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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
0 @2 M5 n$ \9 n/ r( ]RT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when
?# N9 N6 g0 K3 y" B: ]electrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.
, t) ]" h( {& M( _6 C8 WThe dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen
9 N9 y( Y( C2 P/ U7 Q; b" Hwhen electrical properties are less critical. |
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发表于 2019-4-16 10:37
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