Solutions:$ s* B8 Y, U# [: d! e! } ]
(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible: K1 ~8 m( k7 g) N
(2)Low-inductance decoupling capacitors; X: {2 F! N R* S: g. v
(3)Multiple, very short power and ground leads in packages ' a1 b- X. t8 s1 F5 ^: h(4)On-chip decoupling capacitance