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作品名:[AD 9][2层] EC20 物联网模块板(ACT4070B+LPC812M101JDH20+EC20 R2.1)PCB源文件 & z5 X$ t7 T' M2 p
文件描述 1. 作品用途:EC20物联网模块板 2. 软件版本:AD 9 3. 层数:2层板 4. 用到的主要芯片:ACT4070B+LPC812M101JDH20+EC20 R2.1 5. PCB尺寸:115.5mm*44.5mm ; v: F9 d6 p4 y0 s! V
作品截图如下: 顶层截图: 6 O, K9 w$ _* b+ m
底层截图: 全层截图:
7 G" n& f- S6 ~叠层信息截图如下:
' A5 Q+ G( R: _, }# ?* o' v( KBOM: Comment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | 0.1uF | C1, C3, C7, C8, C19, C21 | C0603 | 6 | 10nF | C2, C5 | C0603 | 2 | 1uF | C4 | C0603 | 1 | 22uF | C6 | C0603 | 1 | 10uF | C9 | C0603 | 1 | 1nF | C10 | C0603 | 1 | 220pF | C11 | C0603 | 1 | 100uF/10V | C12, C14 | CC | 2 | 0.1uF(FR9886) | C13 | C0603 | 1 | 33pF | C15, C16, C17, C18, C20, C22 | C0603 | 6 | DCIN | CN1 | CON2_150MIL | 1 | UFLR | CN2 | UFLR-MINIPCI | 1 | SIMCard | CN3 | MicroSIMCard_6P | 1 | program | CN4 | SH79F1612A_PROGRAM_2.0*6 | 1 | AC_IN | CN5 | CON_300MIL_NC | 1 | UART | CN6 | CON4_100MIL | 1 | AC_OUT | CN7 | CON_300MIL_NC | 1 | SMA | CN8 | SMA - KEW | 1 | | CN9 | Simp3P_2.0 | 1 | ISP | CN12 | SIP2_2.0mm | 1 | PROGRAM | CN13 | ARM_Program_4 | 1 | 1N4007 | D1 | SMA | 1 | RS1B | D2 | SMA | 1 | SS34 | D4 | DO-214AB(SMC) | 1 | 470uF/50V | EC1 | RB.2/.4 | 1 | 1000uF/16V | EC2 | RB.15/.35 | 1 | LED | LED1, LED2, LED3, Login | LED0603 | 4 | WIFI | NET | LED0603 | 1 | 22uH_2A | PL1 | CDRH104 | 1 | WPM3401 | Q1 | SOT23_N | 1 | 5551 | Q2 | 80508550SOT23 | 1 | 8050 | Q3, Q4, Q5 | 80508550SOT23 | 3 | 100K | R1 | R0603 | 1 | 33K_1% | R2 | R0603 | 1 | 8.2K_1% | R3 | R0603 | 1 | 4.7K | R4, R5, R6, R11 | R0603 | 4 | NC/0R | R7 | R0603 | 1 | 100R | R8 | R0603 | 1 | 1K | R9, R10, R12, R13, R14, R19 | R0603 | 6 | 15K | R16, R21 | R0603 | 2 | 10K | R20, R22, R23 | R0603 | 3 | SRD-12VDC-SL-A | RL1 | SRD-05VDC-SL-A | 1 | ACT4070B | U1 | MP1591 | 1 | LPC812M101JDH20 | U2 | TSSOP20 | 1 | EC20 R2.1 | U3 | EC20_R2.1 | 1 | MFF2 | U4 | QFN5*6-8 | 1 | 4 |' V( ^5 O" T3 T* |4 y! A
附件: PCB源文件如下: , M3 f4 Y# n; E3 q
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