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PCB Stackup and Layer Order中:
! l. E2 a' ~& w, }Power supplies with high transient current should have their associated VCC planes close to the
' ~/ Z( i' f* U1 C! S- [top suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction
( I+ T7 h- o1 y1 a( _that currents travel through VCC and GND vias before reaching the associated VCC and GND
; j0 m3 p9 L& ^/ _planes. As mentioned in the previous section, every VCC plane should have a GND plane* _& T( S' X* H8 d
adjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents6 A4 b0 X/ `' l+ p, K. s' J
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the8 k4 z, H3 b$ N. D( ^; e
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC$ R, \" L. w" a& q$ e2 ?4 q
and GND planes are considered as a pair.
+ `+ J0 P+ b) `8 y' O這裡面,說的VCC,GND層到底所何放置?: B/ q3 C6 [) j% A3 P$ S, u
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发表于 2007-12-28 17:23
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