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逻辑电平接口

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发表于 2017-11-13 16:15 | 只看该作者 回帖奖励 |正序浏览 |阅读模式

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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5
" S, T! k" r7 ?: [* F1.1 半导体三极管及其开关特性..................................................................................... 5
$ b8 u, b: ~& X# o1.2 MOS 管的开关特性......................................................................................................7( @5 r! P4 z8 \. j, [6 S, `
2、逻辑电平简介.................................................................................................................... 8
, B4 S, G) J+ H' a, d3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10/ h% g7 w+ g/ G
3.1:逻辑电平的一些概念............................................................................................... 10
2 h0 j! [2 T: l7 a2 s! j% t. r3.2:常用的逻辑电平....................................................................................................... 11/ L8 }- _5 L- v; D
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11  o# t3 j& ~& {. M+ W5 M8 y) l" Q: N
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
' _+ S3 `# _% i4 V+ a4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13- X  `9 F' `$ r' o) X
4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................135 _, E& j- w9 r9 Y) C
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
" N# F. A% \3 L- ~+ A4.4:包含特殊功能的逻辑器件....................................................................................... 149 Q  Z) z' i( e$ c; A- X- f
4.5:逻辑器件的使用指南............................................................................................... 15
8 B6 @! _( \8 v; J1 W5、TTL、CMOS 器件的互连.................................................................................................. 16; I) K5 z+ \# q5 e6 y4 b" G( n
5.1:器件的互连总则.......................................................................................................16* G# _0 f3 o4 W- ^4 d. C8 d6 Z
5.2:5V TTL 门作驱动源..................................................................................................195 o- D9 W# t8 W7 q. X
5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19
2 o( ^- ]* o* l! N5.4:5V CMOS 门作驱动源................................................................................................ 19
# ~/ Y% C3 }! {5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
. I7 T# L  m1 h, b6、ECL 器件的原理和特点................................................................................................... 20; m. q( G  ^! ~5 P1 q6 d' W5 |
6.1:ECL 器件的原理........................................................................................................20
" L7 D# W: ~) X/ k' i6.2:ECL 电路的特性........................................................................................................21
* A: q8 w6 `% W8 g. v* @9 B6.3:ECL 器件的使用原则................................................................................................ 22! H+ c6 O$ u, p* }  v4 P
7、GTL 器件的原理和特点................................................................................................... 23
- V$ O! J4 @+ d, P( E- d7.1:GTL 器件的特点和电平............................................................................................ 233 q* t7 i# h# u4 N0 @. `7 V3 Y* B' P% I
7.2:GTL 信号的PCB 设计................................................................................................ 24! f. o! d. N7 E3 {$ {
7.3:GTL 信号的测试........................................................................................................25# f! G4 t1 D; u7 a, ?! }, R$ t
7.4:GTL 信号的时序........................................................................................................25
1 u6 H7 H8 D, i1 X; p' D8 HSTL 电平......................................................................................................................... 25
8 S$ Z/ C5 Q( p3 E; `. P8.1 基本定义..................................................................................................................... 25: G" F$ R# |* O/ u
1.2 HSTL 分类.................................................................................................................... 26
0 _( Q+ t4 U* L7 a* [% l8.3 HSTL 特点及SSTL .....................................................................................................26
8 R+ N) a# P# w# B, i  @9 PECL、LVPECL 电平........................................................................................................... 275 S- x; `. ]' w
9.1:PECL/LVPECL 器件的原理和特点............................................................................27# Q* `5 r7 H; b
9.2. PECL/LVPECL 电平输出结构................................................................................... 27
6 L: A: Z% |4 J7 y3 o% t9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
* u- r- \# G5 }( i10 CML 电平......................................................................................................................... 30, I; P5 r1 `) ]9 P$ S8 M/ E1 Z
10.1. CML 接口输出结构............................................................................................... 30
* k; X* n9 g1 g' Z- w10.2 CML 接口输入结构...................................................................................................30
8 W3 o+ `: s0 \* l10.3 CML 电平的输出门和输入门的特点: ....................................................................31
2 b! J& ^; H6 ~9 M+ k8 B- n11. LVDS 器件的原理和特点.......................................................................................... 326 }& J' h5 H% [$ [5 E" X- I9 [
11.1:LVDS 器件简介........................................................................................................32/ _) G9 [: s# M; y
11.2 LVDS 器件的工作原理.............................................................................................. 33; i, ]8 R- V" K
11.3 LVDS 输入输出结构.................................................................................................33' K5 u# s; z3 A) r3 t1 I0 R7 a+ B' L
11.4 LVDS 电平的特点...................................................................................................355 j1 N) R/ `/ w% X9 v
12. CML LVPECL LVDS 简单比较及互连......................................................................... 35: i- X6 A3 Q. y
12.1 CML LVPECL LVDS 简单比较..............................................................................35, a8 e* d2 K: }5 y9 K+ b
12.2 CML LVPECL LVDS 的互连综述..........................................................................380 k: k1 Y' L2 f5 x
12.3 LVPECL 的互连........................................................................................................39' S% e$ e5 G* M  \* k! o
12.4 LVDS 的互连............................................................................................................44
: _7 d0 r' t& d( D12.5 CML 的互连..............................................................................................................45
5 u( |* s. {4 x/ Z3 p& ]) M. B附录:.................................................................................................................................... 47
1 e) t% a6 q, z% }附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47( q) u1 A+ X+ }4 b# j9 `/ M, @* W
附录2. CMOS 门电路及其特点.................................................................................... 59, ^4 v( o/ I7 @) D8 ^) e( B
" U* n6 y( s4 q6 U

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