Solutions: 4 w9 p8 ?' Y% B) X) \; S(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible 0 a6 p6 S9 {2 t4 w(2)Low-inductance decoupling capacitors " S5 u: q+ n, f- z/ b(3)Multiple, very short power and ground leads in packages % v" W. E- l) b(4)On-chip decoupling capacitance