[allegro16.3][4层]TWR-AUDIO-SGTL SGTL5000编解码器塔式系统音频模块（EPM570F100...

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[allegro16.3][4层]TWR-AUDIO-SGTL SGTL5000编解码器塔式系统音频模块（EPM570F100C5N+SGTL5000+PCI接口）原理图和pcb文件

文件描述：
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4 j+ |9 Q- k) @# ?$ E1. 作品用途：TWR-AUDIO-SGTL SGTL5000编解码器塔式系统音频模块
2. 软件版本：allegro16.3
6 m( B: l- D) y& O9 Z, i9 U3. 层数：4层
/ |$ d5 b7 O' W, N. }4. 用到的主要芯片：EPM570F100C5N+SGTL5000+PCI接口
5. pcb尺寸： 3543*3174 MIL
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1 X( Y5 H7 A5 n6 V$ {% H' h作品截图如下：

顶层截图：

底层截图：


全层截图：
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叠层阻抗信息如下：
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7 W( @$ }' d" k3 KBOM：
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Bill of Material Report (Condensed)
SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS	QUANTITY	REFDES
名称	类型	属性	类别	数量	位号
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.64M	0.1UF	DISCRETE	4	C13; C14; C15; C16
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.55M	0.1uF	DISCRETE	1	C37
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.635	0.1UF	DISCRETE	8	C1007; C1008; C1009; C1010; C1014; C1015; C1017; C1018
CC0603_OV	CAP_NP_CC0603_OV_DISCRETE_0.9MM	1uF	DISCRETE	6	C1; C2; C3; C4; C5; C10
CC0603_OV	CAP_NP_CC0603_OV_DISCRETE_0.965	100PF	DISCRETE	4	C8; C9; C11; C12
CC0805_OV	CAP_NP_CC0805_OV_DISCRETE_1.45M	10UF	DISCRETE	1	C36
CC0805_OV	CAP_NP_CC0805_OV_DISCRETE_1.4_1	10UF	DISCRETE	1	C925
CC3216_10	CAP_POL_CC3216_10_1.2MM_150-785	220UF	IC	2	C6; C7
CN2X82_FINGER_ASS	CONN_PCI_XPRESS_X16_328P_CN2X82	PCI EXPRESS TOWER SYSTEM	IO	1	J5
CON5_AUD_JACK_RA_TH	AUDIO_JACK_5_CON5_AUD_JACK_RA_T	CONN AUD JACK 5	IO	2	J1; J2
CON5_AUD_JACK_RA_TH_SJ-43515TS	SJ-43515TS_CON5_AUD_JACK_RA_TH_	AUD_5	IO	2	J3; J4
CON_TFM-120-01-S-D	CONN_SHRHDR_20X2_CON_TFM-120-01	HDR_2X20	IO	1	J16
FPBGA100_1P0_11X11	EPM570F_FBGA_100P_FPBGA100_1P0_	EPM570F100C5N	IC	1	U4
HDR102	CONN_HDR_1X2_HDR102_IO_8.6MM_21	HDR 1X2 TH	IO	12	J7; J8; J9; J10; J11; J12; J13; J14; J15; J19; J21; J22
HDR205	CONN_HDR_5X2_HDR205_IO_8.38 MM_	HDR 2X5	IO	1	J23
IND_0402	INDUCTOR_IND_0402_DISCRETE_0.55	600OHM	DISCRETE	2	L1; L2
IND_0603	BEAD_FERRITE_IND_0603_DISCRETE_	120OHM	DISCRETE	1	L3
MIC_WM-63PR	MIC_MIC_WM-63PR_IC_2.2MM_510-77	WM-64PNT	IC	1	P1
QFN32	SGTL5000_QFN32_0.9MM_315-77907_	SGTL5000 32QFN	IC	1	U1
RC0402_25	RES_RC0402_25_DISCRETE_470-75_1	10K	DISCRETE	5	R6; R8; R18; R20; R42
RC0402_25	RES_RC0402_25_DISCRETE_470-7539	0	DISCRETE	29	R7; R9; R10; R11; R12; R13; R14; R15; R16; R19; R21; R22; R23; R24; R25; R26; R27; R28; R29; R30; R31; R32; R33; R34; R35; R36; R37; R44; R45
RC0402_25	RES_RC0402_25_DISCRETE_470-7578	22	DISCRETE	1	R17
RC0402_25	RES_RC0402_25_DISCRETE_470-7563	33	DISCRETE	1	R38
RC0402_25	RES_RC0402_25_DISCRETE_0.45 MM_	0	DISCRETE	2	R39; R43
RC0402_25	RES_RC0402_25_DISCRETE_0.41MM_4	4.7K	DISCRETE	1	R41
RC0402_25	RES_RC0402_25_DISCRETE_0.35MM_4	4.7K	DISCRETE	3	R271; R272; R273
RC0402_25	RES_RC0402_25_DISCRETE_470-7555	1K	DISCRETE	1	R1138
RC0603_OV	RES_RC0603_OV_DISCRETE_470-7541	10K	DISCRETE	4	R1; R2; R3; R4
RC0603_OV	RES_RC0603_OV_DISCRETE_470-7539	2.2K	DISCRETE	1	R5
SOD-123	DIODE_SCHTKY_SOD-123_IC_1 MM_48	MBR130LSFT1G	IC	1	D45
SOD-923	DIODE_TVS_BIDIR_SOD-923_IC_0.4M	ESD9B3.3ST5G	IC	3	TVS1; TVS2; TVS3
TESTPOINT_35MIL	TEST PAD_TESTPOINT_35MIL_IC_0.1	35 MIL	IC	9	TP3; TP4; TP5; TP6; TP7; TP8; TP9; TP10; TP11
XTL4_14X8	OSC3_XTL4_14X8_IC_4.7MM_230-300	12.288MHZ	IC	1	Y1
XTLOSC4_5X7_5	SG8002_XTLOSC4_5X7_5_IC_1.8MM_2	33.333M	IC	1	X1

附件：
原理图和pcb文件如下：
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