|
|
Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
2 m$ J0 I ]2 q8 p( B: G; jRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when/ x7 C& L1 ?( N e8 w2 x
electrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003., S$ X3 u7 L5 O5 a; [% B, k0 [
The dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen
9 d- w: {, O( x5 Ywhen electrical properties are less critical. |
|