STC12C5A60S2+MAX3232ESE+M74HC373M1R+地质灾害检测仪+原理图+PCB文件作品文件分享。

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STC12C5A60S2+MAX3232ESE+M74HC373M1R+地质灾害检测仪+原理图+PCB文件作品文件分享。
用AD画的两层板，
# k. X8 \% U( w% M1 }' d地质灾害检测仪，
5 u, q, M) C5 J6 [/ u( j5 z板子很简单，
0 O3 u% z/ y5 a5 K8 s" `8 ~3 S布局布线很清晰，有需要的可以看看。

层数：2层
, Y( G& v1 _4 U& g: `7 r用途：控制板
& ~- p8 o! V3 V+ s7 Gpcb作品截图如下：
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附件：

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BOM：
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Comment	Designator	Quantity	Footprint
Cap Pol1	C1	1	CAPC2012L
Cap	C2, C3, C4, C16, C17, C18, C19, C20, C21, C22, C23	11	CAPC1608L_S
Cap Pol1	C5, C10	2	CAP_SMT_10*10*10mm
Cap	C6, C7, C9, C11, C13	5	CAPC2012L
Cap Pol1	C8	1	CAP_SMT_6.6x6.5x7.5
Cap Pol2	C12	1	CAP_DIP_10*16 220uF50V
Cap	C14, C15	2	CAPC2012L_S
Cap	C24, C25	2	CAPC1608L
LED0	D1, D2, D3, D8, D9, D10, D11, D12	8	LED_SMT_0805
Diode 1N4007	D4	1	DO-214AC(SMA)_SS12
12VLED	D5	1	LED_SMT_0805
D Schottky	D6, D7, D13	3	DO-214AB(SMC)_SS54
SP_3232	J1	1	DSUB1.385-2H9
232-JUMP	J2	1	HDR2X3
SIM	J3	1	SIM_SOCKET
Inductor	L1, L2	2	Inductance_SMT_10*10*3.5mm
SIM900	M1	1	SIM900_SOC
SIM700D	M2	1	SIM700D_SMD_FOOTPRINT
Power	P1	1	2EDG_3.84_2PIN_DIP_RM_SMALL
SYS_CONFIG	P2	1	HDR1X2
RAINFULLSEN	P3	1	2EDG_3.84_2PIN_DIP_RM_SMALL
DISTANCESEN	P4	1	2EDG_3.84_2PIN_DIP_RM_SMALL
OUT_LED	P5	1	2EDG_3.84_2PIN_DIP_RM_SMALL
POWER_SW	P6	1	SW_SMT
Camera	P7	1	2EDG_3.84_4PIN_DIP_RM_SMALL
Header 3X2	P8	1	HDR2X3
ZIGBEE_CONFIG	P9	1	HDR2X3
ANT	P10, P12	2	SMB_V-RJ45
SP3232PWR	P11	1	HDR1X2
Humidity	P13	1	2EDG_3.84_4PIN_DIP_RM_SMALL
IRF540S	Q1	1	D2PAK
NPN_9014	Q2, Q4, Q5	3	SOT-23_9014
IRLML2505	Q3, Q6	2	SOT95P230X82-3N
Res2	R1, R2, R3, R16, R17, R18, R19, R24, R25, R26, R27, R28, R29, R30, R31, R32	16	RESC1608L
Res2	R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R20, R21, R22, R23, R33	17	RESC2012L
12C5A60S2_LQFP48	U1	1	TSQFP50P900X900X160-48L
LM2596S-5.0	U2	1	TS5B_N
LM1117MP-3.3	U3	1	MP04A_N
LM2576S-ADJ	U4	1	TS5B_N
SZ05-ADV-Byname	U5	1	SZ05_DIP
Optoisolator1	U6, U7	2	Optoisolator_SOP4_350mil
MAX3232ESE	U8	1	NSO16_N
M74HC373M1R	U9	1	TSSOP65P640X120-20N
62-65c5128BL_SOP	U10	1	TSSOP50P2000X120-32N
XTAL	Y1	1	XTAL_DIP_2PIN

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fanichicl

楼主发帖辛苦了。