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Mechanical 1 (M1):Board outline (it is not recommended to use just the keep-out layer, since that can be used for other things also).建议作为板框层使用,不用做禁布层或其他用途) f: H- P" ?& L4 m, T. W
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Mechanical 2 (M2):PCB notes and comments for the PCB manufacturer/assembler (included in Gerber output).需要PCB生产或装配知悉的注释和要求,生成Gerber时输出此层 O( B; n5 G8 @' ]5 V7 ^
Mechanical 3 (M3):General notes and comments that the PCB manufacturer/assembler does not need to know about (not included in Gerber output).不需要PCB生产或装配知悉的注释和要求,生成Gerber时不输出此层; ]( b# y, F" d
+ V3 F8 N K k9 d; J3 G* eMechanical 11 (M11):Top layer dimensions (paired with M12).顶层尺寸标注8 i% P2 i; m+ {8 `, d7 t Y, H- _
Mechanical 12 (M12):Bottom layer dimensions (paired with M11).底层尺寸标注* c) H' e# p6 A3 ?% ~" v0 N
' y3 s' s8 L G; A" b3 _, P) z1 x9 UMechanical 13 (M13):Top layer component body information (3D models and mechanical outlines, paired with M14).顶层元器件实体尺寸信息(3D模型和机械边框,与M14层相对)
# I9 d7 M) J$ ?1 r7 DMechanical 14 (M14):Bottom layer component body information (3D models and mechanical outlines, paired with M13).底层元器件实体尺寸信息(3D模型和机械边框,与M13层相对)
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Mechanical 15 (M15):Top layer courtyard and assembly information (paired with M16). This normally includes a cross-hairs at the origin of the component.顶层元器件实体占位和装配信息(与M16相对),一般也包括圆心标注的十字准线
4 n6 d1 ~, E7 ?+ yMechanical 16 (M16):Bottom layer courtyard and assembly information (paired with M15). This normally includes a cross-hairs at the origin of the component.底层元器件实体占位和装配信息(与M15相对),一般也包括:原点标注的十字准线3 M2 K- y, H" o: Y1 A
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