最新拿到一家IC厂家的推荐设计文件) k5 d! G$ Y# h2 S6 T
发现里面的大封装电容的两个焊盘全部贴的很近，1206封装的电容，焊盘间距大概只有10mil左右。' f6 Y6 M$ r4 w, K% e5 L* ]
The +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized. 7 m" l ]6 B# ]5 T7 ^2 Q 9 b: x5 y7 ]/ g! z6 h" n9 E这样处理的意义何在？! P& z: n& c O. R6 `- G
减小ESR吗？
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发表于 2012-9-21 15:35
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淘帖
支持！
反对！