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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 51 b F$ A+ n0 t4 x$ N* @
1.1 半导体三极管及其开关特性..................................................................................... 5
. {& _6 J' |8 ?) x7 o; Z( S1.2 MOS 管的开关特性......................................................................................................77 F% X- Q! J3 f, E- B+ g' \4 G8 i
2、逻辑电平简介.................................................................................................................... 8
n4 }& F" a9 ~; V3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10" x; K/ z! z+ k$ g% _, e
3.1:逻辑电平的一些概念............................................................................................... 10
+ c7 [$ f5 J+ t/ s6 h( N0 j3.2:常用的逻辑电平....................................................................................................... 111 |) \ C( I& @0 h' U- {* g
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 116 _) i( c5 N6 M+ ~
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
! y. P* a! n/ R9 i N1 d4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
7 p5 d# X0 H0 ~/ W4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13) I2 I5 C/ R$ T0 R5 g: w
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
) O$ s* n9 C# |4.4:包含特殊功能的逻辑器件....................................................................................... 14
! V7 y/ ~' k1 G1 Z% [4.5:逻辑器件的使用指南............................................................................................... 15- P8 b9 A5 B4 c
5、TTL、CMOS 器件的互连.................................................................................................. 166 ]" C; ?$ T7 e5 f
5.1:器件的互连总则.......................................................................................................163 s: P+ h# K( M$ e0 s0 a/ V
5.2:5V TTL 门作驱动源..................................................................................................19
( n- @6 ?/ k' Y5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19/ v0 i( u) D' {6 q2 R
5.4:5V CMOS 门作驱动源................................................................................................ 19
, n5 t8 Z' B6 ^4 |2 [& R4 V5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
1 W$ M! a. z/ r" K9 |& f# p6、ECL 器件的原理和特点................................................................................................... 20
9 ^* N( P0 \, `5 x4 C5 H5 ~6.1:ECL 器件的原理........................................................................................................20
. C5 h7 ]4 B' m7 }6.2:ECL 电路的特性........................................................................................................21
4 K1 b- U# T" o& |2 y1 G' Q6 T6.3:ECL 器件的使用原则................................................................................................ 22
* f% i8 b$ g% ^7、GTL 器件的原理和特点................................................................................................... 23* V- U$ J2 E [$ _# u0 T
7.1:GTL 器件的特点和电平............................................................................................ 23
7 Q! ~5 ^. ]# F& I0 s$ x7.2:GTL 信号的PCB 设计................................................................................................ 24
! `1 B8 E" k* h) t) P0 `7.3:GTL 信号的测试........................................................................................................25' b! h9 x1 x. h0 h ^* t
7.4:GTL 信号的时序........................................................................................................25! b. n/ p, C. H& j
8 HSTL 电平......................................................................................................................... 259 [, W4 r4 _' ^& e G% P: A
8.1 基本定义..................................................................................................................... 25
; c# X, V1 ]1 v+ k! D4 J6 a1.2 HSTL 分类.................................................................................................................... 26
1 Q M x; V5 Y! b' ~6 M8.3 HSTL 特点及SSTL .....................................................................................................263 U7 x3 E$ v1 P+ t2 K
9 PECL、LVPECL 电平........................................................................................................... 27" l2 q" Z. \1 x6 f; o! P3 R
9.1:PECL/LVPECL 器件的原理和特点............................................................................27
, U: b) G" u# L9 p9.2. PECL/LVPECL 电平输出结构................................................................................... 27
3 _: d1 q' d0 A) X9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
, I; G$ R, o2 S z) G7 s7 p10 CML 电平......................................................................................................................... 30' ^. J: L% a* w/ w
10.1. CML 接口输出结构............................................................................................... 300 L% k& j. k7 n. B
10.2 CML 接口输入结构...................................................................................................309 Z1 \' }1 W4 N1 n* _8 Y! t
10.3 CML 电平的输出门和输入门的特点: ....................................................................31 n6 i2 z/ u6 A) w' _
11. LVDS 器件的原理和特点.......................................................................................... 32, l0 i. A* c8 s8 C; Y5 @2 Y* l
11.1:LVDS 器件简介........................................................................................................32
- D: t( m8 u) T8 d1 ^! d/ s8 M11.2 LVDS 器件的工作原理.............................................................................................. 33; ?" A: H1 M2 _; a/ z6 n* E
11.3 LVDS 输入输出结构.................................................................................................337 c U; b9 \$ ?/ p! ]$ O* a
11.4 LVDS 电平的特点...................................................................................................35
! S4 ]2 d/ g+ _. k3 }; @12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
g% z4 _0 T! y+ q7 r12.1 CML LVPECL LVDS 简单比较..............................................................................35
7 Q; T% k* r$ O* Z ?12.2 CML LVPECL LVDS 的互连综述..........................................................................38" n& `- f+ \ E. C" ]
12.3 LVPECL 的互连........................................................................................................39
& _( e% i' x& t. r$ l12.4 LVDS 的互连............................................................................................................44
) A3 f* u( c2 N& H; W12.5 CML 的互连..............................................................................................................45
2 K) t) ]) \3 n1 }附录:.................................................................................................................................... 479 o# l1 L! R D1 x* o! @' V
附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47/ g! e1 ~$ ^7 @
附录2. CMOS 门电路及其特点.................................................................................... 59
8 q: Y% S3 R9 s* l& c! j9 J5 Z! ?( J% x! S
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