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IPC-2252射频/微波电路板设计指南2 G, y- H: P9 f: F' V
IPC 2252射频微波电路板设计指南.pdf
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0 m" x$ o+ R, I% q" D& b | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发3 D1 X5 Z/ {" ~9 ]: A- `
目录
: e' P* u9 k1 y; z7 e8 ?1 ]1 概述(GENERAL)................................................................................................................................ 1
N, _8 H, a7 e' n4 Z" V* u) o T1.1 目的(Purpose)........................................................................................................................... 1- o* N, ~* Y/ d( t7 \0 c! ^
1.2 范围(Scope).............................................................................................................................. 1. c; m# ]# w- ~& K
1.3 术语和定义(Terms and Definitions)......................................................................................... 12 y+ v% u* K7 r6 w
2 应用文档(Application Documents) ..................................................................................................... 31 E+ A6 ]: l1 n1 j3 b/ J
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
, E) ] N" C" q b2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
1 e- e* h6 H2 p% t/ X2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3* W$ u! Y- _, t
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3& r9 I/ H+ g& x
2.5 国际标准化组织(International Organization for Standardization)........................................... 3
' {& H" t/ C) ? \5 }2.6 参考文档(Reference Information) ............................................................................................ 3
) L/ {) _/ z( S7 l3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
9 Y4 Y7 \) k- B/ I4 E' z5 p3.1 最初输入(Initial Input).............................................................................................................. 31 ]+ U; A U9 J5 @
3.2 设计方案(Design Options)........................................................................................................ 30 |* K9 d7 s; k( a8 m }; q
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3 K9 m- r( i% h8 E
3.4 电气设计(Electrical Design)..................................................................................................... 3
( y7 `$ X- Z v9 U# r. r3.5 机械设计(Mechanical Design).................................................................................................. 3: q4 o/ s& }4 W6 }
3.6 设计预审(Preliminary Design Review) .................................................................................... 3% L2 `# ?. k/ ]% V
3.7 电路实验板(Breadboard).......................................................................................................... 30 g0 h2 ?' w; J& t T. X8 q
3.8 原型(Prototype)........................................................................................................................ 3
: J7 w' d2 y+ o1 E+ K4 y+ E3 S3.9 文件编制(Documentation)........................................................................................................ 37 L: F6 X3 V+ j: F. ]
3.10 最终设计评审(Final Design Review)..................................................................................... 3( n2 M/ F% U+ [4 P
4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 54 l( c( x1 d Z+ J) p' [
4.1 产品特性列表(Design Features Listing) .................................................................................. 59 [+ ]0 X' G, ~; ]
4.2 原图(Master Drawing) .............................................................................................................. 5
. G7 p+ f% r1 e& p# T: K5 d3 a4.3 原始图形(Master Pattern) ......................................................................................................... 5
. X6 ?- M% B! s5 材料(MATERIALS)............................................................................................................................ 5
6 k, `4 a& J7 _ K3 N) u5 s8 N' e5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5/ {' _2 @6 c, F t& L
5.1.1 基材选择(Substrate Selection)....................................................................................... 56 d: Z9 v9 d2 [3 Q0 g
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
- X2 R s3 _8 v2 q* d5 C/ H" z5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
1 s# ~0 J) P) j7 c" V; R3 H6 r5.1.1.3 厚度(Thickness) .................................................................................................. 6" t4 Z3 j& u2 u+ ~8 p( a( m6 P
5.1.1.4 环境(Environment).............................................................................................. 7: w, h4 h4 q1 R7 E! n7 i/ E
5.1.1.5 成本(Cost) ........................................................................................................... 73 s: ~% a3 p T2 |7 }/ a$ i' Z
5.1.1.6 供应商(Supplier) ................................................................................................. 7: ]* a* b( U: [! G
5.2 粘接膜(Bonding Films)............................................................................................................. 7( A, C: p+ y1 | o9 o9 P, g
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7% c0 I5 ^* R7 j$ }
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: F) ~2 z3 n& I( s2 Z; \5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
/ k+ v: W5 u, w" {/ e/ T* Y$ z& ^5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8' C0 i5 ?9 n S0 E6 |7 l4 o7 e
5.3 金属(Metals)............................................................................................................................. 8
! j \" x9 \3 N( y; b! d* {5.3.1 金属覆层(Cladding) ....................................................................................................... 8
6 M: [% W7 ^* M! \ p$ K6 `5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8) {3 r. q5 k( J0 A
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8
L9 k! O2 c; i7 ]" d# h' x& J3 N5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
. Y7 K5 k; i5 F5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9- H* h% I* U6 w
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9: I2 j( W2 ]9 j1 Y3 N- y1 s
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
! e7 E4 x9 V- [5.3.2.4 镀金(Gold)........................................................................................................... 9& Y6 D# h h7 [- X+ I8 K
5.3.2.5 镀银(Silver) ......................................................................................................... 9
) D/ L8 L- P& n# R* D+ Z. `5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9* l/ j+ x) m; \. Y# G/ Q
5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
8 m1 |5 ~/ D" [* W. u% ]5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
+ V1 A# K2 j Q+ c. d5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 93 r8 z3 W. x+ A! I* c/ }3 z
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9& y1 M a- f3 W7 J9 y* t: Q% G9 n
5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
" ]6 a+ Z$ W, X0 n5.4 仿型涂层(Conformal Coating)................................................................................................ 103 \) t- V u2 d+ M U: [
5.4.1 一般注意事项(General Caution).................................................................................. 10* }0 t a _# P: N, y1 c
