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*.GTL TopLayer顶层走线, U2 I) ` w. |/ h
*.GBL BottomLayer底层走线 $ F5 [( s4 F$ C* n u1 ]
*.GTO TopOverlay顶层丝印字
; q/ B; y" A+ t* ~/ k: w *.GBO BottomOverlay底层丝印2 l; L# @4 X. z# O
*.GTS TopSolder顶层阻焊. a9 K9 T4 J# {& n8 L& _" @* I' z
*.GBS BottomSolder底层阻焊
2 r2 H3 B/ ~. u; Q. ^' W *.GTP TopPaste顶层贴片钢网# s7 P* t8 m+ _) W2 G
*.GBP BottomPaste底层贴片钢网: _" L5 p& T) b9 z8 q
*.GPT Top Pad Master顶层主焊盘$ w# G, v# r9 ]2 {9 o' ~7 K c1 e( v! f5 m; J
*.GPB Bottom Pad Master底层主焊盘" l r0 v: R. }# B3 G' _
*.G1,*.G2,.. MidLayer1,2,..内层走线2 I9 \3 q9 K L( E8 w( E- S
*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
' O6 K# n6 S" o *.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,..
# d& m/ z% w3 X0 ^0 x6 \4 ^, w *.GKO KeepOutLayer禁止布线层(可做板子外形)* ~# j& F* l. v7 h0 B8 U6 o
*.GG1 DrillGuide钻孔位置层( U4 ^7 u& z# s& f
*.GD1 DrillDrawing钻孔图层 *drill 钻孔文件7 ~0 y, s2 B4 p0 |5 P
*.TXT 分孔图表
# m& y+ J4 b) A/ {0 G. Z *.APR 光圈表文件
* o! j! o3 I. o" ? *.DRR 钻孔报告文件
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