Solutions: . O4 |# O! D% d* i(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible5 C* `9 c# j% z8 Y) G
(2)Low-inductance decoupling capacitors 8 O5 B; Z) o) p; ?- F4 m; `( k, S(3)Multiple, very short power and ground leads in packages1 N e+ B! E) ~- [4 M1 K
(4)On-chip decoupling capacitance