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Hi all,
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9 f3 A* u7 S! o: {( B7 s' \I am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried core Via (L2-L3)
6 G" d- X B6 D- O# pBlind via size 60 um drill / 100um pad , Via length 40um) E/ v$ }0 n" s& b" R5 A
% {) }8 d- j; d+ M; jBuried Core via size 100um drill / 200um pad , via length 150um
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, C* W2 z, K3 r) v3 t' hAnyone knows the Current carrying capacity of above mentioned blind and buried core via ?7 q+ p; q: \6 i3 C
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What is the general Via wall thickness in substrate?
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Thanks in Advance. }" J, h, t& A( U$ z. I4 k) n
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发表于 2019-1-10 21:53
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淘帖
支持！
反对！
楼主