[allegro16.2][2层] SAM9CN11-DM_RevA（QT1070+LR043JC211+CP2123ST-A1）pcb文件

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[allegro16.2][2层] SAM9CN11-DM_RevA（QT1070+LR043JC211+CP2123ST-A1）pcb文件
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! N% E: s4 t: q文件描述：
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+ j  M5 e. Z- m9 R  U1. 作品用途：SAM9CN11-DM_RevA
% M4 ~  c+ Q/ O& p& a/ I0 I2. 软件版本：allegro16.2
3. 层数：2层
4. 用到的主要芯片：QT1070+LR043JC211+CP2123ST-A1
* f5 u" V# @- M. `, b+ j5. pcb尺寸： 5309* 2749 MIL
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# H2 ]/ a2 q1 k& s! e8 ]1 u# ~作品截图如下：
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Bill of Material Report (Condensed)
SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS	QUANTITY	REFDES
名称	类型	属性	类别	数量	位号
4_8X4_8	L_SMT_4_8X4_8_22UH	22uH	IC	1	L1
C0603	C0603_C0603_100N	100n	IC	5	C11; C13; C20; C21; C22
C0603	C0603_C0603_DNP	DNP	IC	4	C16; C17; C18; C19
C1206	C1206_C1206_10U	10u	IC	3	C7; C10; C12
C1206	C1206_C1206_2.2U_10% X5R	2.2u	IC	2	C9; C15
CONN15X2_100_AUK_FVP75_2X15	TSW_2X15_DIP_RA_CONN15X2_100_AU	TSM-115-01-L-DV-A	IC	1	J2
CONN20X2_100_AUK_FVP75_2X20	BCS_2X20_DIP_RA_CONN20X2_100_AU	TSM-120-01-L-DV-A	IC	1	J3
FPC40	LR043JC211_0_FPC40_TF130-40RU-T	TF130-40RU-TAND	IC	1	J1
PAD	KEY_PAD_KEY	KEY	IC	4	K1; K2; K3; K4
QT1070_QFN20	QT1070_QT1070_QFN20_QT1070	QT1070	IC	1	MN6
QT1070_SOIC14	QT1070_SOIC_QT1070_SOIC14_QT107	QT1070_SOIC	IC	1	MN5
R0603	R0603_R0603_0R	0R	IC	34	R5; R6; R19; R22; R23; R43; R53; R54; R55; R56; R57; R58; R59; R60; R61; R62; R63; R76; R77; R78; R79; R80; R81; R82; R83; R84; R85; R86; R87; R88; R89; R90; R91; R92
R0603	R0603_R0603_DNP	DNP	IC	2	R24; R42
R0603	R0603_R0603_10K	10k	IC	2	R40; R75
R0603	R0603_R0603_7.5R	7.5R	IC	1	R41
R0603	R0603_R0603_4.7K	4.7K	IC	13	R44; R45; R64; R65; R66; R67; R68; R69; R70; R71; R72; R73; R74
SM_6_SOT23_70H	CP2122_0_SM_6_SOT23_70H_CP2123S	CP2123ST-A1	IC	1	MN1
SOD-123	SCH_SOD-123_RB160M-60	RB160M-60	IC	1	D1
SOIC8-200MIL	DS2433_SOIC8-200MIL_DS24B33S+	DS24B33S+	IC	1	MN2
SOT23-5	SPX3819_SOT23-5_SPX3819	SPX3819	IC	1	MN3

附件：
- d0 V5 o( r0 Z" k6 sPCB文件如下：

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