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标题: [allegro17.2][2层]HVP-MC3PH高压开发平台HVP-MC5682748-PWB(CP2102+ADuM6201+PC5... [打印本页]

作者: Bright_SM    时间: 2020-1-9 13:43
标题: [allegro17.2][2层]HVP-MC3PH高压开发平台HVP-MC5682748-PWB(CP2102+ADuM6201+PC5...
[allegro17.2][2层]HVP-MC3PH高压开发平台HVP-MC5682748-PWB(CP2102+ADuM6201+PC56F82748VLH+NCP1117ST33T3G)原理图和pcb文件
文件描述:
1. 作品用途:]HVP-MC3PH高压开发平台HVP-MC5682748-PWB
2. 软件版本:allegro17.2
3. 层数:2层
4. 用到的主要芯片:CP2102+ADuM6201+PC56F82748VLH+NCP1117ST33T3G
5. PCB尺寸:异形
作品截图如下:
顶层截图:
底层截图:
全层截图:
BOM:
Bill of Material Report (Condensed)
SYM_NAMECOMP_DEVICE_TYPECOMP_VALUECOMP_CLASSQUANTITYREFDES
名称类型属性类别数量位号
CC0603_OVCAP_NP_CC0603_OV_DISCRETE_0.9652200PFDISCRETE11C1; C2; C4; C6; C7; C8; C9; C10; C12; C13; C14
CC0603_OVCAP_NP_CC0603_OV_DISCRETE_0.9MM330pFDISCRETE3C3; C5; C11
CC0603_OVCAP_NP_CC0603_OV_DISCRETE_0.9_10.10UFDISCRETE7C16; C18; C20; C21; C24; C28; C29
CC0603_OVCAP_NP_CC0603_OV_DISCRETE_1.25M2.2UFDISCRETE5C17; C19; C22; C23; C27
CC0603_OVCAP_NP_CC0603_OV_DISCRETE_1.01610uFDISCRETE2C32; C33
CC0805_OVCAP_NP_CC0805_OV_1.45MM_150-7511.0uFIC2C25; C26
CC0805_OVCAP_NP_CC0805_OV_DISCRETE_1.45M22UFDISCRETE2C30; C31
CC2211CAP_NP_CC2211_DISCRETE_1.5MM_TM1000pFDISCRETE2C37; C38
CON5_USB_RA_SMTUSB_MINI_AB_RECEPTACLE_CON5_USBCONN USB MINI-BIO1J2
CONN_2X32_FINGERSCONN_PCIEXP_64P_CUST_CONN_2X32_PCI express x4 edge connectorIO1J3
HSMX-C170LED_HSMX-C170_IC_0.9 MM_370-300HSMG-C170IC2D4; D5
IND_0805BEAD_IND_0805_DISCRETE_1.05 MM_330 OHMDISCRETE2L1; L2
JUMP2X7-6040HDR-2X7_JUMP2X7-6040_IO_8.38 MMHDR_2X7IO1J1
LED_2P_0805LED_LED_2P_0805_IC_0.9MM_370-76REDIC1D1
LQFP64PC56F82748MLH_LQFP64_IC_1.6MM_3PC56F82748VLHIC1U1
RC0603_OVRES_RC0603_OV_DISCRETE_470-7542100DISCRETE14R1; R2; R3; R4; R5; R6; R7; R8; R9; R10; R11; R12; R13; R14
RC0603_OVRES_RC0603_OV_DISCRETE_470-75912.7KDISCRETE1R16
RC0603_OVRES_RC0603_OV_DISCRETE_470-7551330DISCRETE3R17; R38; R39
RC0603_OVRES_RC0603_OV_DISCRETE_470-75400DISCRETE3R20; R21; R23
RC0603_OVRES_RC0603_OV_DISCRETE_470-75414.7KDISCRETE11R27; R28; R29; R30; R31; R32; R33; R34; R35; R36; R37
SHORTBAR_1206SHORTBAR1206_SHORTBAR_1206_IC_0ShortingBar1206IC1BAR1
SOD-123DIODE_SCHTKY_SOD-123_IC_1MM_480MBR120VLSFT1GIC2D2; D3
SOIC16_1P27_7P6X10P5SI8661BD-B-IS_16P_SOIC16_1P27_7Si8661ED-B-ISIC1U2
SOIC16_1P27_7P6X10P5ADUM6201_16P_SOIC16_1P27_7P6X10ADuM6201IC1U3
SOT223LD1117AS18_SOT223_IC_1.8MM_312-NCP1117ST33T3GIC1U4
TESTPOINT_060_039MILT POINT TH_TESTPOINT_060_039MILTEST_POINTIC15TP2; TP3; TP4; TP5; TP6; TP7; TP9; TP10; TP11; TP12; TP13; TP14; TP18; TP19; TP20
TPAD_030TESTLOOP_TPAD_030_IO_0.1MM_211-TPAD_030IO1TP8
附件:
原理图和pcb文件

. B2 J- Z4 v1 O; G
作者: 觅路人    时间: 2023-11-12 23:51
谢谢分享
作者: wschau    时间: 2024-6-4 14:47
testtestsetsetstes
作者: wschau    时间: 2024-6-4 14:49
NO 17.2 is 16.6 version5 x* [* }9 l, r





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