CC2560蓝牙模块板SN74AVC4T774RSV+LP2985-18DBV+PCB设计作品文件

ygcgsa · 发表于 2019-9-4 17:55

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CC2560蓝牙模块板SN74AVC4T774RSV+LP2985-18DBV+PCB设计作品文件

层数：4层
用途：蓝牙模块
作品截图：

附件：

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BOM：

SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS
201	CAP_NP_0201_22PF_0201_SMALL	22pF	IC
402	CAP_NP_0402_0.1UF_0402_SMALL	0.1uF	IC
402	CAP_NP_0402_1.0UF_0402_SMALL	1.0uF	IC
402	CAP_NP_0402_0.01UF_0402_SMALL	0.01uF	IC
402	CAP_NP_0402_10PF_0402_SMALL	10pF	IC
402	CAP_NP_0402_0.47UF_0402_SMALL	0.47uF	IC
402	RESISTOR_0402_0	0	IC
402	RESISTOR_0402_680_0402_SMALL	680	IC
402	RESISTOR_0402_10K_0402_SMALL	10K	IC
402	RESISTOR_0402_0_0402_SMALL	0	IC
402	RESISTOR_0402_100K_0402_SMALL	100K	IC
402	RESISTOR_0402_10.0K_0402_SMALL	10.0K	IC
603	CAP_NP_0603_10UF	10uF	IC
805	RESISTOR_0805_0.10	0.1	IC
ANT_IIFA_CC2420_32MIL_MIR	ANT_IIFA_CC2420_32MIL_MIR_ANT_I	N/A	IC
CON_COAXIAL_UFL-R-SMT	CON_COAXIAL_UFL-R-SMT_CON_COAXI	COAXIAL	IC
CON_EDGE_50_P635MM	CON_EDGE_2X50_25_MEC6_CON_EDGE_	EDGE CARD	IC
CON_SMVT_2X10_50_F_SFM_FLIP_CC	CON_2X10_FLIP_CC_CON_SMVT_2X10_	2x10 SMVT	IC
FB_0402	FERRITE_BEAD_FB_0402_BK1005HS68	BK1005HS680-T	IC
FIL_4_85X53X41	FILTER_4PIN_GND_FIL_4_85X53X41_	2.45GHz	IC
HDR_THVT_1X2_100_M	HEADER_1X2_HDR_THVT_1X2_100_M_1	1x2 THVT	IC
HDR_THVT_2X9_100_M	HEADER_2X9_100_430L_HDR_THVT_2X	2x9	IC
LABEL_THT-14	LABEL_BOARD_LABEL_THT-14_LINE 1	Line 1 Line 2	IC
LED_0603	LED_2P_LED_0603_GRN	GRN	IC
OSC_4_SM_134X67X40	OSC_4_SM_3-OUT_OSC_4_SM_134X67X	32.768KHz 15pF	IC
PQFP_RSV16	SN74AVC4T774_RSV16_PQFP_RSV16_S	SN74AVC4T774RSV	IC
PVQFN_RVM_EP134X122	BL6450Q_RVM_PVQFN_RVM_EP134X122	CC2560RVM	IC
SH_BMI-S-202_650X650	RF_SHIELD_8P_SH_BMI-S-202_650X6	xx	IC
SOT23_DBV5	TPS731XX_DBV5_SOT23_DBV5_LP2985	LP2985-18DBV	IC
TP_THVT_060_RND	TESTPOINT_TP_THVT_060_RND_BLK	Blk	IC
TP_VIA_030RND020	TESTPOINT_TP_VIA_030RND020_XX	XX	IC
XTAL_4_SM_83X67X20	XTAL_4P_GND_XTAL_4_SM_83X67X20_	26MHz	IC