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10
: U3 G3 |0 k3 I( ?2 p3 ?, C6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10% _. Q0 z9 N Z- v: a/ o' A2 ~ i4 k
6.1 带状线(Stripline) ..................................................................................................................... 119 ^: ~# ? D+ L. l. f
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
6 K2 y3 k( ~8 V+ i$ q! [ t6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11$ f' c. ^ W/ ^
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
. }: A7 V1 Y! V8 Q6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 120 u4 N0 F: R2 Y, T
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12
0 S; w; h! s; A6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12+ B; T6 M# z8 {, L
6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 138 s. p! f8 f" O3 q/ N1 G& r/ P
6.3 微带线(Microstrip) .................................................................................................................. 139 z* k7 P% s; t0 P
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective$ T4 w2 T) Z9 _+ H* n
Permittivity f Microstrip)................................................................................................................ 13
1 \- c3 X( l/ a4 X1 A1 Y4 K2 j6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 159 N: A6 g5 i1 v9 k6 U: V. c
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15' z& P0 c' Q+ s& I
7.1 机械特性(Machined Features) ................................................................................................ 152 W- s& z( O9 v
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
+ q1 `+ T) {9 @+ R) i7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
2 r, Z( e1 P' N Z1 M* R/ d7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17. K N' }. ]6 f* [$ V5 u1 e
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7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17, ?$ i' \( W4 X/ v# ] E
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18! t! m: U* H( A7 b; P4 M7 d
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18+ |9 W; ^" B9 ], {- [7 F, I
7.1.6 外形(Periphery)............................................................................................................ 18
) C% x- I: }: h9 S; n2 j+ s7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 186 V8 E7 a5 ^$ S U
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 181 h. h' H' U% _5 C, j- J
7.2 出图(Imaging) ......................................................................................................................... 18
. w6 v+ V% Z! R/ J' }& S$ _7.2.1 底片(Artwork).............................................................................................................. 190 X8 W; \/ ]' l7 F! L9 P
7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19# O- H: }0 v7 F8 X
7.2.3 环孔(Annular Rings) .................................................................................................... 19
4 Q# U* t. `; n7.3 PTFE活化(PTFE Activation) ................................................................................................... 19/ C; S& t1 b8 X) x1 r# C
7.4 金属化(Metallization) ............................................................................................................. 19, {9 Z8 H' g) f8 f! n" s
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
, i& j$ R6 c) c( \7.4.2 镀铜(Copper Plating) ................................................................................................... 19
1 E1 q' A/ _* P: l& A7.5 蚀刻(Etching) .......................................................................................................................... 20% Y; D: r) N# }4 C9 t p
7.6 粘接(Bonding)........................................................................................................................ 20
( r) c+ B2 P7 T& G, E7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
, i4 r9 O+ W. ?# b4 `( I* @# O3 }7.8 测试(Testing).......................................................................................................................... 21" C+ c# D) v5 [4 Y" _' e, g0 {
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
7 K3 z7 R$ r! i4 D' ?0 u8 ?8 t& P8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
7 a7 o z! B9 l- m# ?1 [6 ^1 E8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
, J5 t! k. W3 q; B8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21% [ E1 r+ q; ~& w/ s/ R4 ?- Z
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
4 H( i* r7 K! x, _ d0 @8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
$ i9 O: A' V: X5 ^# x6 u% G8 q8.1.4 软钎焊（Soldering）................................................................................................... 22. I- T1 }7 D' [' L5 P
8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
' P0 {# L+ z" e v8.1.5 直接粘结（Direct Bonding）...................................................................................... 22& l6 X4 |2 L2 l5 b
8.2 连接器安装（Connector Attachment） ................................................................................. 22& G8 |* [/ X" }9 h! O4 ]8 `$ b
8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
$ e9 c: ~! |4 ~# b4 ?, M- P8.2.2 表面连接器（SuRFace Connector） ............................................................................ 237 Z5 O+ Z! P2 u
8.3 器件安装（Device Attachment）........................................................................................... 234 Q' C7 {5 d8 \& W2 L' j) L% f
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
1 A( Q6 @: r9 S. O& o* I8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
! C; r5 t* u* F+ j4 D8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23) \6 Y# s( |7 d! x; d. }/ d8 _% {" f
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24; i1 t( N! |) T z2 D
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
- y, u* N# I% }/ u* x- i& V. M8.3.1.5 软钎焊（Soldering）........................................................................................ 24) X( X! f* J, Z) p i
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
( `* M1 E# h1 X2 v. m1 N: Y8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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July 2002
0 { D# h% ?3 u0 E8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24
+ ]# W3 W+ n- [8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 243 c" Q& w4 \' ]) `
8.3.3 器件安装（Device Attachment）................................................................................ 241 \, R. ?4 Y! V2 g
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
! Y3 d T2 T, S8 q8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
) O3 M% Y3 z+ c# f* M @1 V8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
B |4 _ ]2 O! H8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25* a7 `" W4 J, b7 S
8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
, L9 C7 w; g6 P+ s3 J9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25: R- A! I4 ~6 ]5 @2 `" e3 x
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
5 ~# q3 ~+ P5 y0 W' I9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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