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［书籍］Digital Techniques for High-Speed Design
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目录/ z: g' f' m$ q3 ]4 w
( [3 c/ S7 N( W3 NI. INTRODUCTION.
4 G$ @; c/ b, d6 s- j; J( S1. Trends in High-Speed Design.
4 U0 P6 L/ a5 S1 t$ S, u* o2. ASICs, Backplane Configurations, and SerDes Technology. 6 n1 R+ I4 g6 k5 o7 U4 P% l
3. A Few Basics on Signal Integrity.
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II. SIGNALING TECHNOLOGIES AND DEVICES.
# e# Z- f2 w, {2 O2 L$ E9 f4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
1 k) b0 @& f0 u5. Low Voltage Differential Signaling (LVDS). ) P0 u+ t. k* Y7 N6 }/ Z# `1 w+ b
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS). ; K4 V3 L/ B$ J" d" r+ D* p
7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL). ; ^7 V. Z6 ]1 p: `) f( ?+ l
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
3 b9 S" A9 r% D, v4 j7 L% ?9. Current-Mode Logic (CML). 5 m4 |* l9 O$ K
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. / G8 f* n9 o/ `& u1 |
11. Fiber-Optic Components. f6 u0 f0 C- D1 c" A: \# K
12. High-Speed Interconnects and Cabling. 8 v2 w4 E. o7 d B: l$ A
4 v8 l0 j- w, W0 D9 _III. HIGH-SPEED MEMORY AND MEMORY INTERFACES. . ?, B9 @0 ^; D$ z* |
13. Memory Device Overview and Memory Signaling Technologies.
/ l0 x$ O- `# T( e14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. O3 E' }4 I8 y* Y
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM. ' R& U3 \4 P( G9 |" K q, B: N
16. Quad Data Rate (QDR, QDRII) SRAM. ) S, i0 w5 f6 u0 g# E
17. Direct Rambus DRAM (DRDRAM).
& B# \0 j( f- s% s- r f+ r; x18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
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IV. MODELING, SIMULATION, AND EDA TOOLS.
$ [0 C0 o2 e% _3 D" [: y- A: P) ?19. Differential and Mixed-Mode S?Parameters.
4 x2 Q6 j2 m7 U9 p20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. 6 m& y/ a4 E. |* _# ]
21. Modeling with IBIS.
! }' S D0 l5 g4 L: K8 L' x6 ~22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
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) @! T' W) D* Q: z6 y- d7 OV. DESIGN conceptS AND EXAMPLES. 8 `* g/ g1 q" e/ p
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.
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Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. ' i+ f$ K% j4 n% g. \. q+ N6 R$ w
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
: L6 w! t' h9 h/ F0 V/ ]4 `3 V25. Designing with LVDS.
6 l$ e) Q: [( A5 M/ T26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
# C' T& l9 V$ c, u9 u7 y% i27. WarpLink SerDes System Design Example. - N6 P+ T6 b% z
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VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
' A$ U t3 y( U6 k28. Electrical Optical Circuit Board (EOCB). 8 c+ ?# {% E& L8 V
29. RapidIO.
. h5 [+ [+ ~/ ]% h; ~30. PCI Express and ExpressCard.
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VII. LAB AND TEST INSTRUMENTATION.
' c" a5 K2 A3 i+ |* T. W4 c31. Electrical and Optical Test Equipment. & L9 Z: \. c2 I. V
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[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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