[AD9][6层] LPC32X0核心板（LPC32X0+H5MS5162EFR+BLM18AG221SN1D）原理图和pcb文件

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5 w: x0 v, d6 F" {8 v+ K# n[AD9][6层] LPC32X0核心板（LPC32X0+H5MS5162EFR+BLM18AG221SN1D）原理图和pcb文件

文件描述：
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1 v3 Z+ a* O( E- H1. 作品用途：LPC32X0核心板
2. 软件版本：AD9
, y7 w! j, V% [& @2 p( f3. 层数：6层
' g8 P2 O. G/ g( q! c* |5 H4. 用到的主要芯片：LPC32X0+H5MS5162EFR+BLM18AG221SN1D
( ]9 G: Q' q$ I9 p& \% i5. pcb尺寸： 2165.354*1574.803 MIL

' ]+ j/ Q& N5 F  C1 H/ Y作品截图如下：

; S4 C! i( T$ K! B& [顶层截图：
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, A& A/ W  I3 Z  |, d7 W底层截图：

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  c- g6 Z+ Q7 t" [% U$ N3 L全层截图：
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8 [; }& U) T" R% n  L" |叠层阻抗信息如下：

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Comment（属性）	Designator（位号）	Footprint（封装）	Quantity（数量）
	1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, A13, A14, A15	B0,5MM	31
22p	C1, C2, C6, C7	0402C	4
5-20p	C3	CTRIMCTZ3	1
100n	C4, C13, C15, C16, C17, C19, C21, C24, C25, C27, C29, C34, C35, C36, C37, C39, C41, C43, C44, C45, C46, C47, C55, C57, C60, C61, C65	0402C	27
150p	C5	0402C	1
na	C8, C9, C48, C54	0402C	4
3n9	C10	0402C	1
10u/X7R	C11, C12, C42, C56, C64	0805C	5
10n	C14, C18, C20, C22, C23, C26, C28, C30, C31, C32, C33, C38, C40, C58, C59, C62, C63	0402C	17
1n	C49, C50, C51, C52, C53	0402C	5
BAT754	D1, D2	SOT23	2
	IC1	TSOP48	1
24LC256-I/ST	IC2	TSSOP8	1
	IC3	SOT1048-1	1
	IC4	SC70-5	1
	IC5	SOT143	1
H5MS5162EFR	IC6	FBGA60-6X10	1
74LVC1G125GW	IC7, IC8	SC70-5	2
LPC3240 Head P1	J1, J2	LPC3240 HEAD	2
BLM18AG221SN1D	L1, L2	0603R	2
OVS-0806(Y)	LED1	CHIPLED_0805	1
OVS-0803(B)	LED2	CHIPLED_0805	1
32.768kHz	Q1	XTAL2	1
12MHz	Q2	XTAL4	1
470E	R1	0402R	1
150E	R2	0402R	1
0E	R3, R4, R12, R14, R21, R22, R25, R30, R37, R42, R44, R45	0402R	12
22E	R5, R7, R9, R16, R26, R33, R43	0402R	7
33k	R6, R11, R28, R40, R47	0402R	5
na (0E for boundary scan)	R8	0402R	1
na	R10, R13, R15, R17, R18, R19, R36, R39, R41	0402R	9
120k	R20	0402R	1
4k7	R23, R24	0402R	2
2k2	R27	0402R	1
3k3	R29, R31, R32, R34	0402R	4
10k	R35, R38, R46	0402R	3
MCDTSA6-2K	RESET1	SMD-KEY	1
22E	RN1, RN2	EXB18V	2
	SP1, SP2, SP3, SP4, SP5, SP6	TP06SQ	6
	TC1, TC2	B1,27	2

附件：
原理图和PCB文件如下：
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usjw112

核心板

菜鸟001

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argonout

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