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［书籍］Digital Techniques for High-Speed Design
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$ a$ l6 @1 _. E目录( [: s1 {7 `# M2 }& L
1 z0 l* t+ h5 `$ D# R4 ~+ bI. INTRODUCTION. % S! R3 N3 r" ~1 r8 l$ w* `, w
1. Trends in High-Speed Design.
: h- e! o2 V1 k) p, ]9 F0 j2. ASICs, Backplane Configurations, and SerDes Technology.
' L. i+ N, b; `9 N; T, v3. A Few Basics on Signal Integrity.
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; ^' R3 ~+ V# J* MII. SIGNALING TECHNOLOGIES AND DEVICES. 3 z% G1 k' H3 I% f8 U, }
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+). 8 h$ C& h8 H* H: O1 p: Q2 `( @
5. Low Voltage Differential Signaling (LVDS). * [3 h' i6 q7 H; ^: Y
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
" ]' Z3 I7 H* p: ~3 d7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL). : L% W7 E2 @( g" N0 z$ N2 s
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
$ T9 p# \/ o2 ` m4 b5 z0 a# m9. Current-Mode Logic (CML). - p) s% @& n% a v
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.
: ?1 h4 t* {9 j, ?3 A+ M+ P; F11. Fiber-Optic Components.
! G# _1 `3 g, j t12. High-Speed Interconnects and Cabling. 7 U: g8 P2 \6 v' N) o
8 C' j" P0 ~* t$ U8 u6 IIII. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
9 X; q9 Q5 v2 l0 h3 B13. Memory Device Overview and Memory Signaling Technologies.
c# r b" x1 ]3 ?' c* E+ F14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
3 x/ ~8 L; t# u x6 n+ U4 `15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
T$ m+ @( k) D* |: x* P0 `6 k4 l16. Quad Data Rate (QDR, QDRII) SRAM.
3 _7 W8 g) R) S3 |8 `! M7 o17. Direct Rambus DRAM (DRDRAM).
* V" t+ X4 R2 n. M" Q$ a' p$ Q0 `18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR. ' ^8 m" u- v! I+ H: { q
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IV. MODELING, SIMULATION, AND EDA TOOLS.
+ x/ d3 K9 L' Q19. Differential and Mixed-Mode S?Parameters. & y& f, @+ f; L7 N2 _
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. ! y }* a j3 T. |6 u
21. Modeling with IBIS. ; u' H/ r O6 b
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
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V. DESIGN conceptS AND EXAMPLES. 4 I$ B4 q; R. c( o) z: o
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. & N7 n' n: b$ e1 c, \
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Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
8 a' y- g3 O3 N' ^24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
2 S# c$ {2 l3 B: z5 E# x25. Designing with LVDS.
5 e' j- s$ g" W26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
2 j9 ^# @: t3 Z# F4 s! `27. WarpLink SerDes System Design Example. ( }' R3 F0 C$ Q# Q) y' H9 M7 t
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VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
3 Y5 H5 F& z0 q# Y* f28. Electrical Optical Circuit Board (EOCB). : ~$ A! a9 R" x- p7 ?; g; z
29. RapidIO. ) k# i" I9 [( R8 F; m6 r
30. PCI Express and ExpressCard. / m. Y1 y! H2 h8 J
+ x* P( |: e3 Q: G) AVII. LAB AND TEST INSTRUMENTATION. + Q& f) p- D+ y. G. }9 g
31. Electrical and Optical Test Equipment. 7 h! C m; q. J6 e# g' h% _
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[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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发表于 2008-3-21 12:43
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