Via Current Carrying Capacity?

karpcb15

Hi all,
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' x$ l5 d. e* Y/ v) kI am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried  core Via (L2-L3)
Blind via size 60 um drill / 100um pad , Via length 40um

0 c/ T& [$ Q" P7 D3 W9 F7 z$ i1 mBuried Core via size 100um drill / 200um pad , via length 150um

" C; Q8 O6 v. G. h" r+ p; {Anyone knows the Current carrying capacity of above mentioned blind and buried core via ?

. S7 V9 q7 S, n+ }9 d, R  D4 B1 P! aWhat is the general Via wall thickness in substrate?
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Thanks in Advance


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gochip

怎么算

tencome

直接按照圆柱体的实体铜计算过电流能力就行了。　　

karpcb15

EDNA 发表于 2019-1-14 10:01
自己计算下，这种激光孔，是实心铜。

如果通过填充铜，我可以知道通孔电流密度

EDNA

自己计算下，这种激光孔，是实心铜。