Solutions: s- T0 @& @/ T
(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible5 o# t) {9 i; J4 K
(2)Low-inductance decoupling capacitors2 }3 G: _3 J& e! `( r
(3)Multiple, very short power and ground leads in packages $ D; j, b( T2 R1 P/ q' Y/ N(4)On-chip decoupling capacitance