Solutions:5 J S; z) i& ?% B) D r1 x9 C
(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible- x' I& ~- j' N9 q" {/ g; j# \
(2)Low-inductance decoupling capacitors - U% e! i2 i6 Q* u# J1 Z(3)Multiple, very short power and ground leads in packages9 j( I$ c- R% S5 E" E/ k: ~( j; r
(4)On-chip decoupling capacitance