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PCB Stackup and Layer Order中:
/ S: c3 J# R$ I0 f3 yPower supplies with high transient current should have their associated VCC planes close to the
# R8 g# l9 f8 C# M) f% y' |9 f; {top suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction9 d- q0 S; s; |3 l# w/ p) D3 F
that currents travel through VCC and GND vias before reaching the associated VCC and GND4 i& H4 |1 a P# c. M( ^/ x' b$ A- u
planes. As mentioned in the previous section, every VCC plane should have a GND plane
5 O: a/ R% @5 ~+ L+ _# M! g2 Wadjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents6 x1 x* i$ m- E+ i* \
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the# R3 V% c0 p+ [
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC& Q/ J4 E% ~8 J# o1 k
and GND planes are considered as a pair./ B. |3 b- U) K9 p
這裡面,說的VCC,GND層到底所何放置?
* H6 F6 Q, C, ? Q2 z: v謝謝! |
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发表于 2007-12-28 17:23
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