9 ^0 l+ d) j! d7 A: P7 z- W+ g% M+ q
Check For Vias Under Top Place Outlines : YES3 k$ R6 q; R" Y9 {
Hazards Found : 25
6 j3 y7 d. x% P5 C
$ b, b# g9 k$ \* t5 e3 a5 w |. X7 p! B
Check For Vias Under Bottom Place Outlines : YES- L7 N) t; F0 J. _" A1 I0 y% i
Hazards Found : 11
. ]+ s6 U+ \" ?" a5 X: _' Y
% R! o9 [! u* m3 A4 U1 d/ w, {; Y! n& s
Check For Missing Conductive Pads : NO
8 q- G+ H: ?- d$ {: x3 ~
$ z3 R* I9 Q& D+ N7 T% V/ L+ d
1 D$ k; s) w* I+ `% z5 I5 Y Check For Missing Part Soldermask Pads : NO! M& ~! x" r# c: F g, T
1 a f3 D9 Z! L' P& y4 E
0 S% E1 W* ?; H1 Q Check For Missing Via Soldermask Pads : NO
) m9 @2 s7 r3 f) ^/ q& A* R4 C0 O* L+ l+ T7 U: Q# \
6 E1 e' A7 }# W6 S1 t Check For Missing Solderpaste Pads : NO
* s0 F8 @8 F$ _& s. a; _$ |( {5 u' b6 U- p+ v5 u* o6 @" Y
1 h" u+ s8 o' w& i" {: F; C5 Y( \* J8 V
Total Connectivity/SpecialRules Hazards Found : 36: t; `8 s$ ^1 n8 L0 F" h: l; ^
3 d4 X p- S# h; t
9 x9 G3 c8 E6 s# \
- B2 y: F" n6 _ ====================================================================% I7 S* [8 W! u7 O) b
" a4 L8 z0 I* e7 J* _- X. w0 H7 P7 M) ^; [, c( s
' P h, f# Y3 O5 o6 [ Total DRC Hazards Found : 49: i" D6 l) m/ l# H( g7 s- V+ [
$ ]& o( J m, u9 Y
2 |2 `4 k; G( J x9 t: [5 }0 M1 z+ Q8 O8 h* z" d
04:46 PM Thursday, April 16, 2015 |
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发表于 2015-4-16 17:04
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