Mechanical via split into Stacked via?

karpcb15 · 发表于 2018-3-8 13:42

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We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 , mechanical via from layer 1 to 4.

but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias My Question is why manufacturer changed mechanical via to stacked via? cost also increased increase while using stacked vias?