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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5# ^2 ^# [& Y6 q/ _" t
1.1 半导体三极管及其开关特性..................................................................................... 56 z. C. k' X% P- ]0 X
1.2 MOS 管的开关特性......................................................................................................7
) }& E5 I, Y; O6 z# ]2、逻辑电平简介.................................................................................................................... 8" [3 k. C1 N/ j7 R: Q9 D
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
6 z- E. B# p0 z0 C; [- S. Q3.1:逻辑电平的一些概念............................................................................................... 10& {3 d0 e9 K& i7 d
3.2:常用的逻辑电平....................................................................................................... 11* D' ?; d/ X: i3 x+ q, A: s
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 119 B; P2 j3 f/ _! U k7 l1 s5 g
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
7 \- D7 l8 Y0 }" k1 b# ~4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
2 C: D& g2 l4 J# I4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................130 j0 u. s+ c/ W0 { l! d
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13) V9 _% R4 d) }) I2 M/ a, T/ x
4.4:包含特殊功能的逻辑器件....................................................................................... 14' D& q& l1 i( |5 @ N3 I
4.5:逻辑器件的使用指南............................................................................................... 15( b' N" R& w4 b, g# R
5、TTL、CMOS 器件的互连.................................................................................................. 16
- Z3 \/ z: c+ M4 M4 w" u, C5.1:器件的互连总则.......................................................................................................16! ]% M$ R+ M8 V
5.2:5V TTL 门作驱动源..................................................................................................19
% R. w5 p! r- R- b5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 196 W9 V* ]9 N {5 e" f$ n2 D4 {
5.4:5V CMOS 门作驱动源................................................................................................ 19
J& ?" K r3 l2 p* f- [0 Y5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
' h& ]* ], p# H# r7 h5 ~6、ECL 器件的原理和特点................................................................................................... 20# J& h3 t6 O1 e5 M5 H+ H& Q
6.1:ECL 器件的原理........................................................................................................205 G$ l) P$ C4 W& p
6.2:ECL 电路的特性........................................................................................................21
' x. s( f1 }: Q) t" n# B6.3:ECL 器件的使用原则................................................................................................ 22* D6 C" Z( M- [3 d% B
7、GTL 器件的原理和特点................................................................................................... 23
; d0 j1 D/ i8 m8 s }, M7.1:GTL 器件的特点和电平............................................................................................ 23
' o8 n+ P3 J0 W0 N5 E! X. T: N7.2:GTL 信号的PCB 设计................................................................................................ 24
- j% ~' H, B E8 p, L7.3:GTL 信号的测试........................................................................................................25
: ?" x( i; W( H' Y9 \* p: P }( R# |7.4:GTL 信号的时序........................................................................................................25
" o. z9 N3 t/ J$ \0 d6 g8 HSTL 电平......................................................................................................................... 25
9 {; W' m9 `- `% T& h" ]/ B8.1 基本定义..................................................................................................................... 25
! p- |7 V+ h1 F9 L: i: V) b$ P; ^1.2 HSTL 分类.................................................................................................................... 26
: @- P7 d8 b E. y, U* J8.3 HSTL 特点及SSTL .....................................................................................................26
4 V5 F. A5 B+ N' v9 PECL、LVPECL 电平........................................................................................................... 27
9 ~7 H2 N- h. I* ]; @; B; A4 p9.1:PECL/LVPECL 器件的原理和特点............................................................................278 z4 K2 h8 u% J/ C
9.2. PECL/LVPECL 电平输出结构................................................................................... 27/ n! M- P4 i/ \0 W
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29: H7 Y! h& U9 e
10 CML 电平......................................................................................................................... 30
3 ?1 l4 K2 n3 n5 g2 M10.1. CML 接口输出结构............................................................................................... 30
# ?0 b. e2 b* D/ i5 P10.2 CML 接口输入结构...................................................................................................30
% r' j% p3 e+ e% U. W6 M' t0 O( L10.3 CML 电平的输出门和输入门的特点: ....................................................................31
. X% {" M" Z- z5 A8 B' h) K11. LVDS 器件的原理和特点.......................................................................................... 32
2 h2 v- f5 `2 K( `3 S$ w11.1:LVDS 器件简介........................................................................................................32
9 {6 U# a# s. m b. Y$ z/ E11.2 LVDS 器件的工作原理.............................................................................................. 33
i$ P- o1 H% {) E+ S11.3 LVDS 输入输出结构.................................................................................................33
+ Z I- H. P7 ^0 r& [ A+ q11.4 LVDS 电平的特点...................................................................................................35
, A# y/ M! J+ [3 @' p+ f12. CML LVPECL LVDS 简单比较及互连......................................................................... 357 _2 z8 i! u G( C/ O- I; A& ~. k
12.1 CML LVPECL LVDS 简单比较..............................................................................35
g% [# I; P7 _' T8 Z, b+ v12.2 CML LVPECL LVDS 的互连综述..........................................................................38$ A: [5 ?* q) u. i- A
12.3 LVPECL 的互连........................................................................................................39
5 q2 Q E, q' D+ F& Z! {12.4 LVDS 的互连............................................................................................................44
3 b( R( \4 p0 x; Q7 Y+ S7 L+ e12.5 CML 的互连..............................................................................................................45
5 a; P% q2 Y& J0 L* q附录:.................................................................................................................................... 47
}: G2 u U9 h; y$ `附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 478 p$ y5 @5 Y3 I/ \. a1 r
附录2. CMOS 门电路及其特点.................................................................................... 59
?3 q2 h/ J$ a! [. d" R" ?2 t& j j0 J) l" s1 `. u. p9 T' x
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